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STM8AF6268TCX

STMicroelectronics

STM8AF6268TCX by STMicroelectronics

STM8AF6268TCX by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 2048 bytes of RAM, 1K data EEPROM size, and 10-Ch 10-Bit ADC channels. Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range from -40 °C to 125°C.

Median Price

$2.060

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,400 parts In-Stock

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$2.060

Distributors (In-Stock)

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Vyrian

USA . 2,855 parts In-Stock

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2,855

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Anansix

USA . 2,565 parts In-Stock

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Digiode

USA . 1,258 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 1,950 parts In-Stock

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$1.660

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-

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$1.660

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AZTECH Wire

Italy . 506 parts In-Stock

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$8.610

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506

$8.610

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Microchip USA

USA . 5,133 parts In-Stock

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$14.933

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$14.933

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$45.298

100+ parts

$41.221

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$37.144

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-

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$45.298

$41.221

$37.144

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IDEA Electronic Components Group

UK . 58 parts In-Stock

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$52.017

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$46.815

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58

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$46.815

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MKK Technologies

India . 1,183 parts In-Stock

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$97.814

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$97.814

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DigiPath Technology Company

USA . 1,183 parts In-Stock

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$97.814

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$97.814

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Perfect Parts

USA . 10,752 parts In-Stock

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Corphita

USA . 4,946 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,409 parts In-Stock

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Parana Technologies

USA . 1,495 parts In-Stock

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$62.194

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$62.194

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A-Z Elektronik GmbH

Germany . 341 parts In-Stock

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341

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Overview

Unlock endless possibilities with the STM8AF6268TCX microcontroller from STMicroelectronics. Designed with top-notch quality and reliability, this powerful microcontroller is perfect for a wide range of applications in automotive electronics, industrial control systems, and consumer electronics. With its advanced features and high performance, the STM8AF6268TCX offers unmatched value and benefits to customers looking for seamless integration, robust functionality, and innovative solutions. Experience the difference with this cutting-edge microcontroller and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, ensuring a long lifespan.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making it suitable for automotive applications.

ROM Words: 8192

Large ROM capacity allows for storing a significant amount of program data, enabling complex applications.

ADC Channels: YES

Analog-to-digital converters enhance the microcontroller's ability to interface with the analog world, opening up more application possibilities.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency, making the microcontroller suitable for demanding applications.

Connectivity: I2C, LIN, SPI, UART

Support for various communication protocols facilitates easy integration with other devices and systems.

RAM Bytes: 2048

Adequate RAM capacity enables efficient data processing and manipulation, enhancing the microcontroller's performance.

Technical Specifications

Microcontrollers STM8AF6268TCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

48

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

STM8AF6268TCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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