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STM8AL3166UAX

STMicroelectronics

STM8AL3166UAX by STMicroelectronics

STM8AL3166UAX microcontroller from STMicroelectronics features a 16 MHz CPU, 1K EEPROM, and 22 ADC channels. It operates b/w -40 °C to 85 °C with a supply voltage of 1.65V to 3.6V, making it ideal for low-power applications in industrial control systems. Its compact design supports various connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,796 parts In-Stock

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5,796

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Lonics

Poland . 2,995 parts In-Stock

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2,995

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Anansix

USA . 2,790 parts In-Stock

1+ parts

-

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2,790

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Digiode

USA . 195 parts In-Stock

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195

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,489 parts In-Stock

1+ parts

$1.390

100+ parts

-

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-

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-

7,489

$1.390

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AZTECH Wire

Italy . 922 parts In-Stock

1+ parts

$8.530

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-

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922

$8.530

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Microchip USA

USA . 3,978 parts In-Stock

1+ parts

$11.875

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3,978

$11.875

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IDEA Electronic Components Group

UK . 692 parts In-Stock

1+ parts

$49.321

100+ parts

-

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$44.389

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-

692

$49.321

-

$44.389

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MKK Technologies

India . 54 parts In-Stock

1+ parts

$92.745

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54

$92.745

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DigiPath Technology Company

USA . 54 parts In-Stock

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$92.745

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54

$92.745

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Corphita

USA . 1,409 parts In-Stock

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1,409

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Parana Technologies

USA . 1,097 parts In-Stock

1+ parts

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100+ parts

$58.971

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1,097

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$58.971

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Overview

Elevate your designs with the STM8AL3166UAX microcontroller from STMicroelectronics, a trusted leader in innovation and reliability. This compact powerhouse combines low power consumption with robust performance, perfect for diverse applications like home automation, industrial controls, and IoT devices. With integrated DAC and ADC capabilities, it simplifies complex tasks while ensuring seamless connectivity. Experience unparalleled quality and unmatched support, delivering exceptional value to your projects.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration into various devices, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options, making it versatile for different applications.

On Chip Data RAM Width: 8

Enables efficient data handling and processing, suitable for applications requiring moderate memory.

Package Shape: SQUARE

The square form factor simplifies PCB design and improves thermal performance.

Bit Size: 8

Offers compatibility with 8-bit architecture, making it a cost-effective option for many applications.

DAC Channels: YES

Integrated DAC channels enable the microcontroller to convert digital data to analog signals, enhancing its application range.

No. of Terminals: 48

A higher number of terminals provides extensive connectivity options for peripherals and devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile aids in heat dissipation, enhancing reliability in fast-paced applications.

Minimum Supply Voltage: 1.65 V

Allows for energy-efficient designs that can run on low-voltage supplies.

Maximum Operating Temperature: 85 °C

Suitable for consumer and industrial environments with a high thermal threshold.

CPU Family: STM8

Part of the well-established STM8 family, ensuring reliability and extensive support.

No. of External Interrupts: 8

Ability to handle multiple external interrupts makes it suitable for responsive applications.

Minimum Operating Temperature: -40 °C

Robust performance in extreme low temperatures, making it suitable for harsh environments.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to read analog signals, broadening its application scope.

DMA Channels: YES

DMA support allows for high-speed data transfers with minimal CPU intervention, improving efficiency.

Terminal Position: QUAD

The quad terminal positioning facilitates easier connections and soldering in designs.

ROM Words: 32768

A substantial amount of ROM allows for more complex programs and better functionality.

Maximum Seated Height: 1 mm

Low profile design assists in space-efficient production and helps meet design constraints.

Digital To Analog Convertors: 1-Ch 12-Bit

Offers precise analog output, making it excellent for applications requiring fine control.

Width: 5 mm

Compact size aids in creating smaller boards and devices, appealing to modern tech design needs.

Data EEPROM Size: 1K

Provides additional storage for non-volatile data, beneficial for embedded applications requiring data retention.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Integrated peripheral features enhance versatility and functionality in a single chip.

Maximum Clock Frequency: 16 MHz

Offers a decent processing speed for handling most tasks efficiently in a variety of applications.

Length: 5 mm

Compact dimensions contribute to overall design efficiency and allow for innovation in product layout.

Peripheral IC Type: MICROCONTROLLER

The microcontroller configuration is suited for a wide range of control and automation applications.

No. of Timers: 5

Multiple timer resources enable advanced timing operations such as scheduling and counting tasks.

RAM Bytes: 2048

Sufficient RAM for handling moderately complex applications while ensuring smooth operation.

Technology: CMOS

CMOS technology allows for lower power consumption and greater efficiency, ideal for battery-operated devices.

Terminal Form: NO LEAD

No-lead packages enhance reliability and reduce environmental impact during soldering processes.

Analog To Digital Convertors: 22-Ch 12-Bit

High channel count and resolution ADC support a wide array of sensing applications.

Maximum Supply Current: 4.9 mA

Low supply current enhances energy efficiency, prolonging the lifespan of battery-operated applications.

Nominal Supply Voltage: 1.8 V

Nominal voltage supports low-voltage designs, making it ideal for handheld and low-power devices.

No. of DMA Channels: 4

Multiple DMA channels support efficient data handling without CPU bottlenecks.

PWM Channels: YES

PWM capability is advantageous for motor control and other applications requiring variable output.

Connectivity: I2C, SPI, USART

Flexible connectivity options simplify integration with various devices and protocols.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming, supporting rapid development and updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports dense designs, facilitating advanced miniaturization.

Format: FIXED POINT

Fixed point format simplifies calculations and processing in resource-constrained environments.

Speed: 16 rpm

Adequate processing speed for performing operations in various control tasks.

Low Power Mode: YES

Low power modes extend battery life, making this microcontroller fit for portable applications.

On Chip Program ROM Width: 8

The program ROM width of 8 bits aligns with its 8-bit architecture, ensuring streamlined operation.

No. of I/O Lines: 30

A generous number of I/O lines allows for multiple interfacing possibilities, enhancing overall functionality.

Technical Specifications

Microcontrollers STM8AL3166UAX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

8

No. of I/O Lines:

30

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

4.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8AL3166UAX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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