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STM8AF6266UAY

STMicroelectronics

STM8AF6266UAY by STMicroelectronics

STM8AF6266UAY by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 2048 bytes of RAM, 1K data EEPROM size, and 7-Ch 10-Bit ADC channels. Ideal for industrial applications requiring high-speed processing and multiple connectivity options like I2C, LIN, SPI, and UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,098 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,098

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Vyrian

USA . 2,374 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,374

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Anansix

USA . 1,270 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,270

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 785 parts In-Stock

1+ parts

$10.860

100+ parts

-

1k+ parts

-

10k+ parts

-

785

$10.860

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Microchip USA

USA . 5,213 parts In-Stock

1+ parts

$12.734

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-

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-

10k+ parts

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5,213

$12.734

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IDEA Electronic Components Group

UK . 172 parts In-Stock

1+ parts

$34.815

100+ parts

-

1k+ parts

$31.333

10k+ parts

-

172

$34.815

-

$31.333

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MKK Technologies

India . 2,099 parts In-Stock

1+ parts

$65.467

100+ parts

-

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2,099

$65.467

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DigiPath Technology Company

USA . 2,099 parts In-Stock

1+ parts

$65.467

100+ parts

-

1k+ parts

-

10k+ parts

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2,099

$65.467

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 7,209 parts In-Stock

1+ parts

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7,209

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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Corphita

USA . 3,205 parts In-Stock

1+ parts

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3,205

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Parana Technologies

USA . 1,715 parts In-Stock

1+ parts

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100+ parts

$41.626

1k+ parts

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1,715

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$41.626

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Overview

Unlock the power of innovation with the STM8AF6266UAY by STMicroelectronics. Crafted with precision and expertise, this microcontroller offers unrivaled performance and reliability in a compact package. Ideal for a wide range of applications, from industrial automation to consumer electronics, this product delivers exceptional value and versatility. Experience seamless connectivity, efficient power management, and advanced peripherals all in one device. Elevate your designs and bring your ideas to life with the STM8AF6266UAY.

Feature Benefit Bullets

Surface Mount YES

Allows for easy and convenient mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage 5.5 V

Wide range of supply voltage allows for flexibility in power supply options.

Package Shape SQUARE

Square package shape is space-efficient and easy to handle during assembly.

Bit Size 8

8-bit architecture provides a good balance between performance and cost for many applications.

Power Supplies (V) 3.3/5

Supports both 3.3V and 5V power supplies, making it compatible with a wide range of systems.

No. of Terminals 32

Sufficient number of terminals for connecting to various external components and peripherals.

Package Style (Meter) CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer flexibility in design and thermal management.

Minimum Supply Voltage 3 V

Low minimum supply voltage allows for operation in low-power applications.

Maximum Operating Temperature 85 °C

Wide operating temperature range suitable for industrial applications.

CPU Family ST8

Belongs to a reputable CPU family known for reliability and performance.

Minimum Operating Temperature -40 °C

Can operate in extremely low temperature environments without compromising performance.

ADC Channels YES

Built-in analog-to-digital converters enable interfacing with analog sensors and signals.

Terminal Position QUAD

Quad terminal position allows for easy access to all terminals for debugging and testing.

ROM Words 8192

Ample ROM size for storing program code and data in embedded applications.

Maximum Seated Height 1 mm

Low profile design makes it suitable for compact electronic devices.

Width 5 mm

Compact width allows for space-saving PCB layout.

Data EEPROM Size 1K

Sufficient EEPROM size for storing configuration data and settings.

Peripherals BOD, POR, TIMER(9)

Built-in peripherals enhance functionality and flexibility of the microcontroller.

Maximum Clock Frequency 16 MHz

High clock frequency allows for fast execution of instructions and real-time processing.

Length 5 mm

Compact length for space-saving PCB design.

Temperature Grade INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments.

Peripheral IC Type MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency for embedded applications.

RAM Bytes 2048

Sufficient RAM size for temporary data storage and buffer operations.

Technology CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form NO LEAD

Lead-free terminal form compliant with environmental regulations.

Analog To Digital Convertors 7-Ch 10-Bit

Multiple ADC channels with 10-bit resolution for accurate analog signal sampling.

Maximum Supply Current 14 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage 5 V

Stable 5V supply voltage for reliable operation of the microcontroller.

PWM Channels YES

Pulse Width Modulation channels for precise control of analog outputs.

Connectivity I2C, LIN, SPI, UART

Multiple communication interfaces for seamless connectivity with external devices and peripherals.

ROM Programmability FLASH

Flash programmable ROM for easy firmware updates and reprogramming.

Terminal Pitch 0.5 mm

Fine terminal pitch for compact design and high-density PCB assembly.

Speed 16 rpm

High speed operation for efficient execution of real-time tasks.

On Chip Program ROM Width 32

32-bit program ROM width for handling large amounts of program code efficiently.

No. of I/O Lines 25

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM8AF6266UAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of I/O Lines:

25

No. of Terminals:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

STM8AF6266UAY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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