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STM8AF6226TCSSSX

STMicroelectronics

STM8AF6226TCSSSX by STMicroelectronics

STM8AF6226TCSSSX from STMicroelectronics is an 8-bit automotive microcontroller with a max supply voltage of 5.5V and operates up to 125 °C. It features 28 external interrupts, 7 ADC channels, and supports I2C/SPI connectivity. Ideal for automotive applications requiring reliability and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 13,192 parts In-Stock

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13,192

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J2 Sourcing AB

Sweden . 2,400 parts In-Stock

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2,400

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Digiode

USA . 1,588 parts In-Stock

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1,588

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Anansix

USA . 966 parts In-Stock

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966

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Distributors (Availability)

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Microchip USA

USA . 2,726 parts In-Stock

1+ parts

$4.050

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2,726

$4.050

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AZTECH Wire

Italy . 489 parts In-Stock

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$14.900

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489

$14.900

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IDEA Electronic Components Group

UK . 1,764 parts In-Stock

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$53.031

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$47.728

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1,764

$53.031

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$47.728

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MKK Technologies

India . 1,667 parts In-Stock

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$99.721

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1,667

$99.721

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DigiPath Technology Company

USA . 1,667 parts In-Stock

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$99.721

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$99.721

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Component Stockers USA

USA . 459 parts In-Stock

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$99.990

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459

$99.990

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Parana Technologies

USA . 2,340 parts In-Stock

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$63.406

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2,340

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$63.406

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Vigor

Singapore . 1,521 parts In-Stock

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1,521

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Corphita

USA . 1,229 parts In-Stock

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1,229

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Kepictronics

USA . 755 parts In-Stock

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755

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Overview

Elevate your designs with the STM8AF6226TCSSSX microcontroller from STMicroelectronics, a trusted leader in innovative technology. This robust component seamlessly integrates into automotive applications, offering exceptional performance in extreme environments. With its low power consumption, versatile connectivity options, and impressive 8-bit processing capabilities, it empowers developers to create efficient, reliable solutions that drive your projects forward. Choose quality, choose ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for higher density and reduced size of circuit boards, enabling compact designs.

Maximum Supply Voltage: 5.5 V

The ability to operate up to 5.5 V ensures compatibility with a wide range of power supply options.

On Chip Data RAM Width: 8

An 8-bit RAM width is efficient for applications requiring less data handling, making it cost-effective.

Package Shape: SQUARE

The square package shape offers advantages in layout and mounting, allowing for efficient PCB design.

Bit Size: 8

An 8-bit architecture enables simpler and faster processing for applications that do not require complex computations.

No. of Terminals: 32

With 32 terminals, this microcontroller provides multiple interfacing options for peripheral connections.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design provides excellent space-saving characteristics on circuit boards.

Minimum Supply Voltage: 3 V

Operating at a low minimum supply voltage enhances energy efficiency, making this microcontroller suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

A high operating temperature range ensures reliability in extreme environments, critical for automotive and industrial applications.

CPU Family: STM8

Part of the well-established STM8 family, offering a balance between performance and power consumption.

No. of External Interrupts: 28

A high number of external interrupts allows for responsive designs that can handle multiple inputs efficiently.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures makes this product ideal for harsh environments such as automotive and industrial applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to handle analog inputs, making it versatile for various applications.

Terminal Position: QUAD

The quad terminal position allows for stable soldering and improved electrical performance on PCB.

ROM Words: 8192

A substantial amount of ROM enables the storage of complex programs, suitable for advanced applications.

Maximum Seated Height: 1.6 mm

A low seated height is advantageous for low-profile designs, critical for space-constrained applications.

Width: 7 mm

Compact width contributes to the overall miniaturization of electronic devices.

Data EEPROM Size: 640

A 640-byte EEPROM allows for non-volatile data storage, essential for applications that require data retention after power loss.

Peripherals: BOR, POR, PWM, TIMER(7), WDT(2)

Integrated peripherals enhance functionality, reducing the need for additional components and simplifying design.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides a good balance of speed and power consumption for typical control applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade components ensure reliability and robustness necessary for vehicle applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller, it offers efficient instruction execution and lower power consumption.

No. of Timers: 4

Multiple timers enhance the microcontroller's ability to manage timing-critical tasks effectively.

RAM Bytes: 1024

1 KB of RAM is adequate for handling various tasks and data storage, making it versatile for embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve connection reliability on PCB.

Analog To Digital Convertors: 7-Ch 10-Bit

Having 7 channels of 10-bit ADC allows for capturing multiple analog signals simultaneously, enhancing functionality.

Maximum Supply Current: 4.75 mA

A low maximum supply current promotes energy efficiency, further benefiting battery-operated applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V corresponds with many modern digital circuits, ensuring compatibility.

PWM Channels: YES

PWM channels enable effective motor control and other applications requiring analog signal approximation.

Connectivity: I2C, LINUART, SPI

Multiple connectivity options facilitate easy integration with various sensors and devices, enhancing flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the program, ensuring adaptability over the product lifecycle.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is space-efficient for tight PCB layouts, making this microcontroller suitable for compact devices.

Format: FIXED POINT

Fixed point format processing is efficient and simpler for applications that do not require floating-point calculations.

Speed: 16 rpm

The speed rating indicates reliable performance in specific control applications, whether for motors or other actuators.

Low Power Mode: YES

Low power mode capability is essential for extending battery life in portable applications.

On Chip Program ROM Width: 8

The 8-bit program ROM width is suitable for applications requiring straightforward processing requirements.

No. of I/O Lines: 28

28 I/O lines provide ample interfacing options for sensors, actuators, and other peripherals.

Technical Specifications

Microcontrollers STM8AF6226TCSSSX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of External Interrupts:

28

No. of I/O Lines:

28

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

4.75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

640

Connectivity:

I2C, LINUART, SPI

Peripherals:

BOR, POR, PWM, TIMER(7), WDT(2)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

STM8AF6226TCSSSX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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