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STM8AF5286TCY

STMicroelectronics

STM8AF5286TCY by STMicroelectronics

STM8AF5286TCY microcontroller from STMicroelectronics features a 24 MHz clock, operates b/w 3-5.5 V, and includes ADC and PWM channels. With 32 terminals in a low-profile flatpack package, it's ideal for compact applications. Its 25 I/O lines enhance versatility in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,427 parts In-Stock

1+ parts

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4,427

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Vyrian

USA . 1,001 parts In-Stock

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1,001

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Anansix

USA . 741 parts In-Stock

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741

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,599 parts In-Stock

1+ parts

$69.903

100+ parts

-

1k+ parts

$62.912

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1,599

$69.903

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$62.912

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MKK Technologies

India . 2,307 parts In-Stock

1+ parts

$131.447

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2,307

$131.447

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DigiPath Technology Company

USA . 2,307 parts In-Stock

1+ parts

$131.447

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2,307

$131.447

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Corphita

USA . 4,340 parts In-Stock

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4,340

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Parana Technologies

USA . 2,186 parts In-Stock

1+ parts

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$83.579

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2,186

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$83.579

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Overview

Elevate your designs with the STM8AF5286TCY microcontroller from STMicroelectronics, renowned for its unbeatable quality and reliability. This compact powerhouse delivers exceptional performance in various applications, from industrial automation to consumer electronics. With its low power consumption and versatile features, it streamlines development while ensuring robustness and efficiency. Trust STMicroelectronics to drive innovation and give your projects the competitive edge they deserve!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact board layouts and more efficient use of space in electronic applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in power supply options and compatibility with various circuits.

Package Shape: SQUARE

The square package shape allows for better thermal performance and efficient layout on printed circuit boards.

Bit Size: 8

An 8-bit architecture is suitable for many embedded applications, offering a balance between performance and power consumption.

No. of Terminals: 32

With 32 terminals, this microcontroller provides ample connectivity options for various peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack package is ideal for space-constrained applications, ensuring seamless integration into compact designs.

Minimum Supply Voltage: 3 V

The ability to operate at a minimum of 3 V increases the versatility of the device in battery-operated applications.

ADC Channels: YES

The inclusion of ADC channels allows for direct interfacing with analog sensors, enhancing the microcontroller's functionality.

Terminal Position: QUAD

Quad terminal positioning simplifies soldering and improves the integrity of connections on the PCB.

Width: 7 mm

A compact width makes this microcontroller suitable for small electronic devices and applications.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz enables high-speed processing of tasks, enhancing system performance.

Length: 7 mm

With a length of 7 mm, this microcontroller is ideal for densely packed circuit boards.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it's designed for a wide range of control applications, from automation to robotics.

Technology: CMOS

The CMOS technology ensures low power consumption while maintaining high-speed performance.

Terminal Form: GULL WING

The gull wing terminal form provides ease of handling and soldering during assembly.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many electronics, ensuring compatibility with a wide range of systems.

PWM Channels: YES

PWM channels allow for controlling motors and other devices with precise speed and power modulation.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm offers a compact connection option, ideal for high-density applications.

Speed: 24 rpm

A rotation speed of 24 rpm is suitable for many applications that require moderate motion control.

No. of I/O Lines: 25

Having 25 I/O lines provides significant flexibility for interfacing with various components and devices.

Technical Specifications

Microcontrollers STM8AF5286TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

24 MHz

DMA Channels:

NO

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

25

No. of Terminals:

32

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AF5286TCY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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