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STM690RM6E

STMicroelectronics

STM690RM6E by STMicroelectronics

STM690RM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.6V, operating from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages from 1.1V to 5.5V, ideal for industrial applications. Its compact design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,621 parts In-Stock

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7,621

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Digiode

USA . 4,645 parts In-Stock

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4,645

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Anansix

USA . 723 parts In-Stock

1+ parts

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723

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R&J Components

USA . 235 parts In-Stock

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235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 868 parts In-Stock

1+ parts

$5.226

100+ parts

-

1k+ parts

$5.017

10k+ parts

$5.017

868

$5.226

-

$5.017

$5.017

IDEA Electronic Components Group

UK . 597 parts In-Stock

1+ parts

$7.314

100+ parts

-

1k+ parts

$6.583

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-

597

$7.314

-

$6.583

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Microchip USA

USA . 184 parts In-Stock

1+ parts

$10.599

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184

$10.599

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AZTECH Wire

Italy . 1,183 parts In-Stock

1+ parts

$12.120

100+ parts

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1,183

$12.120

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MKK Technologies

India . 1,011 parts In-Stock

1+ parts

$13.754

100+ parts

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1,011

$13.754

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DigiPath Technology Company

USA . 1,011 parts In-Stock

1+ parts

$13.754

100+ parts

-

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1,011

$13.754

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Component Stockers USA

USA . 294 parts In-Stock

1+ parts

$99.990

100+ parts

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294

$99.990

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Kepictronics

USA . 5,600 parts In-Stock

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5,600

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Corphita

USA . 710 parts In-Stock

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710

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Parana Technologies

USA . 188 parts In-Stock

1+ parts

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$8.745

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188

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$8.745

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Overview

Elevate your designs with the STM690RM6E Power Management IC from STMicroelectronics—a trusted leader in innovation and quality. This compact, surface-mount solution offers exceptional reliability for a wide range of applications, from industrial to consumer electronics. With its robust temperature range and efficient voltage management, you’ll enjoy enhanced performance and energy savings, ensuring your projects stand out with top-tier quality and dependability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy materials offer good durability and thermal stability, making the IC resilient in various applications.

Surface Mount: YES

The surface mount design allows for compact PCB layouts, enabling designs that save space and reduce manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on the PCB, facilitating easier soldering and design integration.

Nominal Supply Voltage (Vsup): 3.6 V

This nominal voltage level is ideal for many consumer electronics, ensuring compatibility and efficiency in power management.

Power Supplies: 3/5 V

Supporting multiple voltage levels enhances flexibility in applications, allowing for broader use across various devices.

No. of Terminals: 8

Eight terminals offer sufficient connectivity while maintaining a compact form factor, which is ideal for space-constrained applications.

Package Style (Meter): SMALL OUTLINE

Small outline packages help in minimizing board space and are suitable for high-density applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature allows the IC to function in a wider range of environments, ensuring reliability in demanding applications.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures expands its usability in outdoor and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent solderability and resistance to corrosion, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB routing and facilitates better thermal management in designs.

Maximum Seated Height: 1.75 mm

A low seated height supports slim designs, making it perfect for portable devices and tight spaces.

Width: 3.9 mm

This compact width allows for efficient space management on printed circuit boards.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This type specializes in managing power distribution, making it ideal for battery-operated devices and energy-efficient designs.

Minimum Supply Voltage (Vsup): 1.1 V

Supporting a low minimum voltage enhances the IC's applicability in low-power applications, ideal for advanced energy-saving designs.

Maximum Time At Peak Reflow Temperature: 40 s

This reflow specification ensures compatibility with modern soldering processes, making it suitable for automated assembly.

Peak Reflow Temperature: 260 C

The ability to withstand high reflow temperatures ensures reliability during assembly and enhances thermal performance in use.

Length: 4.9 mm

The length contributes to its compact footprint, facilitating placement in space-constrained applications.

Nominal Threshold Voltage: +2.625V

This threshold voltage optimizes the device for specific signaling requirements, enhancing performance in power management tasks.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can operate reliably in harsh environments, ensuring durability and longevity.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current contributes to overall system efficiency, making it ideal for battery-operated and low-power devices.

Terminal Form: GULL WING

The gull wing terminal form provides a stable solder joint and ease of assembly, improving overall manufacturing efficiency.

Terminal Pitch: 1.27 mm

A standard terminal pitch facilitates easier PCB design and compatibility with various existing technologies.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle a maximum supply voltage of 5.5 V ensures versatility in powering a variety of devices.

Technical Specifications

Power Management ICs STM690RM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.625V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.625V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM690RM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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