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STM8AF6246ITDX

STMicroelectronics

STM8AF6246ITDX by STMicroelectronics

STM8AF6246ITDX from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates at up to 16 MHz. It features 25 I/O lines, ADC, and PWM channels, making it ideal for automotive applications. Its compact FLATPACK design ensures efficient space utilization.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,286 parts In-Stock

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7,286

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Digiode

USA . 3,877 parts In-Stock

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3,877

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Anansix

USA . 2,369 parts In-Stock

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2,369

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,167 parts In-Stock

1+ parts

$11.410

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-

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1,167

$11.410

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Microchip USA

USA . 3,843 parts In-Stock

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$15.437

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3,843

$15.437

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IDEA Electronic Components Group

UK . 585 parts In-Stock

1+ parts

$52.480

100+ parts

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$47.232

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585

$52.480

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$47.232

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MKK Technologies

India . 276 parts In-Stock

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$98.684

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276

$98.684

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DigiPath Technology Company

USA . 276 parts In-Stock

1+ parts

$98.684

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276

$98.684

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Corphita

USA . 1,982 parts In-Stock

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1,982

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Parana Technologies

USA . 927 parts In-Stock

1+ parts

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$62.747

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927

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$62.747

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Overview

Unlock your project's potential with the STM8AF6246ITDX microcontroller from STMicroelectronics! Renowned for their commitment to innovation and quality, STMicroelectronics ensures reliability and performance in every chip. This versatile 8-bit microcontroller excels in a wide range of applications, from automotive systems to industrial automation. Enjoy seamless integration, robust features, and exceptional power efficiency—all designed to elevate your designs and drive success. Experience the ST difference today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact design and easy integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage provides flexibility for various applications that require stable power input.

Package Shape: SQUARE

The square package shape optimizes board space, making it ideal for tight layouts in PCB design.

Bit Size: 8

An 8-bit architecture is sufficient for a large number of basic control applications, ensuring effective performance in budgeting environments.

No. of Terminals: 32

With 32 terminals, this microcontroller offers ample connectivity options for interfacing with various peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile package style is suitable for low-height designs and all-in-one electronic devices.

Minimum Supply Voltage: 3 V

Supporting a lower minimum supply voltage enhances energy efficiency, making it suitable for battery-operated applications.

ADC Channels: YES

The inclusion of ADC channels allows for direct interface with analog sensors, improving functionality for various sensing applications.

Terminal Position: QUAD

The quad terminal position facilitates easy routing on PCBs, contributing to better design efficiency and board layout.

ROM Words: 16384

With 16384 ROM words, there is ample program space for more complex applications and larger algorithms.

Width: 7 mm

The compact width supports space-saving designs that are essential in modern electronic products.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures that the microcontroller can handle tasks efficiently and responsively.

Length: 7 mm

The 7 mm length complements the width, keeping the entire package compact and suitable for constrained environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers simplified instruction sets for higher performance and efficiency in processing.

Technology: CMOS

The CMOS technology provides a low-power alternative, which is advantageous for mobile and battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and make assembly processes easier.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a common standard, making it easy to integrate into existing systems without special adaptations.

PWM Channels: YES

The presence of PWM channels allows for precise control over motors and lights, expanding application possibilities.

Terminal Pitch: 0.8 mm

With a 0.8 mm terminal pitch, it strikes a balance between reliability and space efficiency on a PCB.

Speed: 16 rpm

A speed of 16 RPM makes it ideal for low-speed actuator applications that require accurate control.

No. of I/O Lines: 25

Having 25 I/O lines permits a versatile range of input and output configurations for complex user applications.

Technical Specifications

Microcontrollers STM8AF6246ITDX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

NO

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

25

No. of Terminals:

32

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

16384

Speed:

16 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AF6246ITDX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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