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STM8AL3189TCY

STMicroelectronics

STM8AL3189TCY by STMicroelectronics

STM8AL3189TCY from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates at up to 16 MHz. It features 54 I/O lines, ADC, and PWM channels, making it ideal for low-power applications in embedded systems. Its compact FLATPACK design ensures efficient space utilization.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,406 parts In-Stock

1+ parts

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7,406

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Digiode

USA . 1,034 parts In-Stock

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1,034

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Anansix

USA . 149 parts In-Stock

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149

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,706 parts In-Stock

1+ parts

$2.120

100+ parts

-

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-

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4,706

$2.120

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AZTECH Wire

Italy . 1,095 parts In-Stock

1+ parts

$14.980

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1,095

$14.980

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Microchip USA

USA . 2,192 parts In-Stock

1+ parts

$19.046

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2,192

$19.046

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Component Stockers USA

USA . 2,232 parts In-Stock

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$37.510

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2,232

$37.510

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IDEA Electronic Components Group

UK . 719 parts In-Stock

1+ parts

$77.059

100+ parts

-

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$69.353

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719

$77.059

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$69.353

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MKK Technologies

India . 1,920 parts In-Stock

1+ parts

$144.905

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1,920

$144.905

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DigiPath Technology Company

USA . 1,920 parts In-Stock

1+ parts

$144.905

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1,920

$144.905

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Corphita

USA . 1,804 parts In-Stock

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1,804

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Parana Technologies

USA . 31 parts In-Stock

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$92.136

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31

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$92.136

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Overview

Unlock the potential of your projects with the STM8AL3189TCY microcontroller from STMicroelectronics, a leader in innovation and quality. This compact powerhouse delivers exceptional performance for a wide range of applications, from automotive to industrial control. With its low power consumption and versatile features, it empowers engineers to design smarter solutions while ensuring reliability and efficiency. Elevate your technology with STMicroelectronics—where excellence meets innovation!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient circuit board layouts, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This maximum supply voltage ensures compatibility with various power sources while maintaining low power consumption.

Package Shape: SQUARE

The square package shape optimizes the layout space on PCB, facilitating easier integration into designs.

Bit Size: 8

An 8-bit architecture allows for efficient processing of data, suitable for applications that do not require extensive computational power.

No. of Terminals: 64

With 64 terminals, this microcontroller offers extensive connectivity options to interface with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch of the flatpack style allow for high-density circuit designs, beneficial in modern electronic applications.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V enhances flexibility in power supply choices, promoting energy-efficient designs.

ADC Channels: YES

Integrated ADC channels allow for easy conversion of analog signals, making this product ideal for sensor applications.

DMA Channels: YES

The presence of DMA channels enables efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning allows for easier routing on PCB, simplifying the design process.

Width: 10 mm

A compact width facilitates integration into smaller devices, making it suitable for portable applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides adequate processing power for a wide range of embedded applications.

Length: 10 mm

The 10 mm length complements the width, contributing to a low-profile design that fits well in compact designs.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and I/O functions, streamlining design and reducing component counts.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this microcontroller suitable for battery-powered applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and enhances reliability in connections.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V balances performance and efficiency, catering to a variety of applications.

PWM Channels: YES

Integrated PWM channels enable precise control over motors and lights, making it ideal for automation and robotics.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density packing on boards, optimizing space without sacrificing performance.

Speed: 16 rpm

A speed rating of 16 rpm indicates this microcontroller can manage basic motor control applications effectively.

No. of I/O Lines: 54

With 54 I/O lines available, it provides ample options for interfacing with external components, enhancing its versatility.

Technical Specifications

Microcontrollers STM8AL3189TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

54

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM8AL3189TCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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