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STM8AL31E89TCY

STMicroelectronics

STM8AL31E89TCY by STMicroelectronics

STM8AL31E89TCY microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 1.8V and 3.6V, and includes ADC and PWM channels. Its compact 10x10 mm flatpack design with 64 terminals makes it ideal for space-constrained applications. This versatile CMOS device is perfect for embedded systems requiring efficient processing and control.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,414 parts In-Stock

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3,414

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Digiode

USA . 3,254 parts In-Stock

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3,254

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Anansix

USA . 527 parts In-Stock

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527

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Distributors (Availability)

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Vigor

Singapore . 6,211 parts In-Stock

1+ parts

$2.120

100+ parts

-

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6,211

$2.120

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AZTECH Wire

Italy . 779 parts In-Stock

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$12.290

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779

$12.290

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Microchip USA

USA . 2,677 parts In-Stock

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$20.351

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2,677

$20.351

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IDEA Electronic Components Group

UK . 1,475 parts In-Stock

1+ parts

$39.623

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$35.661

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1,475

$39.623

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$35.661

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Component Stockers USA

USA . 2,389 parts In-Stock

1+ parts

$40.060

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2,389

$40.060

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MKK Technologies

India . 353 parts In-Stock

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$74.509

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353

$74.509

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DigiPath Technology Company

USA . 353 parts In-Stock

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$74.509

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353

$74.509

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Parana Technologies

USA . 1,019 parts In-Stock

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$47.376

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1,019

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$47.376

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Corphita

USA . 603 parts In-Stock

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603

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Overview

Unlock the potential of your next project with the STM8AL31E89TCY microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for versatility and efficiency, this compact powerhouse is perfect for applications ranging from automation to consumer electronics. With its robust performance, low power consumption, and rich feature set, you’ll enjoy exceptional reliability and seamless integration—empowering you to bring your ideas to life with ease!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact installations in space-constrained applications, making it ideal for modern electronics.

Maximum Supply Voltage: 3.6 V

This higher maximum supply voltage enhances versatility in various applications, providing headroom for operational stability.

Package Shape: SQUARE

The square package shape aids in efficient PCB layout and design, facilitating better thermal management and electrical performance.

Bit Size: 8

An 8-bit microcontroller offers simplicity and is suitable for basic control tasks, making it cost-effective for various applications.

No. of Terminals: 64

With 64 terminals, this microcontroller can support a large number of peripheral connections, enhancing functionality and expandability.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design reduces height on the PCB, ideal for slim devices while maintaining a fine pitch for dense terminal arrangements.

Minimum Supply Voltage: 1.8 V

The minimum supply voltage of 1.8 V allows for low-power operations, making it suitable for battery-powered applications.

ADC Channels: YES

Integrated ADC channels provide the capability to convert analog signals to digital, allowing for sensor interfacing in diverse applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory, improving performance and freeing CPU cycles.

Terminal Position: QUAD

Quad terminal positioning ensures easy access to connections and simplifies routing on the printed circuit board.

Width: 10 mm

A 10 mm width allows for compatibility with standard PCB sizes while being compact enough for small device designs.

Maximum Clock Frequency: 16 MHz

The 16 MHz max clock frequency provides sufficient processing speed for real-time applications, balancing performance and power consumption.

Length: 10 mm

The 10 mm length complements the square shape, making it suitable for applications with spatial constraints.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates processing capabilities with peripherals, offering a comprehensive solution for embedded applications.

Technology: CMOS

CMOS technology enhances power efficiency and offers high density, which is ideal for low-power applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics for reliable electrical connections, suitable for automated assembly.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V indicates stable performance, ideal for powering various electronic components with predictable operation.

PWM Channels: YES

Presence of PWM channels allows for motor control and dimming applications, making it versatile for different control tasks.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a high density of connections on the PCB, maximizing functionality in limited space.

Speed: 16 rpm

The operational speed of 16 rpm indicates capability in slow-moving applications, suitable for precision control systems.

No. of I/O Lines: 54

Having 54 I/O lines enables extensive interfacing with sensors, actuators, and other peripherals, enhancing the microcontroller's utility.

Technical Specifications

Microcontrollers STM8AL31E89TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

54

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM8AL31E89TCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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