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STM8AF5266TCY

STMicroelectronics

STM8AF5266TCY by STMicroelectronics

STM8AF5266TCY by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 24 MHz. It features 25 I/O lines, ADC and PWM channels, and operates at a supply voltage range of 3-5.5 V. Ideal for applications requiring high-speed processing in compact designs like IoT devices and consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,258 parts In-Stock

1+ parts

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4,258

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Digiode

USA . 3,406 parts In-Stock

1+ parts

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3,406

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Anansix

USA . 1,737 parts In-Stock

1+ parts

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1,737

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,944 parts In-Stock

1+ parts

$42.882

100+ parts

-

1k+ parts

$38.594

10k+ parts

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1,944

$42.882

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$38.594

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MKK Technologies

India . 2,085 parts In-Stock

1+ parts

$80.637

100+ parts

-

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2,085

$80.637

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DigiPath Technology Company

USA . 2,085 parts In-Stock

1+ parts

$80.637

100+ parts

-

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10k+ parts

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2,085

$80.637

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Corphita

USA . 77 parts In-Stock

1+ parts

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77

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Parana Technologies

USA . 43 parts In-Stock

1+ parts

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100+ parts

$51.272

1k+ parts

-

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43

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$51.272

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Overview

Unlock the potential of your projects with the STM8AF5266TCY microcontroller by STMicroelectronics. Designed with precision and reliability in mind, this high-quality product offers a wide range of applications in various industries. With its advanced features and impressive performance capabilities, this microcontroller provides customers with unparalleled value and benefits. Trust in STMicroelectronics to deliver innovative solutions that will take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and convenient mounting on PCBs, saving space and making the overall design more compact.

Maximum Supply Voltage: 5.5 V

Can handle higher voltages without risk of damage, providing flexibility in power supply options.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, ensuring a compact design.

Bit Size: 8

Suitable for handling basic computing tasks efficiently while keeping the cost low.

No. of Terminals: 32

Offers a good number of connectivity options for interfacing with other components in the system.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design saves space and allows for a sleek and compact overall product design.

Minimum Supply Voltage: 3 V

Can operate at lower voltages, making it energy efficient and suitable for battery-powered applications.

ADC Channels: YES

Allows for analog to digital conversion, enabling the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position provides a stable and secure connection, reducing the risk of signal interference or loss.

Width: 7 mm

Narrow width allows for efficient use of space on the PCB, contributing to a compact design.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing speed, making it suitable for applications requiring quick response times.

Length: 7 mm

Compact length contributes to a space-saving design, ideal for products with size constraints.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller for handling various tasks efficiently, making it a versatile choice for different applications.

Terminal Form: GULL WING

Gull wing terminals provide a secure and reliable connection, reducing the risk of signal loss or disconnection.

Nominal Supply Voltage: 3.3 V

Stable and common supply voltage, ensuring compatibility with a wide range of power sources.

PWM Channels: YES

Provides Pulse Width Modulation channels for precise control of analog signals, ideal for applications requiring fine adjustments.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for higher density of connections, maximizing connectivity options on the PCB.

Speed: 24 rpm

Can operate at a speed of 24 rpm, suitable for applications requiring precise control and movement.

No. of I/O Lines: 25

Provides a good number of input/output lines for interfacing with external components, offering flexibility in system design.

Technical Specifications

Microcontrollers STM8AF5266TCY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

24 MHz

DMA Channels:

NO

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

25

No. of Terminals:

32

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Speed:

24 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8AF5266TCY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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