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STM32WLE4CBU6TR

STMicroelectronics

STM32WLE4CBU6TR by STMicroelectronics

STM32WLE4CBU6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 131072 ROM words, and 49152 RAM bytes. It features 13-Ch 12-Bit ADC, 1-Ch 12-Bit DAC, and low power mode for IoT applications. With connectivity options like I2C(3) and SPI(2), it's ideal for wireless sensor networks.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,996 parts In-Stock

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3,996

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Digiode

USA . 3,856 parts In-Stock

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3,856

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Anansix

USA . 608 parts In-Stock

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608

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Nova Conductors

Japan . 21 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 660 parts In-Stock

1+ parts

$14.000

100+ parts

$13.650

1k+ parts

$13.580

10k+ parts

-

660

$14.000

$13.650

$13.580

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AZTECH Wire

Italy . 335 parts In-Stock

1+ parts

$19.105

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335

$19.105

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Ampacity Inc.

Singapore . 1,466 parts In-Stock

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$35.000

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1,466

$35.000

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IDEA Electronic Components Group

UK . 769 parts In-Stock

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$41.883

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$37.695

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769

$41.883

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$37.695

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Corohmni

South Africa . 1,109 parts In-Stock

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$51.859

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Aztec Data Supply Inc.

USA . 815 parts In-Stock

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$54.790

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815

$54.790

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MKK Technologies

India . 327 parts In-Stock

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$78.758

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327

$78.758

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DigiPath Technology Company

USA . 327 parts In-Stock

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$78.758

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Corphita

USA . 4,890 parts In-Stock

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Argo Parts USA

USA . 976 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Parana Technologies

USA . 736 parts In-Stock

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$50.078

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736

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Continental Prestige Electronics

USA . 669 parts In-Stock

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669

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Overview

Unlock the potential of your projects with the STM32WLE4CBU6TR by STMicroelectronics, a top-tier microcontroller that offers unparalleled quality and reliability. Designed by an industry leader, this versatile device features integrated cache, multiple ADC channels, and low power mode for optimal performance. Ideal for a wide range of applications, this microcontroller is a game-changer in the world of electronics. Experience the value and benefits of cutting-edge technology with the STM32WLE4CBU6TR. Elevate your designs and push boundaries with this exceptional product.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps improve the overall performance and efficiency of the microcontroller by reducing memory access times.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of external components.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family is known for its high performance and low power consumption, making it a popular choice for applications requiring both processing power and energy efficiency.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals into digital data, making it suitable for applications that require analog input processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient and fast processing of instructions, making it suitable for real-time applications and tasks that require quick response times.

Connectivity: I2C(3), I2S, LPUART, SPI(2), USART(2)

With a variety of connectivity options such as I2C, SPI, and USART, this microcontroller can easily communicate with a wide range of external devices, making it versatile and suitable for diverse applications.

Technical Specifications

Microcontrollers STM32WLE4CBU6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of I/O Lines:

29

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

49152

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Maximum Supply Current:

11 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(3), I2S, LPUART, SPI(2), USART(2)

Peripherals:

BOR, DMA(14), POR, RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

13-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32WLE4CBU6TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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