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STM8AF62A8TDX

STMicroelectronics

STM8AF62A8TDX by STMicroelectronics

STM8AF62A8TDX by STMicroelectronics is an 8-bit microcontroller with 3.3/5V power supplies, 24MHz clock frequency, and 10-Ch 10-Bit ADC channels. Ideal for automotive applications, it features BOD, POR, TIMER(9) peripherals and connectivity options like I2C, LIN, SPI, UART, USART. Operating temperature ranges from -40 to 150 °C.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,420 parts In-Stock

1+ parts

-

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2,420

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Anansix

USA . 1,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,679

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Digiode

USA . 361 parts In-Stock

1+ parts

-

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361

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,103 parts In-Stock

1+ parts

$2.720

100+ parts

-

1k+ parts

-

10k+ parts

-

1,103

$2.720

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AZTECH Wire

Italy . 533 parts In-Stock

1+ parts

$10.320

100+ parts

-

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-

533

$10.320

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Microchip USA

USA . 4,045 parts In-Stock

1+ parts

$25.349

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4,045

$25.349

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IDEA Electronic Components Group

UK . 2,340 parts In-Stock

1+ parts

$25.939

100+ parts

-

1k+ parts

$23.345

10k+ parts

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2,340

$25.939

-

$23.345

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MKK Technologies

India . 456 parts In-Stock

1+ parts

$48.777

100+ parts

-

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456

$48.777

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DigiPath Technology Company

USA . 456 parts In-Stock

1+ parts

$48.777

100+ parts

-

1k+ parts

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456

$48.777

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Corphita

USA . 4,293 parts In-Stock

1+ parts

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4,293

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Parana Technologies

USA . 512 parts In-Stock

1+ parts

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100+ parts

$31.014

1k+ parts

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512

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$31.014

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Overview

Experience unparalleled performance and reliability with the STM8AF62A8TDX microcontroller by STMicroelectronics. Designed with cutting-edge technology, this versatile device is perfect for a wide range of applications in the automotive industry. Enjoy seamless connectivity, advanced peripherals, and efficient power management, all while benefiting from the superior quality and value that STMicroelectronics is known for. Upgrade your projects today with the STM8AF62A8TDX and unlock endless possibilities in innovation and development.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller chip, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Supports a wide range of input voltages, making it versatile for various applications.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and quality, suitable for automotive applications.

Package Shape: SQUARE

Compact shape allows for efficient use of space on the circuit board.

Bit Size: 8

Good balance between performance and cost for many embedded applications.

Power Supplies (V): 3.3/5

Supports multiple voltage options, offering flexibility in power requirements.

No. of Terminals: 48

Provides ample connectivity options for interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Optimal package design for space-constrained applications, ensuring efficient board layout.

Minimum Supply Voltage: 3 V

Supports low voltage operation, suitable for energy-efficient designs.

Maximum Operating Temperature: 150 °C

High temperature tolerance for use in harsh environments or automotive applications.

CPU Family: STM8

Belongs to a reputable and reliable microcontroller family from STMicroelectronics.

Minimum Operating Temperature: -40 °C

Can function in extreme cold conditions, suitable for industrial and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and reliable electrical connections for long-term performance.

ADC Channels: YES

Supports analog-to-digital conversion, enabling interfacing with sensors and other analog devices.

Terminal Position: QUAD

Facilitates easy alignment and soldering during assembly, ensuring reliable connections.

ROM Words: 32768

Sufficient memory for storing program instructions and data, suitable for medium-sized projects.

Maximum Seated Height: 1.6 mm

Low profile design for compact applications where height clearance is limited.

Width: 7 mm

Compact size for efficient use of board space in various electronic devices.

Data EEPROM Size: 2K

Provides non-volatile memory for storing data that needs to be retained even when power is turned off.

Peripherals: BOD, POR, TIMER(9)

Integrated peripherals enhance functionality and performance for diverse applications.

Maximum Clock Frequency: 24 MHz

High clock speed for efficient processing of instructions and data, suitable for real-time applications.

Length: 7 mm

Compact size for board space optimization in small electronic devices.

Temperature Grade: AUTOMOTIVE

Designed to operate reliably in automotive environments with temperature variations and vibrations.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, ensuring optimal performance and functionality.

RAM Bytes: 6144

Provides ample volatile memory for storing data and variables during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Soldering-friendly terminal form for easy assembly and reliable electrical connections.

Analog To Digital Convertors: 10-Ch 10-Bit

Supports multiple analog inputs with high resolution conversion, suitable for sensor interfacing.

Maximum Supply Current: 16.8 mA

Efficient power consumption for energy-conscious designs, extending battery life.

Nominal Supply Voltage: 5 V

Common supply voltage for compatibility with a wide range of electronic components and systems.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) for precise control of output signals, ideal for motor control and dimming applications.

Connectivity: I2C, LIN, SPI, UART, USART

Versatile connectivity options for communication with other devices and peripherals in various protocols.

ROM Programmability: FLASH

Flash-based memory allows for convenient and fast programming of the microcontroller for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch for high-density PCB designs, enabling more connections in a limited space.

Moisture Sensitivity Level (MSL): 3

Ensures proper handling and storage of the device during manufacturing and assembly processes.

Speed: 24 rpm

Capable of processing instructions and data at a high speed, suitable for time-critical applications.

On Chip Program ROM Width: 32

Wide ROM width for storing program instructions, enabling complex algorithms and applications.

No. of I/O Lines: 38

Sufficient I/O lines for interfacing with external devices and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers STM8AF62A8TDX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

48

On Chip Program ROM Width:

32

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C, LIN, SPI, UART, USART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

STM8AF62A8TDX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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