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STM8AF6388TCY

STMicroelectronics

STM8AF6388TCY by STMicroelectronics

STM8AF6388TCY microcontroller from STMicroelectronics features an 8-bit architecture, operates b/w 1.8V and 5.5V, and supports up to 24 MHz clock frequency. With 48 terminals and integrated ADC/DMA channels, it's ideal for automotive applications. Its compact FLATPACK design ensures efficient space utilization in devices.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,270 parts In-Stock

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10,270

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Anansix

USA . 1,296 parts In-Stock

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1,296

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Digiode

USA . 1,129 parts In-Stock

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1,129

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Distributors (Availability)

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Vigor

Singapore . 4,083 parts In-Stock

1+ parts

$1.960

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4,083

$1.960

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Microchip USA

USA . 2,841 parts In-Stock

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$18.274

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2,841

$18.274

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AZTECH Wire

Italy . 495 parts In-Stock

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$20.580

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495

$20.580

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IDEA Electronic Components Group

UK . 953 parts In-Stock

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$53.708

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$48.337

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953

$53.708

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$48.337

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MKK Technologies

India . 607 parts In-Stock

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$100.994

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607

$100.994

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DigiPath Technology Company

USA . 607 parts In-Stock

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$100.994

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607

$100.994

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QUARKTWIN TECHNOLOGY LTD

USA . 5,819 parts In-Stock

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5,819

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Parana Technologies

USA . 969 parts In-Stock

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$64.216

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969

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$64.216

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Corphita

USA . 339 parts In-Stock

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339

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Overview

Unlock the potential of your next project with the STM8AF6388TCY microcontroller from STMicroelectronics. Renowned for its exceptional quality, this versatile MCU delivers reliable performance across a range of applications, from automotive to industrial automation. With its compact design and advanced features like ADC and PWM channels, it offers unmatched value. Experience efficiency and innovation combined—elevate your designs with a trusted partner in technology!

Feature Benefit Bullets

Surface Mount: YES

This surface mount capability allows for easier and more efficient PCB designs, saving space and improving overall layout.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage enables flexibility in powering the microcontroller with various power sources.

Package Shape: SQUARE

The square package shape contributes to uniform size and ease of integration into compact designs.

Bit Size: 8

Being an 8-bit microcontroller, it is suited for simpler applications while maintaining efficient performance.

No. of Terminals: 48

With 48 terminals, it provides ample connectivity options for various peripherals and I/O operations.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style reduces height and footprint on the PCB, enabling space-efficient designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage helps in reducing power consumption and allows for battery-operated applications.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal processing, making it ideal for sensor applications.

DMA Channels: YES

The presence of DMA channels enhances data transfer efficiency, reducing CPU load and improving performance.

Terminal Position: QUAD

QUAD terminal positioning facilitates easier soldering and improves connection stability on PCBs.

Width: 7 mm

A compact width ensures compatibility with densely populated circuit boards.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz provides sufficient processing speed for various applications.

Length: 7 mm

The short length contributes to reduced size, making it suitable for compact electronic designs.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is versatile for a wide range of applications, from consumer electronics to industrial controls.

Terminal Form: GULL WING

GULL WING terminals offer reliable mechanical connections, simplifying PCB assembly and ensuring durability.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V strikes a balance between performance and power efficiency.

PWM Channels: YES

Support for PWM channels makes it suitable for motor control and various signal modulation applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for closer terminal placements, enhancing the integration density on PCBs.

Speed: 24 rpm

With a speed of 24 rpm, it is suitable for applications requiring moderate-speed control, like actuators.

No. of I/O Lines: 38

Having 38 I/O lines provides extensive interfacing options, crucial for complex designs and multiple peripherals.

Technical Specifications

Microcontrollers STM8AF6388TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

38

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AF6388TCY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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