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STM8AL31E8ATAX

STMicroelectronics

STM8AL31E8ATAX by STMicroelectronics

STM8AL31E8ATAX from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 16 MHz. It features ADC and PWM channels, making it ideal for embedded applications. Its compact flatpack design ensures efficient space utilization in devices.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,253 parts In-Stock

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Digiode

USA . 2,048 parts In-Stock

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Anansix

USA . 1,853 parts In-Stock

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1,853

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Distributors (Availability)

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AZTECH Wire

Italy . 765 parts In-Stock

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$13.900

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-

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765

$13.900

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Microchip USA

USA . 1,972 parts In-Stock

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$22.189

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$22.189

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IDEA Electronic Components Group

UK . 2,169 parts In-Stock

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$66.190

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$59.571

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2,169

$66.190

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$59.571

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MKK Technologies

India . 1,754 parts In-Stock

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$124.467

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1,754

$124.467

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DigiPath Technology Company

USA . 1,754 parts In-Stock

1+ parts

$124.467

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1,754

$124.467

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Vigor

Singapore . 7,485 parts In-Stock

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Corphita

USA . 3,042 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 469 parts In-Stock

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$79.141

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469

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$79.141

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Overview

Unlock your project’s potential with the STM8AL31E8ATAX microcontroller from STMicroelectronics! Renowned for their quality and innovation, STMicroelectronics delivers this versatile, low-power solution ideal for a myriad of applications, from consumer electronics to industrial automation. With advanced features like multiple ADC and PWM channels, it ensures seamless performance while simplifying design complexities. Elevate your designs and experience reliability, efficiency, and exceptional value that stands the test of time!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs and efficient use of PCB space, making it ideal for modern electronic applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V provides flexibility for battery-operated devices, allowing for longer operational life.

Package Shape: SQUARE

The square package shape enhances layout symmetry on the PCB, facilitating better routing and placement of components.

Bit Size: 8

An 8-bit architecture is suitable for simpler applications that require basic processing, making it easier and more cost-effective.

No. of Terminals: 80

With 80 terminals, this microcontroller offers extensive connectivity options for various peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack package style is ideal for applications where space is limited and provides ease of handling and soldering.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V supports a broader range of power sources, enabling its use in low-power applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and reduces the risk of oxidation, which improves long-term reliability.

ADC Channels: YES

Built-in ADC channels allow for direct analog signal processing, making it suitable for applications requiring sensor data conversion.

DMA Channels: YES

The inclusion of DMA channels enables efficient data transfer without CPU intervention, leading to improved system performance.

Terminal Position: QUAD

Quad terminal position offers better thermal and electrical performance, contributing to the stability of the microcontroller.

Width: 12 mm

A width of 12 mm allows for easy integration into various devices while maintaining a compact footprint.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides adequate speed for basic tasks and responsive control, enhancing system performance.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of up to 260 °C ensures compatibility with standard soldering processes.

Length: 12 mm

A length of 12 mm complements the width for a square design, optimizing space in compact electronic applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it offers a versatile platform for control applications, making it suitable for a wide range of projects.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity, making it reliable in various environments.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, which is especially important for automated manufacturing processes.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V optimizes power efficiency, making it ideal for battery-operated applications.

PWM Channels: YES

The presence of PWM channels provides precise control over analog devices such as motors and LEDs, enhancing functionality.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for greater density in PCB designs while ensuring reliable connections and ease of soldering.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, requiring some precautions during storage and handling but still suitable for many applications.

Speed: 16 rpm

The operational speed of 16 rpm suggests suitability for various control applications, especially in automotive or robotics fields.

No. of I/O Lines: 68

With 68 I/O lines, this microcontroller offers extensive interfacing capabilities, supporting complex designs and diverse applications.

Technical Specifications

Microcontrollers STM8AL31E8ATAX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Terminals:

80

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

STM8AL31E8ATAX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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