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STM8AL3146TAY

STMicroelectronics

STM8AL3146TAY by STMicroelectronics

STM8AL3146TAY from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 3.6V and operates in -40 °C to 85 °C. It features 32 terminals, ADC/DMA channels, and FLASH ROM for versatile applications in industrial settings. Ideal for compact designs due to its flatpack package.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,286 parts In-Stock

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4,286

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Greenchips

USA . 2,339 parts In-Stock

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2,339

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SIE Connect GmbH - GreenChips

Germany . 2,339 parts In-Stock

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2,339

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Vyrian

USA . 2,237 parts In-Stock

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2,237

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Anansix

USA . 369 parts In-Stock

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369

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Distributors (Availability)

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Vigor

Singapore . 1,798 parts In-Stock

1+ parts

$1.410

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1,798

$1.410

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Microchip USA

USA . 3,515 parts In-Stock

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$12.191

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3,515

$12.191

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AZTECH Wire

Italy . 163 parts In-Stock

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$20.330

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163

$20.330

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IDEA Electronic Components Group

UK . 1,268 parts In-Stock

1+ parts

$68.271

100+ parts

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$61.444

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1,268

$68.271

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$61.444

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MKK Technologies

India . 1,898 parts In-Stock

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$128.380

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1,898

$128.380

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DigiPath Technology Company

USA . 1,898 parts In-Stock

1+ parts

$128.380

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1,898

$128.380

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Corphita

USA . 4,048 parts In-Stock

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4,048

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Parana Technologies

USA . 1,531 parts In-Stock

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$81.629

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1,531

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$81.629

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Overview

Unlock the potential of your next project with the STM8AL3146TAY microcontroller from STMicroelectronics. Renowned for its robust quality and reliability, this versatile 8-bit MCU delivers exceptional performance in demanding applications, from automotive to industrial automation. Experience seamless integration, low power consumption, and an impressive temperature range that ensures stable operation. Trust in STMicroelectronics' legacy of innovation to elevate your designs and drive superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures a robust and reliable microcontroller suited for various environments.

Surface Mount: YES

Surface mount technology allows for compact designs, making this microcontroller ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V enables compatibility with a wide range of power sources.

Screening Level: AEC-Q100

Certification to AEC-Q100 indicates that this microcontroller meets strict automotive standards, ensuring reliability in automotive applications.

Package Shape: SQUARE

The square packaging provides a balanced footprint and efficient thermal management.

Bit Size: 8

An 8-bit architecture is optimal for smaller, simpler control tasks, enhancing efficiency and reducing costs.

Power Supplies (V): 2/3.3

Supports dual supply voltages which increase versatility in design and power management.

No. of Terminals: 32

With 32 terminals, this microcontroller offers ample connectivity options for peripheral integration.

Package Style (Meter): FLATPACK

Flatpack style facilitates easy placement on PCBs and fits well into compact electronic designs.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage allows operation in low-power environments, extending battery life in portable applications.

Maximum Operating Temperature: 85 °C

This temperature rating ensures reliable performance in moderately high-temperature environments.

CPU Family: STM8

The STM8 family offers a combination of performance and ease of use, making development straightforward.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 85 °C) ensures functionality in extreme environmental conditions, ideal for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves solderability and reduces the risk of corrosion, enhancing longevity.

ADC Channels: YES

Integrated ADC channels enable real-time data acquisition from sensors, empowering smart applications.

DMA Channels: YES

Direct Memory Access (DMA) channels facilitate efficient data handling, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity and layout flexibility on PCBs.

ROM Words: 16384

With 16384 ROM words available, this microcontroller can store substantial program code, supporting complex applications.

Width: 7 mm

Its compact width allows integration into miniature devices without compromising performance.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz delivers adequate processing power for most control applications.

Peak Reflow Temperature °C: 260

A high peak reflow temperature means compatibility with modern soldering methods, ensuring a robust assembly.

Length: 7 mm

Its small length contributes to the overall compactness, making it perfect for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature classification ensures long-term reliability in challenging environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller type, it is versatile and suitable for a diverse range of applications, from consumer electronics to industrial controls.

RAM Bytes: 2048

2048 bytes of RAM allow for effective execution of multiple tasks and efficient data handling.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals offer easy and reliable solder connections, enhancing assembly precision and reliability.

Maximum Supply Current: 80 mA

A maximum supply current of 80 mA supports a wide range of application demands without overloading.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is standard for many electronic systems, ensuring compatibility and stability.

PWM Channels: YES

The inclusion of PWM channels allows for efficient motor control and power modulation, enhancing versatility.

ROM Programmability: FLASH

Flash programmability permits easy updates and modifications to the firmware, streamlining development cycles.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch is suitable for advanced PCB designs, facilitating compatibility with high-density layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates a moderate level of moisture sensitivity, guiding proper handling and storage practices.

Speed: 16 rpm

A speed of 16 rpm allows for efficient task execution without overwhelming the processing capabilities.

No. of I/O Lines: 30

Thirty I/O lines provide extensive connectivity options for sensors and other peripherals, enhancing functionality and scalability.

Technical Specifications

Microcontrollers STM8AL3146TAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AL3146TAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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