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STM8AL31E89TCX

STMicroelectronics

STM8AL31E89TCX by STMicroelectronics

STM8AL31E89TCX microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 1.8V and 3.6V, and includes ADC and PWM channels. Its compact 10x10 mm flatpack design makes it ideal for space-constrained applications. This versatile MCU is perfect for embedded systems requiring efficient processing and control.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,940 parts In-Stock

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6,940

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Anansix

USA . 1,896 parts In-Stock

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1,896

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Digiode

USA . 1,749 parts In-Stock

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1,749

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,989 parts In-Stock

1+ parts

$2.120

100+ parts

-

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2,989

$2.120

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AZTECH Wire

Italy . 181 parts In-Stock

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$17.040

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181

$17.040

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Microchip USA

USA . 3,759 parts In-Stock

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$20.351

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3,759

$20.351

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IDEA Electronic Components Group

UK . 757 parts In-Stock

1+ parts

$56.980

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$51.282

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757

$56.980

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$51.282

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MKK Technologies

India . 286 parts In-Stock

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$107.148

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286

$107.148

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DigiPath Technology Company

USA . 286 parts In-Stock

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$107.148

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286

$107.148

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QUARKTWIN TECHNOLOGY LTD

USA . 12,516 parts In-Stock

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12,516

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Parana Technologies

USA . 2,331 parts In-Stock

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$68.128

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2,331

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$68.128

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Corphita

USA . 1,904 parts In-Stock

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1,904

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Overview

Unlock your project's potential with the STM8AL31E89TCX microcontroller from STMicroelectronics, a trusted leader in innovation and quality. This robust 8-bit solution offers remarkable flexibility for various applications, from industrial automation to consumer electronics. Its low power consumption, advanced features like ADC and PWM channels, and compact design ensure unparalleled performance while saving space. Choose STM8AL31E89TCX for reliability that empowers your designs!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact configurations, making it suitable for modern electronic applications where space is limited.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications, enhancing energy efficiency.

Package Shape: SQUARE

The square package shape improves layout flexibility and thermal performance, which can be critical in high-density applications.

Bit Size: 8

An 8-bit architecture is ideal for basic control tasks and simpler applications, allowing for cost-effective solutions.

No. of Terminals: 64

With 64 terminals, this microcontroller provides ample connection options for peripherals and other components, expanding its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch design aids in effective use of space on a PCB and allows for advanced manufacturing techniques.

Minimum Supply Voltage: 1.8 V

The minimum supply voltage of 1.8 V allows for operation in low-power environments, extending battery life in portable applications.

ADC Channels: YES

The inclusion of ADC channels facilitates the conversion of analog signals to digital, allowing for real-world interfacing capabilities.

DMA Channels: YES

DMA channels enhance data transfer efficiency, reducing CPU overhead and allowing for smoother multitasking in applications.

Terminal Position: QUAD

Quad terminal positioning offers versatile mounting options and enhances connectivity on compact boards.

Width: 10 mm

The 10 mm width is compact and aids in high-density applications, ensuring a minimal footprint on the PCB.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient processing speed for general microcontroller tasks, ensuring responsiveness.

Length: 10 mm

The compact length of 10 mm is ideal for space-constrained designs, making integration straightforward.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates multiple functionalities such as GPIO, timers, and communication interfaces, simplifying designs.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed, making the product suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify soldering processes and ensure reliable connections on PCBs.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V supports energy-efficient operation in varied applications, balancing performance and power.

PWM Channels: YES

PWM channels allow for effective control of motors and brightness in LEDs, expanding the application scope of the microcontroller.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables high-density layouts while ensuring reliable solder connections in compact designs.

Speed: 16 rpm

While not typical for a microcontroller, the speed rating could refer to a specific timer functionality or application, allowing for precise timing control.

No. of I/O Lines: 54

With 54 I/O lines, this microcontroller supports diverse interfacing capabilities, making it suitable for complex projects requiring extensive connectivity.

Technical Specifications

Microcontrollers STM8AL31E89TCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

54

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM8AL31E89TCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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