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STM32WB55VGQ6TR

STMicroelectronics

STM32WB55VGQ6TR by STMicroelectronics

STM32WB55VGQ6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, 256KB RAM, and operates b/w -40 °C to 85 °C. With integrated ADCs and multiple connectivity options like I2C and USB, it's ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,486 parts In-Stock

1+ parts

-

100+ parts

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6,486

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Anansix

USA . 1,890 parts In-Stock

1+ parts

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1k+ parts

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1,890

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Digiode

USA . 1,863 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,863

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$15.900

100+ parts

-

1k+ parts

-

10k+ parts

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338

$15.900

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IDEA Electronic Components Group

UK . 324 parts In-Stock

1+ parts

$74.661

100+ parts

-

1k+ parts

$67.195

10k+ parts

-

324

$74.661

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$67.195

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MKK Technologies

India . 2,132 parts In-Stock

1+ parts

$140.395

100+ parts

-

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2,132

$140.395

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DigiPath Technology Company

USA . 2,132 parts In-Stock

1+ parts

$140.395

100+ parts

-

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2,132

$140.395

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Corphita

USA . 2,565 parts In-Stock

1+ parts

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2,565

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Parana Technologies

USA . 2,037 parts In-Stock

1+ parts

-

100+ parts

$89.268

1k+ parts

-

10k+ parts

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2,037

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$89.268

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Overview

Unleash innovation with the STM32WB55VGQ6TR microcontroller from STMicroelectronics—crafted for reliability and performance. Perfect for IoT applications, smart home devices, and industrial automation, this 32-bit powerhouse ensures seamless connectivity while optimizing energy efficiency. With robust support and unparalleled quality from a trusted leader in semiconductor solutions, elevate your projects and gain a competitive edge that empowers your designs to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and lightweight properties, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves the performance and speed of data access, enhancing overall system responsiveness.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making it ideal for modern electronics.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V ensures compatibility with a wide range of battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit RAM width supports a balance between system performance and complexity.

Package Shape: SQUARE

The square package shape aids in efficient PCB layout and thermal management.

Bit Size: 32

A 32-bit architecture allows for greater processing power and functionality, making it suitable for complex applications.

No. of Terminals: 129

A high number of terminals provides flexibility for interfacing with various peripherals and components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style enhances performance in high-density applications, making it easier to integrate into smaller devices.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage allows for energy-efficient operation, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Rated for high temperatures, this microcontroller can operate reliably in demanding industrial environments.

CPU Family: CORTEX-M4

The Cortex-M4 family is known for its high efficiency in processing and low power consumption, suitable for embedded applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes this microcontroller ideal for use in extreme environments.

ADC Channels: YES

Integrated ADC channels enable precise analog-to-digital conversions, essential for sensor applications.

DMA Channels: YES

DMA channels facilitate high-speed data transfers, freeing up CPU resources for other tasks.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient PCB mounting and minimizes signal path lengths.

ROM Words: 1048576

With 1MB of ROM, ample space is available for program storage, enabling complex applications.

Maximum Seated Height: 0.6 mm

The thin profile promotes sleek device designs and is compatible with advanced manufacturing techniques.

RAM Words: 256K

256K of RAM enhances performance for data storage and manipulation, crucial for demanding applications.

Width: 7 mm

A compact width allows for integration into space-constrained devices, maintaining a small form factor.

Boundary Scan: YES

Boundary scan support aids in testing and debugging the microcontroller, streamlining development processes.

Peripherals: BOR, COMPARATOR(2), POR, RTC, TIMER(7), WDT(2)

A rich set of peripherals increases versatility, enabling a wide range of functionalities in applications.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz ensures good processing speed for various tasks.

Length: 7 mm

Similar to its width, a 7 mm length contributes to overall space efficiency in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in challenging operational environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from a simplified instruction set, making it energy-efficient and fast.

No. of Timers: 7

Multiple timers enable complex scheduling and timing operations, essential for real-time applications.

RAM Bytes: 524288

Half a megabyte of RAM allows for handling of complex algorithms and data, suitable for advanced applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it ideal for battery-powered applications.

Terminal Form: BALL

Ball terminal form promotes better thermal and electrical performance through efficient heat dissipation.

Analog To Digital Converters: 19-Ch 12-Bit

The inclusion of a 19-channel 12-bit ADC allows for high-resolution data acquisition from multiple sensors.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA supports robust operation without excessive power draw.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V is standard for many modern electronic devices, ensuring compatibility.

No. of DMA Channels: 14

A high count of DMA channels enhances data handling capabilities, critical for high-speed applications.

No. of Serial I/Os: 2

Two serial I/O lines provide basic communication capabilities for connecting to other devices.

PWM Channels: YES

Integrated PWM channels allow for advanced control in motor and light applications, enhancing functionality.

Connectivity: I2C(2), LPUART, QSPI, SAI(2), SPI(2), USART, USB

Diverse connectivity options support integration with various devices and protocols, making it a versatile choice.

ROM Programmability: FLASH

Flash programmability allows for easier updates and flexibility in application development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density assembly, making it suitable for compact applications.

Format: FLOATING POINT

Support for floating point operations enables complex mathematical calculations, useful in scientific applications.

Speed: 64 rpm

With 64 rpm, the microcontroller is capable of supporting applications that require moderate processing speeds.

Low Power Mode: YES

Low power mode helps in extending battery life, making it ideal for energy-sensitive applications.

On Chip Program ROM Width: 8

The 8-bit program ROM width balances between program size and performance efficiency.

No. of I/O Lines: 72

Having 72 I/O lines opens up numerous interfacing possibilities, allowing for extensive customization in designs.

Technical Specifications

Microcontrollers STM32WB55VGQ6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B129

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

129

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA129,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

524288

RAM Words:

256K

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(2), LPUART, QSPI, SAI(2), SPI(2), USART, USB

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(7), WDT(2)

Analog To Digital Convertors:

19-Ch 12-Bit

Trade Compliance

STM32WB55VGQ6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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