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STM6778TZWB6F

STMicroelectronics

STM6778TZWB6F by STMicroelectronics

STM6778TZWB6F by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.3V, operating from 0.8V to 5.5V. It features a low profile design (1.45mm height) and operates in extreme temperatures (-40 °C to 85°C). Ideal for industrial applications, it supports adjustable thresholds and has a compact footprint (1.6mm x 2.9mm).

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.515

3,000

-

-

-

$0.515

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.713

1k+ parts

$0.494

10k+ parts

-

3,000

-

$0.713

$0.494

-

Dan-Mar Components

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Vyrian

USA . 2,891 parts In-Stock

1+ parts

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2,891

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Digiode

USA . 2,702 parts In-Stock

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2,702

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Anansix

USA . 2,086 parts In-Stock

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2,086

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SPM Sales

USA . 180 parts In-Stock

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180

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Distributors (Availability)

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Vigor

Singapore . 3,077 parts In-Stock

1+ parts

$0.540

100+ parts

-

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-

3,077

$0.540

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Microchip USA

USA . 4,671 parts In-Stock

1+ parts

$5.349

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4,671

$5.349

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$11.458

100+ parts

$10.427

1k+ parts

$9.396

10k+ parts

-

150

$11.458

$10.427

$9.396

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AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$11.700

100+ parts

-

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755

$11.700

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

1+ parts

$12.160

100+ parts

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$10.944

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1,888

$12.160

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$10.944

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MKK Technologies

India . 3 parts In-Stock

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$22.865

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3

$22.865

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DigiPath Technology Company

USA . 3 parts In-Stock

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$22.865

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3

$22.865

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RC Electronics

USA . 31,290 parts In-Stock

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31,290

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Corphita

USA . 3,446 parts In-Stock

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Perfect Parts

USA . 3,390 parts In-Stock

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3,390

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Parana Technologies

USA . 1,775 parts In-Stock

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$14.539

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1,775

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$14.539

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Overview

Elevate your designs with the STM6778TZWB6F from STMicroelectronics—a premium power management IC renowned for its reliability and precision! With a robust temperature range and low profile, this versatile component enhances power efficiency in industrial applications. Choose STMicroelectronics for unmatched quality and innovation, ensuring your projects thrive with cutting-edge performance and durability. Unlock new possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient space utilization on PCBs.

Package Shape: RECTANGULAR

Rectangular packages facilitate easier layout planning and efficient use of board space in applications.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3 V is standard for many digital devices, ensuring compatibility with various systems.

Power Supplies (V): 0.8/5.5

Wide operable voltage range allows flexibility in design and compatibility with different power supply systems.

No. of Terminals: 6

The 6-terminal configuration provides adequate connection points while maintaining a compact size.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low profile and shrink pitch design enhances space-saving possibilities and minimizes the footprint on PCBs.

Maximum Operating Temperature: 85 °C

Operating safely up to 85 °C ensures reliability in high-temperature environments.

Minimum Operating Temperature: -40 °C

A wide temperature range from -40 °C makes this IC suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes improve solderability and reliability, enhancing the longevity of connections.

Terminal Position: DUAL

Dual terminal positioning helps in efficient soldering and enhances the performance of the IC in various configurations.

Maximum Seated Height: 1.45 mm

Low seated height allows for space-efficient designs in compact electronic devices.

Width: 1.6 mm

Narrow width enhances the ability to place multiple ICs in a tight space, optimizing PCB layout.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed as a power supply support circuit, it ensures stable operation and efficient power distribution.

Minimum Supply Voltage (Vsup): 0.8 V

The ability to operate down to 0.8 V enhances the design's flexibility for low-voltage applications.

Maximum Time At Peak Reflow Temperature (s): 30

The reflow profile tolerance allows for compatibility with standard PCB manufacturing processes.

Peak Reflow Temperature (°C): 260

Withstand high reflow temperatures, ensuring stable performance throughout the soldering process.

Length: 2.9 mm

Compact length aids in design flexibility and versatility in layout configurations.

Nominal Threshold Voltage (V): +3.075, 2.313 V

The adjustable threshold voltages accommodate various application requirements, enhancing the product's adaptability.

Temperature Grade: INDUSTRIAL

Industrial-grade rating indicates robustness and reliability in demanding environments.

Maximum Supply Current (Isup): 0.035 mA

Low supply current ensures efficient power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and effective soldering performance.

Terminal Pitch: 0.95 mm

The terminal pitch allows for efficient routing on PCBs without sacrificing performance.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage increases compatibility with a wide range of systems.

Adjustable Threshold: YES

Adjustable thresholds allow customization for specific application needs, enhancing versatility.

Technical Specifications

Power Management ICs STM6778TZWB6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGES ARE 3.075V AND 2.313V; MANUAL RESET INPUT

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.035 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.075,2.313V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

STM6778TZWB6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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