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STM8AF6286UDY

STMicroelectronics

STM8AF6286UDY by STMicroelectronics

STM8AF6286UDY microcontroller from STMicroelectronics features a 24 MHz CPU, operates b/w -40 °C to 150 °C, and supports 7 ADC channels. With a compact flatpack design and 32 terminals, it's ideal for automotive applications requiring robust performance. Its connectivity options include CAN and I2C for versatile integration.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,815 parts In-Stock

1+ parts

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6,815

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-

-

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Anansix

USA . 1,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,154

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-

-

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Digiode

USA . 563 parts In-Stock

1+ parts

-

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-

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563

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,556 parts In-Stock

1+ parts

$2.010

100+ parts

-

1k+ parts

-

10k+ parts

-

2,556

$2.010

-

-

-

Ampacity Inc.

Singapore . 336 parts In-Stock

1+ parts

$13.000

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-

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-

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-

336

$13.000

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-

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Microchip USA

USA . 3,894 parts In-Stock

1+ parts

$16.922

100+ parts

-

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3,894

$16.922

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AZTECH Wire

Italy . 360 parts In-Stock

1+ parts

$20.690

100+ parts

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360

$20.690

-

-

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IDEA Electronic Components Group

UK . 1,867 parts In-Stock

1+ parts

$67.515

100+ parts

-

1k+ parts

$60.764

10k+ parts

-

1,867

$67.515

-

$60.764

-

MKK Technologies

India . 1,914 parts In-Stock

1+ parts

$126.958

100+ parts

-

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-

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1,914

$126.958

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DigiPath Technology Company

USA . 1,914 parts In-Stock

1+ parts

$126.958

100+ parts

-

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10k+ parts

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1,914

$126.958

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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100+ parts

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7,000

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Corphita

USA . 1,680 parts In-Stock

1+ parts

-

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1,680

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-

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Parana Technologies

USA . 1,040 parts In-Stock

1+ parts

-

100+ parts

$80.725

1k+ parts

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10k+ parts

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1,040

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$80.725

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Overview

Unlock limitless potential with the STM8AF6286UDY microcontroller from STMicroelectronics, a leader in innovative technology. Designed for reliability and versatility, this robust chip excels in automotive and industrial applications, ensuring peak performance even in extreme conditions. With its advanced peripherals and seamless connectivity options, you’ll enjoy enhanced functionalities and efficient designs, all backed by ST's renowned quality and support. Elevate your projects with unmatched precision and power!

Feature Benefit Bullets

Surface Mount: YES

Being surface mount allows for easier integration into compact designs and improved performance due to reduced lead inductance.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows compatibility with a wide range of power supplies, making it flexible for various applications.

Package Shape: SQUARE

The square package shape helps in maximizing space utilization on the PCB, making it ideal for space-constrained designs.

Bit Size: 8

An 8-bit architecture is straightforward and sufficient for a variety of control applications, enabling simple programming and reduced cost.

No. of Terminals: 32

Having 32 terminals provides ample I/O options for connecting peripherals, sensors, and other components.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style enhances the design's compactness, making it suitable for applications with limited vertical space.

Minimum Supply Voltage: 3 V

The low minimum supply voltage of 3 V enables operation with battery-powered or energy-efficient devices.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature provides reliability and stability in harsh environments or industrial applications.

CPU Family: STM8

The STM8 family offers reliable performance along with a rich set of features and support from the manufacturer.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures makes this microcontroller suitable for automotive and industrial applications.

ADC Channels: YES

Having ADC channels enables direct measurements of analog signals, enhancing the microcontroller's versatility for a variety of applications.

Terminal Position: QUAD

Quad terminal position allows for a balanced layout on PCB, promoting better performance in high-speed applications.

ROM Words: 65536

A larger ROM size enables more complex programs to be stored directly on the microcontroller.

Width: 7 mm

The compact width helps in maintaining a small footprint on the PCB.

Data EEPROM Size: 2048

A sizeable EEPROM allows for flexible data storage, enabling applications that require the retention of critical information.

Peripherals: BOR, POR, PWM, TIMER, WDT(2)

Built-in peripherals enhance functionality, allowing for better control and management of various tasks within applications.

Maximum Clock Frequency: 24 MHz

A 24 MHz clock frequency enables faster computation and processing capabilities, enhancing performance in time-sensitive tasks.

Length: 7 mm

The short length contributes to a small overall package size, ideal for miniaturized electronic designs.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it combines processing power with peripheral interfaces in a single IC, simplifying design complexity.

RAM Bytes: 6144

Sufficient RAM size ensures that applications can execute complex algorithms and multitask efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making it ideal for battery-operated devices.

Terminal Form: GULL WING

The gull-wing terminal form provides easy soldering and assembly, improving manufacturing efficiency.

Analog To Digital Convertors: 7-Ch 10-Bit

Multiple ADC channels allow for the simultaneous monitoring of various signals, enhancing system responsiveness.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard in many applications, ensuring easy compatibility with other electronic components.

PWM Channels: YES

Supporting PWM channels allows for precise control of motors and other actuators within the system.

Connectivity: CAN, I2C, LIN, UART, SPI, USART

Multiple connectivity options enable easy interfacing with various devices and systems, expanding the scope of applications.

ROM Programmability: FLASH

FLASH ROM programmability allows for easy reprogramming and updates, enhancing the device’s flexibility across product lifecycles.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch strikes a balance between ease of soldering and compact design.

Speed: 24 rpm

While not directly related to the microcontroller's specs, a speed capability of 24 rpm indicates potential effective control in motor-driven applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width optimizes programming efficiency for 8-bit applications and reduces system complexity.

No. of I/O Lines: 25

With 25 I/O lines, this microcontroller can manage many peripheral devices simultaneously, facilitating complex control tasks.

Technical Specifications

Microcontrollers STM8AF6286UDY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

25

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

6144

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2048

Connectivity:

CAN, I2C, LINUART, SPI, USART

Peripherals:

BOR, POR, PWM, TIMER, WDT(2)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

STM8AF6286UDY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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