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STM8AF6388TDX

STMicroelectronics

STM8AF6388TDX by STMicroelectronics

STM8AF6388TDX microcontroller from STMicroelectronics features an 8-bit CPU with a max clock of 24 MHz, operating temp range of -40 °C to 150 °C, and supports I2C/SPI connectivity. With 48 terminals and 6 KB RAM, it's ideal for automotive applications requiring robust performance. Its low-profile package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,751 parts In-Stock

1+ parts

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12,751

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Digiode

USA . 1,024 parts In-Stock

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1,024

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Anansix

USA . 975 parts In-Stock

1+ parts

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975

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,146 parts In-Stock

1+ parts

$2.290

100+ parts

-

1k+ parts

-

10k+ parts

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1,146

$2.290

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AZTECH Wire

Italy . 837 parts In-Stock

1+ parts

$18.400

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837

$18.400

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Microchip USA

USA . 5,189 parts In-Stock

1+ parts

$19.776

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5,189

$19.776

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IDEA Electronic Components Group

UK . 2,228 parts In-Stock

1+ parts

$46.955

100+ parts

-

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$42.259

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2,228

$46.955

-

$42.259

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MKK Technologies

India . 760 parts In-Stock

1+ parts

$88.296

100+ parts

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760

$88.296

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DigiPath Technology Company

USA . 760 parts In-Stock

1+ parts

$88.296

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760

$88.296

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Parana Technologies

USA . 1,087 parts In-Stock

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$56.142

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1,087

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$56.142

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Corphita

USA . 171 parts In-Stock

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171

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Overview

Unlock unmatched performance and reliability with the STM8AF6388TDX microcontroller from STMicroelectronics. Designed for harsh environments, it excels in automotive and industrial applications while offering exceptional power efficiency and versatility. Benefit from a robust architecture that simplifies design, reduces costs, and enhances system longevity. Choose STM8AF6388TDX for innovative solutions that drive your projects forward!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact circuits and is ideal for modern assembly techniques.

Maximum Supply Voltage: 5.5 V

This flexible maximum voltage ensures compatibility with a wide range of power supply designs, enhancing usability in various applications.

Package Shape: SQUARE

The square package shape optimizes PCB layout and space-saving, making it suitable for compact devices.

Bit Size: 8

The 8-bit architecture provides a good balance of performance and ease of use, ideal for a variety of applications.

No. of Terminals: 48

With 48 terminals, it supports extensive I/O options, allowing for greater flexibility in peripheral connections.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style supports high-density designs and is suited for applications requiring a low profile and fine pitch connections.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage ensures compatibility with battery-powered devices, extending the potential applications for this microcontroller.

Maximum Operating Temperature: 150 °C

High temperature tolerance makes this microcontroller suitable for harsh environments and applications where heat may be a concern.

CPU Family: STM8A

The STM8A family offers robust performance and proven reliability, ensuring that it meets the requirements of various embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures enhances the microcontroller’s versatility in extreme environments.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with the analog world, making it capable of handling various sensors.

DMA Channels: YES

DMA channels enhance data handling by allowing peripherals to communicate directly with memory, improving performance and efficiency.

Terminal Position: QUAD

Quad terminal positioning facilitates easier PCB design and layout, ensuring efficient use of board space.

ROM Words: 65536

With a substantial ROM capacity, this microcontroller can store complex programs, enhancing its functionality in diverse applications.

Width: 7 mm

The compact width allows for integration into smaller devices without compromising performance.

Data EEPROM Size: 2048

A decent EEPROM size allows for storing non-volatile data, enhancing the usability of the microcontroller in applications requiring data retention.

Peripherals: BOR, POR, PWM, TIMER(4), WDT(2)

Diverse built-in peripherals increase the microcontroller’s capabilities in managing power, timing, and control functions effectively.

Maximum Clock Frequency: 24 MHz

A 24 MHz clock frequency provides adequate processing speed for a variety of applications, striking a balance between performance and power consumption.

Length: 7 mm

The compact length adds to its space-saving nature, making it an excellent choice for tight applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is specifically designed for embedded applications, ensuring optimal functionality and performance.

RAM Bytes: 6144

Ample RAM allows for efficient processing and storage of data during operation, supporting more complex applications.

Terminal Form: GULL WING

The gull wing form factor aids in effective soldering and enhances board-level connections, ensuring reliability.

Analog To Digital Convertors: 10-Ch 10-Bit

10 channels of 10-bit ADCs enable detailed data acquisition from multiple analog sources, enhancing functionality in sensor applications.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage ensures compatibility with commonly used power supplies, simplifying design and integration.

PWM Channels: YES

With PWM channels available, this microcontroller is suitable for applications requiring motor control, dimming, and other modulation tasks.

Connectivity: I2C, SPI, LINUART, USART

Versatile connectivity options allow for easy integration with other devices and expanded functionality in connected systems.

ROM Programmability: FLASH

Flash programmability enables easy updating and customization of the firmware, making it adaptable for changing application needs.

Terminal Pitch: 0.5 mm

A fine terminal pitch enhances the density of connections, allowing for more compact designs.

Speed: 24 rpm

The speed rating indicates efficient operation capabilities, important for applications that require timely responses.

On Chip Program ROM Width: 8

An 8-bit ROM width aligns with standard data processing, making it straightforward to implement in various software environments.

No. of I/O Lines: 38

38 I/O lines provide significant interfacing capabilities, fulfilling the requirements of complex embedded systems.

Technical Specifications

Microcontrollers STM8AF6388TDX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8A

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

38

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

6144

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

I2C, SPI, LINUART, USART

Peripherals:

BOR, POR, PWM, TIMER(4), WDT(2)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

STM8AF6388TDX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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