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STM8AF6286TCX

STMicroelectronics

STM8AF6286TCX by STMicroelectronics

STM8AF6286TCX by STMicroelectronics is an 8-bit microcontroller with 24 MHz clock frequency, 3072 RAM words, and 65536 ROM words. Ideal for automotive applications due to AEC-Q100 screening level, it features low power mode and PWM channels for efficient performance in a compact FLATPACK package.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,144 parts In-Stock

1+ parts

-

100+ parts

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4,144

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Digiode

USA . 3,939 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,939

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Chip Stock

USA . 3,700 parts In-Stock

1+ parts

-

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3,700

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Anansix

USA . 2,008 parts In-Stock

1+ parts

-

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2,008

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,889 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

-

10k+ parts

-

1,889

$1.870

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AZTECH Wire

Italy . 62 parts In-Stock

1+ parts

$10.970

100+ parts

-

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-

10k+ parts

-

62

$10.970

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Microchip USA

USA . 4,924 parts In-Stock

1+ parts

$17.386

100+ parts

-

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4,924

$17.386

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IDEA Electronic Components Group

UK . 2,282 parts In-Stock

1+ parts

$37.048

100+ parts

-

1k+ parts

$33.344

10k+ parts

-

2,282

$37.048

-

$33.344

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MKK Technologies

India . 818 parts In-Stock

1+ parts

$69.667

100+ parts

-

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818

$69.667

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DigiPath Technology Company

USA . 818 parts In-Stock

1+ parts

$69.667

100+ parts

-

1k+ parts

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818

$69.667

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Corphita

USA . 903 parts In-Stock

1+ parts

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903

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Parana Technologies

USA . 341 parts In-Stock

1+ parts

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100+ parts

$44.297

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341

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$44.297

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Overview

Enhance your projects with the STM8AF6286TCX microcontroller from STMicroelectronics. Known for their high-quality components, STMicroelectronics delivers reliable products that meet the rigorous demands of various applications. This microcontroller, with its versatile features and capabilities, offers exceptional value to customers looking to optimize performance and efficiency in their designs. Whether you're working on automotive, industrial, or consumer electronics projects, this microcontroller is the perfect choice to bring your ideas to life. Experience the benefits of cutting-edge technology and unlock endless possibilities with the STM8AF6286TCX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight, durable, and cost-effective.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 5.5 V

Suitable for applications requiring a higher supply voltage.

On Chip Data RAM Width: 8

8-bit data RAM width provides sufficient memory capacity for processing tasks.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Bit Size: 8

8-bit architecture is suitable for handling basic computational tasks efficiently.

No. of Terminals: 32

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Flatpack, low profile design saves space and allows for compact PCB layouts.

Minimum Supply Voltage: 3 V

Operates at a low minimum supply voltage, conserving power in applications with strict power requirements.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range suitable for automotive and industrial applications.

CPU Family: STM8

STM8 CPU family offers proven performance and reliability for microcontroller applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation in extreme environmental conditions.

ADC Channels: YES

Built-in ADC channels for analog signal conversion, suitable for sensor interfacing.

Terminal Position: QUAD

Quad terminal position provides a secure connection to the PCB.

ROM Words: 65536

Large ROM capacity of 65536 words for storing program code and data.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for slim and compact device design.

RAM Words: 3072

Sufficient RAM capacity of 3072 words for temporary data storage during program execution.

Width: 7 mm

Compact width of 7mm for space-constrained PCB layouts.

Maximum Clock Frequency: 24 MHz

High maximum clock frequency of 24 MHz for fast data processing and response times.

Length: 7 mm

Compact length of 7mm for space-saving PCB designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in automotive environments.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller for embedded system applications.

RAM Bytes: 6144

Generous RAM capacity of 6144 bytes for data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form for easy and secure surface mounting on the PCB.

Maximum Supply Current: 16.8 mA

Low maximum supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 5 V

Standard 5V nominal supply voltage suitable for a wide range of applications.

PWM Channels: YES

Built-in PWM channels for precise control of connected devices.

ROM Programmability: FLASH

Flash ROM programmability for easy and quick updating of program code.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm for high-density PCB layouts.

Format: FIXED POINT

Fixed point format for efficient mathematical operations and data processing.

Speed: 24 rpm

Operating speed of 24 rpm for responsive and real-time control applications.

Low Power Mode: YES

Low power mode option for energy-saving operation in battery-powered devices.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits for storing program instructions.

No. of I/O Lines: 25

Adequate number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM8AF6286TCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of I/O Lines:

25

No. of Terminals:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AF6286TCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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