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STM8AF62A6UDX

STMicroelectronics

STM8AF62A6UDX by STMicroelectronics

STM8AF62A6UDX microcontroller from STMicroelectronics features a 24 MHz CPU, operates b/w -40 °C to 150 °C, and supports up to 25 I/O lines. Ideal for automotive applications, it offers low power modes and AEC-Q100 screening. Its compact design ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,190 parts In-Stock

1+ parts

-

100+ parts

-

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7,190

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-

-

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Digiode

USA . 4,871 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,871

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Anansix

USA . 2,099 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

-

2,099

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,889 parts In-Stock

1+ parts

$2.430

100+ parts

-

1k+ parts

-

10k+ parts

-

1,889

$2.430

-

-

-

AZTECH Wire

Italy . 352 parts In-Stock

1+ parts

$8.360

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$8.360

-

-

-

IDEA Electronic Components Group

UK . 1,025 parts In-Stock

1+ parts

$22.112

100+ parts

-

1k+ parts

$19.901

10k+ parts

-

1,025

$22.112

-

$19.901

-

Microchip USA

USA . 5,376 parts In-Stock

1+ parts

$22.252

100+ parts

-

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-

5,376

$22.252

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MKK Technologies

India . 1,636 parts In-Stock

1+ parts

$41.581

100+ parts

-

1k+ parts

-

10k+ parts

-

1,636

$41.581

-

-

-

DigiPath Technology Company

USA . 1,636 parts In-Stock

1+ parts

$41.581

100+ parts

-

1k+ parts

-

10k+ parts

-

1,636

$41.581

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

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7,000

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Corphita

USA . 3,228 parts In-Stock

1+ parts

-

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3,228

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Parana Technologies

USA . 584 parts In-Stock

1+ parts

-

100+ parts

$26.438

1k+ parts

-

10k+ parts

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584

-

$26.438

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Overview

Elevate your designs with the STM8AF62A6UDX microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Engineered for automotive applications, it offers unmatched reliability and performance across extreme temperatures. Benefit from its low power consumption, advanced features like PWM and ADC channels, and compact design that fits seamlessly into your projects. Experience innovation that drives efficiency and enhances functionality, empowering you to create cutting-edge solutions with confidence.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for compact designs and efficient use of PCB space, making it ideal for modern electronic applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supplies, providing flexibility in various applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width is suitable for straightforward data handling, which is often sufficient for many microcontroller tasks.

Screening Level: AEC-Q100

Being AEC-Q100 certified ensures reliability and suitability for automotive applications, providing assurance of quality in critical environments.

Package Shape: SQUARE

The square package shape optimizes space efficiency on PCBs, facilitating easier integration into various designs.

Bit Size: 8

An 8-bit architecture is ideal for low-power, cost-sensitive applications where complex data processing is not required.

No. of Terminals: 32

With 32 terminals, this microcontroller offers ample connectivity options for interfacing with other components and sensors.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink capability enable effective heat dissipation, enhancing performance in space-constrained applications.

Minimum Supply Voltage: 3 V

A low minimum supply voltage of 3 V allows for operation in battery-powered devices, extending their runtime.

Maximum Operating Temperature: 150 °C

This high temperature tolerance makes it suitable for harsh environments, particularly in automotive applications.

CPU Family: STM8

The STM8 family provides a reliable platform with proven performance, ensuring stability and support for a range of applications.

Minimum Operating Temperature: -40 °C

The ability to operate at extremely low temperatures ensures reliability in diverse climatic conditions, particularly for automotive uses.

ADC Channels: YES

Integrated ADC channels allow for direct sensor reading, streamlining the design process and reducing component count.

Terminal Position: QUAD

The quad terminal arrangement facilitates easy handling and soldering, improving assembly efficiency.

ROM Words: 131072

A large ROM capacity enables the storage of complex programs, enhancing functionality and capability for various applications.

Maximum Seated Height: 1 mm

The low seated height contributes to slim form factors in final product designs, appealing to aesthetics and compact requirements.

RAM Words: 3072

Ample RAM allows for complex calculations and data storage during operation, enhancing overall performance.

Width: 5 mm

The compact width supports miniaturized designs, making this microcontroller advantageous for space-sensitive applications.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz allows for quick processing speeds, making it suitable for responsive applications.

Length: 5 mm

The short length complements its width, contributing to a very compact design footprint that is critical for modern electronics.

Temperature Grade: AUTOMOTIVE

With an automotive temperature grade, this microcontroller is specifically designed to withstand the demanding conditions of vehicle applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it integrates various functionalities making it versatile for embedded control applications.

RAM Bytes: 6144

Sufficient RAM size supports complex applications, allowing for efficient multitasking and data handling.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead terminals provide improved performance in various environments by minimizing concerns over corrosion and contact quality.

Maximum Supply Current: 16.8 mA

A maximum supply current of 16.8 mA ensures efficient power usage, making it suitable for low-power applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many electronics, making integration into existing systems easier.

PWM Channels: YES

The inclusion of PWM channels facilitates motor control and other applications requiring precise signal modulation.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and customization of the firmware, enhancing usability and longevity.

Terminal Pitch: 0.5 mm

A tight terminal pitch allows for denser layout designs, maximizing circuit board real estate.

Format: FIXED POINT

The fixed-point format simplifies computation and data processing, which can lead to faster execution in resource-constrained systems.

Speed: 24 rpm

This microcontroller's speed rating is suitable for a variety of control applications, making it versatile in performance.

Low Power Mode: YES

The low power mode enables energy-saving operation, essential for portable and energy-efficient applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width optimizes memory usage for small-scale applications, ensuring efficient firmware storage.

No. of I/O Lines: 25

With 25 I/O lines available, this microcontroller provides extensive connectivity options for diverse interfacing needs.

Technical Specifications

Microcontrollers STM8AF62A6UDX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of I/O Lines:

25

No. of Terminals:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM8AF62A6UDX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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