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STM8AF52A8TDX

STMicroelectronics

STM8AF52A8TDX by STMicroelectronics

STM8AF52A8TDX by STMicroelectronics is an 8-bit microcontroller with 3.3/5V power supplies, 24MHz clock frequency, and 6144 bytes of RAM. Ideal for automotive applications, it features CAN, I2C, LIN, SPI connectivity and ADC channels for precise analog to digital conversion.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,535 parts In-Stock

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2,535

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Anansix

USA . 2,233 parts In-Stock

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2,233

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Digiode

USA . 1,755 parts In-Stock

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-

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1,755

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,747 parts In-Stock

1+ parts

$3.280

100+ parts

-

1k+ parts

-

10k+ parts

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1,747

$3.280

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AZTECH Wire

Italy . 1,168 parts In-Stock

1+ parts

$17.370

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-

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1,168

$17.370

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Microchip USA

USA . 3,706 parts In-Stock

1+ parts

$27.611

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3,706

$27.611

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IDEA Electronic Components Group

UK . 1,077 parts In-Stock

1+ parts

$36.781

100+ parts

-

1k+ parts

$33.103

10k+ parts

-

1,077

$36.781

-

$33.103

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MKK Technologies

India . 1,259 parts In-Stock

1+ parts

$69.164

100+ parts

-

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1,259

$69.164

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DigiPath Technology Company

USA . 1,259 parts In-Stock

1+ parts

$69.164

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1,259

$69.164

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Corphita

USA . 3,359 parts In-Stock

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3,359

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Parana Technologies

USA . 281 parts In-Stock

1+ parts

-

100+ parts

$43.977

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281

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$43.977

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A-Z Elektronik GmbH

Germany . 143 parts In-Stock

1+ parts

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143

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Kepictronics

USA . 85 parts In-Stock

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85

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Overview

Unleash the power of innovation with the STM8AF52A8TDX microcontroller from STMicroelectronics. Designed with cutting-edge technology and AEC-Q100 screening level, this versatile device offers unparalleled performance and reliability for a wide range of automotive applications. With features like 10-channel ADC, 2K data EEPROM, and connectivity options including CAN, I2C, LIN, SPI, UART, and USART, this microcontroller provides endless possibilities for your projects. Trust in STMicroelectronics' reputation for quality and excellence, and experience the difference with the STM8AF52A8TDX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good physical protection for the microcontroller, ensuring durability and longevity.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power supply options, making it versatile for various applications.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Bit Size: 8

Offers sufficient processing power for most basic to mid-level applications.

Data EEPROM Size: 2K

Provides enough non-volatile memory for storing critical data and settings.

Connectivity: CAN, I2C, LIN, SPI, UART, USART

Offers a wide range of communication options, allowing for seamless integration into various systems.

Maximum Clock Frequency: 24 MHz

Allows for fast and efficient processing of instructions and data.

Technical Specifications

Microcontrollers STM8AF52A8TDX attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

48

On Chip Program ROM Width:

32

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

16.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C, LIN, SPI, UART, USART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

STM8AF52A8TDX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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