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STM8AF6246UDX

STMicroelectronics

STM8AF6246UDX by STMicroelectronics

STM8AF6246UDX by STMicroelectronics is an 8-bit microcontroller with 4096 ROM words, 2048 RAM bytes, and 512 data EEPROM size. It operates at a max clock frequency of 16 MHz and features 7-Ch 10-Bit ADC channels. Ideal for automotive applications due to AEC-Q100 screening level.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,952 parts In-Stock

1+ parts

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6,952

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Digiode

USA . 3,053 parts In-Stock

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1k+ parts

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3,053

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Anansix

USA . 1,252 parts In-Stock

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1,252

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,728 parts In-Stock

1+ parts

$1.480

100+ parts

-

1k+ parts

-

10k+ parts

-

1,728

$1.480

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Microchip USA

USA . 3,976 parts In-Stock

1+ parts

$12.468

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-

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-

10k+ parts

-

3,976

$12.468

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AZTECH Wire

Italy . 444 parts In-Stock

1+ parts

$19.570

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-

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444

$19.570

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IDEA Electronic Components Group

UK . 2,043 parts In-Stock

1+ parts

$35.712

100+ parts

-

1k+ parts

$32.140

10k+ parts

-

2,043

$35.712

-

$32.140

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MKK Technologies

India . 285 parts In-Stock

1+ parts

$67.153

100+ parts

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285

$67.153

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DigiPath Technology Company

USA . 285 parts In-Stock

1+ parts

$67.153

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285

$67.153

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Corphita

USA . 4,030 parts In-Stock

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4,030

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Parana Technologies

USA . 1,333 parts In-Stock

1+ parts

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$42.699

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1,333

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$42.699

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Overview

Unlock the potential of your automotive applications with the STM8AF6246UDX microcontroller from STMicroelectronics. This high-quality chip boasts a wide range of peripherals including BOD, POR, and TIMER(9), as well as 7-Ch 10-Bit ADC channels for precise analog to digital conversion. With a maximum clock frequency of 16 MHz and a flash ROM programmability, this RISC microcontroller offers speed and flexibility to meet your design needs. Whether you're developing automotive control systems or industrial automation solutions, the STM8AF6246UDX delivers value, performance, and reliability to drive your projects forward.

Feature Benefit Bullets

Surface Mount YES

Allows for easy installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage 5.5 V

Can handle higher voltage levels, providing flexibility in power supply options.

Screening Level AEC-Q100

Meets automotive industry standards for reliability and quality, making it suitable for automotive applications.

Package Shape SQUARE

Compact and space-saving design for efficient use of PCB real estate.

Bit Size 8

Suitable for handling basic computing tasks and applications that do not require high processing power.

Power Supplies (V) 3.3/5

Supports multiple voltage options, allowing for compatibility with different power sources.

No. of Terminals 32

Offers a sufficient number of connection points for interfacing with external devices and components.

Package Style (Meter) CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides options for different package styles to suit various PCB layouts and cooling requirements.

Minimum Supply Voltage 3 V

Can operate at lower voltage levels, increasing efficiency and reducing power consumption.

Maximum Operating Temperature 150 °C

Can withstand high operating temperatures, making it suitable for harsh environments.

CPU Family STM8

Part of a well-established and reliable microcontroller family known for its performance and features.

Minimum Operating Temperature -40 °C

Capable of functioning in extreme cold conditions, enhancing its versatility for different applications.

Terminal Finish MATTE TIN

Provides a durable and corrosion-resistant finish for long-term reliability.

ADC Channels YES

Includes analog-to-digital converter channels for processing analog signals, expanding its functionality.

Terminal Position QUAD

Quad configuration for terminals allows for easy connections and efficient layout on the PCB.

ROM Words 4096

Offers a decent amount of read-only memory for storing program instructions and data.

Maximum Seated Height 1 mm

Low profile design for space-constrained applications and compact device designs.

Width 5 mm

Compact form factor for fitting into tight spaces and smaller electronic devices.

Data EEPROM Size 512

Sufficient EEPROM storage for non-volatile data retention and program memory.

Peripherals BOD, POR, TIMER(9)

Includes built-in peripherals like brown-out detection, power-on reset, and multiple timers for added functionality.

Maximum Clock Frequency 16 MHz

Capable of high-speed processing for quick response and efficient operation.

Length 5 mm

Consistent dimensions for a square package shape, ensuring uniformity in design and layout.

Temperature Grade AUTOMOTIVE

Designed to meet the stringent requirements for automotive applications, ensuring reliability and durability.

Peripheral IC Type MICROCONTROLLER, RISC

Features a RISC architecture microcontroller for enhanced performance and efficiency in computing tasks.

RAM Bytes 2048

Adequate random-access memory for data storage and processing, enabling multitasking and data-intensive applications.

Technology CMOS

Utilizes CMOS technology for low power consumption and high speed operation, ideal for battery-powered devices.

Terminal Form NO LEAD

Lead-free terminal form for environmentally friendly and RoHS-compliant manufacturing.

Analog To Digital Convertors 7-Ch 10-Bit

Multiple analog-to-digital converter channels with 10-bit resolution for accurate analog signal processing.

Maximum Supply Current 14 mA

Low supply current consumption for reduced power usage and longer battery life.

Nominal Supply Voltage 5 V

Standard voltage supply for compatibility with many electronic components and power sources.

PWM Channels YES

Supports pulse-width modulation channels for precise control of analog circuits and devices.

Connectivity I2C, LIN, SPI, UART

Multiple communication interfaces for connecting with various external devices and peripherals.

ROM Programmability FLASH

Flash programmable ROM for easy and flexible program updates and modifications.

Terminal Pitch 0.5 mm

Fine terminal pitch for high-density mounting and space-saving PCB layouts.

Moisture Sensitivity Level (MSL) 3

Moderate moisture sensitivity level for safe handling and storage during manufacturing and assembly.

Speed 16 rpm

Capable of executing instructions at a speed of 16 million instructions per second for efficient processing.

On Chip Program ROM Width 32

Wide on-chip program ROM for storing a large number of program instructions and data.

No. of I/O Lines 25

Sufficient number of input/output lines for interfacing with external devices and peripherals for versatile applications.

Technical Specifications

Microcontrollers STM8AF6246UDX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

25

No. of Terminals:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

4096

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

512

Connectivity:

I2C, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

STM8AF6246UDX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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