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STM8AL3146UCX

STMicroelectronics

STM8AL3146UCX by STMicroelectronics

STM8AL3146UCX microcontroller from STMicroelectronics features a 16 MHz CPU, 22 ADC channels, and operates b/w -40 °C to 125 °C. With low power consumption (4.9 mA max) and AEC-Q100 screening, it's ideal for automotive applications. Its compact design supports I2C, SPI, and USART connectivity.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,940 parts In-Stock

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6,940

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Anansix

USA . 2,264 parts In-Stock

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2,264

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Digiode

USA . 51 parts In-Stock

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51

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,578 parts In-Stock

1+ parts

$1.360

100+ parts

-

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1,578

$1.360

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AZTECH Wire

Italy . 104 parts In-Stock

1+ parts

$8.580

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104

$8.580

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Component Stockers USA

USA . 6,504 parts In-Stock

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$22.430

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6,504

$22.430

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IDEA Electronic Components Group

UK . 455 parts In-Stock

1+ parts

$26.051

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$23.446

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455

$26.051

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$23.446

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MKK Technologies

India . 1,392 parts In-Stock

1+ parts

$48.987

100+ parts

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1,392

$48.987

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DigiPath Technology Company

USA . 1,392 parts In-Stock

1+ parts

$48.987

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1,392

$48.987

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QUARKTWIN TECHNOLOGY LTD

USA . 9,023 parts In-Stock

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9,023

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Microchip USA

USA . 4,781 parts In-Stock

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4,781

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 2,101 parts In-Stock

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$31.148

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2,101

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$31.148

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Corphita

USA . 1,361 parts In-Stock

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1,361

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Overview

Elevate your designs with the STM8AL3146UCX microcontroller from STMicroelectronics, a trusted leader in innovative solutions. This compact and efficient device delivers unmatched performance, ensuring reliability across diverse applications—from automotive to industrial controls. With advanced features like low power modes, multiple ADC channels, and robust connectivity options, experience superior functionality that drives your projects forward seamlessly while optimizing energy consumption.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration in various applications, making it ideal for space-constrained projects.

Maximum Supply Voltage: 3.6 V

This moderate voltage range ensures compatibility with a wide array of battery-powered devices, enhancing versatility.

On Chip Data RAM Width: 8

An 8-bit data RAM width is suitable for low-power applications where processing efficiency is critical.

Screening Level: AEC-Q100

The AEC-Q100 screening level signifies high reliability, making this microcontroller suitable for automotive and industrial applications.

Package Shape: SQUARE

The square package shape helps in uniform thermal distribution and simplifies PCB layout.

Bit Size: 8

An 8-bit architecture allows for a good balance between performance and power consumption for simple control applications.

DAC Channels: YES

Having DAC channels enables the microcontroller to generate analog signals, expanding its application in PWM control and audio tasks.

No. of Terminals: 48

With 48 terminals, this microcontroller offers ample connections for peripherals, accommodating complex system designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile is advantageous for applications where space is at a premium, such as portable devices.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage allows for operation in battery-powered applications, enhancing longevity and efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature level makes it suitable for harsh environments, expanding its usability.

CPU Family: STM8

The STM8 CPU family offers robust performance with low power requirements, catering to a range of applications.

No. of External Interrupts: 8

Multiple external interrupts allow for responsive designs, making it favorable for real-time applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, this microcontroller is fit for outdoor and industrial applications.

ADC Channels: YES

ADC channels enable the microcontroller to handle real-world input signals, essential for sensor-based applications.

DMA Channels: YES

Support for DMA allows for efficient data handling, freeing up CPU resources for other tasks and improving performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB design and enhances connectivity options for a variety of applications.

ROM Words: 16384

With 16KB of ROM, it provides enough memory for simple to moderately complex applications.

Maximum Seated Height: 1 mm

A low seated height enhances compatibility with space-constrained designs, allowing for more compact assemblies.

Digital To Analog Converters: 1-Ch 12-Bit

The inclusion of a 12-bit DAC ensures high-resolution output for applications requiring precise analog control.

Width: 5 mm

A compact width allows the microcontroller to be integrated into small form-factor designs easily.

Data EEPROM Size: 1K

1KB of EEPROM is sufficient for storing configuration settings and other small data, enhancing flexibility.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

The variety of integrated peripherals boosts functionality, allowing for enhanced control and monitoring in applications.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency supports fast processing for responsive applications while maintaining low power usage.

Length: 5 mm

A 5 mm length makes the microcontroller ideal for compact electronic devices, ensuring efficient use of PCB space.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is designed specifically for control applications, providing the necessary tools for efficient task management.

No. of Timers: 5

Five timers provide diverse timing capabilities, enhancing multitasking and precise control in applications.

RAM Bytes: 2048

2KB of RAM offers sufficient space for data processing, allowing for smooth execution of complex algorithms.

Technology: CMOS

Using CMOS technology ensures low power consumption, making it suitable for battery-operated devices.

Terminal Form: NO LEAD

The no-lead terminal form factor allows for better thermal management and improved electrical performance.

Analog To Digital Converters: 22-Ch 12-Bit

A 22-channel ADC enables diverse sensor integration, making it highly versatile for data acquisition applications.

Maximum Supply Current: 4.9 mA

Low maximum supply current facilitates energy-efficient designs, prolonging battery life in portable applications.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V is suitable for low-power applications, allowing for efficient operation and prolonged device lifetimes.

No. of DMA Channels: 4

A total of 4 DMA channels enhances data transfer efficiency, increasing overall system performance.

PWM Channels: YES

PWM capability allows for efficient motor control and dimming applications, broadening its utility in design.

Connectivity: I2C, SPI, USART

A variety of connectivity options ensures compatibility with various peripherals, enhancing system integration.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, essential for iterative development processes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch accommodates high-density PCB layouts, optimizing space without sacrificing connectivity.

Format: FIXED POINT

The fixed-point format is beneficial for applications that require predictable performance and efficiency in numerical operations.

Speed: 16 rpm

A speed of 16 rpm indicates suitability for low-speed applications, such as controlling motors or sensors.

Low Power Mode: YES

The low power mode feature extends battery life in portable devices by reducing power consumption during inactivity.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for efficient storage and execution of control programs in embedded systems.

No. of I/O Lines: 30

With 30 I/O lines, this microcontroller provides ample interfacing options for external components, enhancing versatility.

Technical Specifications

Microcontrollers STM8AL3146UCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

8

No. of I/O Lines:

30

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

4.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8AL3146UCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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