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STM8AF52AATCX

STMicroelectronics

STM8AF52AATCX by STMicroelectronics

STM8AF52AATCX by STMicroelectronics is an 8-bit microcontroller with 131072 ROM words and 3072 RAM words. Operating at a max clock frequency of 24 MHz, it is ideal for automotive applications requiring low power mode and PWM channels. With a temperature range from -40 to 125 °C, this CMOS technology-based microcontroller offers high performance in a compact FLATPACK package.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,995 parts In-Stock

1+ parts

-

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2,995

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Anansix

USA . 2,398 parts In-Stock

1+ parts

-

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-

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2,398

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Digiode

USA . 2,332 parts In-Stock

1+ parts

-

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-

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2,332

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,178 parts In-Stock

1+ parts

$3.080

100+ parts

-

1k+ parts

-

10k+ parts

-

2,178

$3.080

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-

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IDEA Electronic Components Group

UK . 233 parts In-Stock

1+ parts

$17.119

100+ parts

-

1k+ parts

$15.407

10k+ parts

-

233

$17.119

-

$15.407

-

AZTECH Wire

Italy . 368 parts In-Stock

1+ parts

$22.190

100+ parts

-

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-

368

$22.190

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-

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MKK Technologies

India . 1,647 parts In-Stock

1+ parts

$32.192

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1,647

$32.192

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-

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DigiPath Technology Company

USA . 1,647 parts In-Stock

1+ parts

$32.192

100+ parts

-

1k+ parts

-

10k+ parts

-

1,647

$32.192

-

-

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Component Stockers USA

USA . 1,533 parts In-Stock

1+ parts

$87.890

100+ parts

-

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-

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1,533

$87.890

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QUARKTWIN TECHNOLOGY LTD

USA . 12,403 parts In-Stock

1+ parts

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12,403

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Corphita

USA . 3,671 parts In-Stock

1+ parts

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3,671

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Microchip USA

USA . 3,656 parts In-Stock

1+ parts

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3,656

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Parana Technologies

USA . 1,379 parts In-Stock

1+ parts

-

100+ parts

$20.469

1k+ parts

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1,379

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$20.469

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Kepictronics

USA . 1,250 parts In-Stock

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1,250

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Overview

Elevate your projects with the STM8AF52AATCX microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering high performance and efficiency. With features such as low power mode and PWM channels, this product provides exceptional value and benefits to customers looking to optimize their designs. Upgrade your projects today with the STM8AF52AATCX and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Easy installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 5.5 V

Supports a wide range of external power sources for flexibility in system design.

On Chip Data RAM Width: 8

Allows for efficient data processing and storage capabilities within the microcontroller.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, suitable for automotive applications.

Package Shape: SQUARE

Compact form factor that can easily fit into various device designs.

Bit Size: 8

Ideal for handling small to medium complexity tasks efficiently.

No. of Terminals: 80

Sufficient connectivity options for interfacing with external devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE

Slim design for space-constrained applications.

Minimum Supply Voltage: 3 V

Allows operation in low-voltage environments for energy efficiency.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for automotive and industrial environments.

CPU Family: STM8

A reliable and widely-used microcontroller family known for its performance and features.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, suitable for harsh environments.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for long-term reliability.

ADC Channels: YES

Integrated analog-to-digital converters for sensor interfacing and data acquisition.

Terminal Position: QUAD

Efficient terminal layout for easy PCB routing and assembly.

ROM Words: 131072

Ample program memory for storing code and data.

Maximum Seated Height: 1.6 mm

Low-profile design for compact applications.

RAM Words: 3072

Sufficient random-access memory for temporary data storage and processing.

Width: 14 mm

Compact form factor for versatile placement on PCBs.

Maximum Clock Frequency: 24 MHz

High-speed operation for quick data processing and response times.

Length: 14 mm

Compact form factor for space-saving installations.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive-grade operating conditions.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, ensuring optimized performance.

RAM Bytes: 6144

Sufficient memory for data storage and manipulation operations.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Robust terminal design for reliable solder connections.

Maximum Supply Current: 16.8 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 5 V

Standard voltage supply for compatibility with common power sources.

PWM Channels: YES

Integrated pulse-width modulation channels for precision control applications.

ROM Programmability: FLASH

Flash memory technology for easy and fast reprogramming of code and data.

Terminal Pitch: 0.65 mm

Fine pitch terminals for high-density PCB layouts.

Format: FIXED POINT

Fixed-point arithmetic format for efficient numerical calculations.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with medium moisture sensitivity.

Speed: 24 rpm

High-speed processing capabilities for real-time applications.

Low Power Mode: YES

Enables power-saving modes for extended battery life in portable devices.

On Chip Program ROM Width: 8

On-chip program memory for efficient code execution and storage.

No. of I/O Lines: 68

Sufficient input/output lines for external communication and control.

Technical Specifications

Microcontrollers STM8AF52AATCX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Terminals:

80

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

3072

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM8AF52AATCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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