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STM8AL3136UCY

STMicroelectronics

STM8AL3136UCY by STMicroelectronics

STM8AL3136UCY microcontroller from STMicroelectronics features a max supply voltage of 3.6V, operates at up to 16 MHz, and includes 22 ADC channels. With AEC-Q100 screening, it's ideal for automotive applications requiring reliability. Its compact design supports various connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,887 parts In-Stock

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5,887

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Bristol Electronics

USA . 2,940 parts In-Stock

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2,940

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Digiode

USA . 2,376 parts In-Stock

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2,376

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Anansix

USA . 1,629 parts In-Stock

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1,629

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Distributors (Availability)

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Vigor

Singapore . 3,652 parts In-Stock

1+ parts

$1.210

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-

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3,652

$1.210

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Microchip USA

USA . 5,099 parts In-Stock

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$11.411

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5,099

$11.411

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AZTECH Wire

Italy . 940 parts In-Stock

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$15.090

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940

$15.090

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IDEA Electronic Components Group

UK . 1,163 parts In-Stock

1+ parts

$39.249

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$35.324

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1,163

$39.249

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$35.324

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MKK Technologies

India . 883 parts In-Stock

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$73.805

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883

$73.805

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DigiPath Technology Company

USA . 883 parts In-Stock

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$73.805

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883

$73.805

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Corphita

USA . 889 parts In-Stock

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Parana Technologies

USA . 342 parts In-Stock

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$46.928

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342

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$46.928

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Overview

Unlock innovation with the STM8AL3136UCY microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for robust performance in automotive and industrial applications, this versatile device ensures reliability under extreme conditions. With features like integrated DAC and ADC channels, it empowers your projects while maintaining low power consumption. Trust STMicroelectronics to deliver quality and efficiency, enhancing your designs and driving success.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration into various electronic circuits, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-voltage applications, enhancing battery efficiency.

On Chip Data RAM Width: 8

An 8-bit RAM width is suitable for simple applications with lower memory requirements, ensuring cost-effectiveness.

Screening Level: AEC-Q100

The AEC-Q100 screening level guarantees high reliability in automotive applications, making this microcontroller a robust choice for automotive electronics.

Package Shape: SQUARE

The square package shape provides efficient thermal management and allows for dense placement on PCBs.

Bit Size: 8

An 8-bit architecture is ideal for cost-sensitive applications where processing power requirements are modest.

DAC Channels: YES

Inclusion of DAC channels allows for digital signals to be converted to analog form, broadening functionality in control applications.

No. of Terminals: 48

A greater number of terminals provides flexibility for interfacing with various peripherals, enhancing the microcontroller's versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style improves thermal dissipation while maintaining a low profile, suitable for compact devices.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage extends battery life, making it ideal for portable and low-power designs.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows for use in harsh environments, increasing its range of application.

CPU Family: STM8

The STM8 family offers a reliable and proven architecture with ample documentation and community support.

No. of External Interrupts: 8

Multiple external interrupts provide enhanced responsiveness for real-time applications, improving system performance.

Minimum Operating Temperature: -40 °C

A wide temperature range makes this microcontroller suitable for extreme environmental conditions, perfect for industrial use.

ADC Channels: YES

Having ADC channels allows the microcontroller to interact with analog sensors, expanding its functional capabilities.

DMA Channels: YES

The presence of DMA channels helps offload data transfer tasks from the CPU, improving performance and efficiency.

Terminal Position: QUAD

Quad terminal positioning optimizes PCB layout, making it easier to integrate into various designs.

ROM Words: 8192

A substantial number of ROM words allows for complex program storage, facilitating advanced applications.

Maximum Seated Height: 1 mm

A low seated height allows for a compact design, crucial for modern electronic devices.

Digital To Analog Converters: 1-Ch 12-Bit

A 12-bit DAC provides high-resolution analog output, ideal for sensitive control applications.

Width: 5 mm

The compact width enables more devices to fit on a PCB, optimizing space usage.

Data EEPROM Size: 1K

An integrated EEPROM size of 1K allows for efficient data storage and retention without using external components.

Peripherals: BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Diverse peripherals enhance functionality, enabling features like real-time clocks, watch-dog timers, and data management.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides ample processing speed for many applications without excessive power consumption.

Length: 5 mm

A compact length, along with its width, makes this microcontroller a perfect fit for space-limited applications.

Peripheral IC Type: MICROCONTROLLER

As a peripheral IC type microcontroller, it integrates well with other components in embedded systems.

No. of Timers: 5

Multiple timers allow for precise time management in applications, making it suitable for time-critical tasks.

RAM Bytes: 2048

With 2048 bytes of RAM, it can handle moderate data storage needs, suitable for many embedded applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it efficient and reliable.

Terminal Form: NO LEAD

No lead configuration allows for a more compact and environmentally friendly design.

Analog To Digital Converters: 22-Ch 12-Bit

Having 22 channels of 12-bit ADCs enables the device to monitor multiple analog sources, enhancing functionality.

Maximum Supply Current: 4.9 mA

Low maximum supply current ensures energy efficiency, making it suitable for battery-operated devices.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V optimizes power consumption while maintaining performance.

No. of DMA Channels: 4

Multiple DMA channels facilitate efficient data transfers, improving system performance by reducing CPU load.

PWM Channels: YES

With PWM channels available, it's well-suited for applications requiring precise motor control or signal generation.

Connectivity: I2C, SPI, USART

Multiple communication interfaces provide flexibility in connecting with different devices and sensors.

ROM Programmability: FLASH

Flash memory programmability allows for easy updates and reprogramming without hardware changes.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports compact designs, ensuring suitability for high-density applications.

Format: FIXED POINT

Fixed-point format is well-suited for efficient arithmetic operations in control applications.

Speed: 16 rpm

The speed specification indicates suitability for low-speed applications, such as sensors and simple actuators.

Low Power Mode: YES

Low power mode capability extends battery life, making it an optimal choice for portable and energy-efficient devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width is adequate for simpler applications, balancing performance and cost considerations.

No. of I/O Lines: 30

30 I/O lines provide significant flexibility for interfacing with various devices, enhancing overall versatility.

Technical Specifications

Microcontrollers STM8AL3136UCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

8

No. of I/O Lines:

30

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

4.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, USART

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(5), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8AL3136UCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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