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STM32WB55VEQ6TR

STMicroelectronics

STM32WB55VEQ6TR by STMicroelectronics

STM32WB55VEQ6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 85 °C, and supports up to 100 mA supply current. With integrated ADC channels and DMA, it's ideal for industrial IoT applications. Its compact design includes 129 terminals in a very thin profile package.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,381 parts In-Stock

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Anansix

USA . 2,894 parts In-Stock

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Digiode

USA . 967 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 207 parts In-Stock

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$14.850

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207

$14.850

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IDEA Electronic Components Group

UK . 823 parts In-Stock

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$28.485

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$25.637

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823

$28.485

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$25.637

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MKK Technologies

India . 1,539 parts In-Stock

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$53.564

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$53.564

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DigiPath Technology Company

USA . 1,539 parts In-Stock

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$53.564

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1,539

$53.564

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Corphita

USA . 4,802 parts In-Stock

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Parana Technologies

USA . 1,332 parts In-Stock

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$34.058

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$34.058

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Overview

Elevate your designs with the STM32WB55VEQ6TR microcontroller from STMicroelectronics, a leader in innovation and quality. Its versatile 32-bit architecture seamlessly integrates advanced connectivity features and low-power modes, making it perfect for IoT, wearable tech, and industrial applications. Experience exceptional performance, reliability, and support from a trusted manufacturer dedicated to pushing boundaries. Empower your projects with this cutting-edge solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material makes this microcontroller suitable for various industrial applications.

Integrated Cache: YES

The presence of an integrated cache improves data access speed, enhancing overall performance.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, saving PCB space.

Maximum Supply Voltage: 3.6 V

This voltage range supports compatibility with various power supplies in embedded systems.

On Chip Data RAM Width: 8

An 8-bit RAM width offers efficient data handling, suitable for diverse applications.

Package Shape: SQUARE

The square package shape is optimal for uniform spacing during assembly, ensuring reliability.

Bit Size: 32

With a 32-bit architecture, it can handle complex computations more efficiently.

No. of Terminals: 129

A larger number of terminals allows for more connections and functionalities in the design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch make it suitable for space-constrained applications like wearables.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage ensures compatibility with low-power devices, improving energy efficiency.

Maximum Operating Temperature: 85 °C

Designed to operate at higher temperatures, making it reliable in harsh environments.

CPU Family: CORTEX-M4

The Cortex-M4 CPU offers enhanced processing capabilities ideal for real-time applications.

Minimum Operating Temperature: -40 °C

Able to function in extreme cold, making it suitable for outdoor and industrial applications.

ADC Channels: YES

Includes ADC capabilities, enabling the measurement of analog signals for sensor applications.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency, reducing CPU overhead.

Terminal Position: BOTTOM

Bottom terminals facilitate better heat dissipation and make assembly easier.

ROM Words: 524288

A substantial ROM capacity allows for more complex firmware and data storage.

Maximum Seated Height: 0.6 mm

Low seated height is preferable for thin profile designs, enhancing versatility.

RAM Words: 256K

Ample RAM offers sufficient space for applications needing quick data access.

Width: 7 mm

Its compact width is perfect for integration in miniaturized electronics.

Boundary Scan: YES

Boundary scan functionality aids in testing and debugging processes during development.

Peripherals: BOR, COMPARATOR(2), POR, RTC, TIMER(7), WDT(2)

A rich peripheral set makes it versatile for various complex applications.

Maximum Clock Frequency: 32 MHz

A high clock frequency allows for quicker processing, beneficial in high-speed applications.

Length: 7 mm

Compact length contributes to space-saving in device designs.

Temperature Grade: INDUSTRIAL

Rated for industrial use, ensuring stability and reliability in tough conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture leads to efficient instruction execution, enhancing performance.

No. of Timers: 7

Multiple timers offer flexibility for scheduling tasks and managing time-sensitive processes.

RAM Bytes: 524288

The large RAM capacity ensures the microcontroller can handle demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and improved performance.

Terminal Form: BALL

Ball terminal form allows for reliable connections and reduces the footprint on PCBs.

Analog To Digital Converters: 19-Ch 12-Bit

A high number of ADC channels and resolution support detailed data acquisition from sensors.

Maximum Supply Current: 100 mA

Allows for sufficient power delivery for intensive processing needs while managing thermal performance.

Nominal Supply Voltage: 3.3 V

The nominal voltage is common in many applications, simplifying integration with existing systems.

No. of DMA Channels: 14

A high number of DMA channels optimizes data transfers and reduces CPU workload.

No. of Serial I/Os: 2

Support for serial I/O connections enhances communication capabilities with other devices.

PWM Channels: YES

PWM channels allow for precise control of motors and other variable devices.

Connectivity: I2C(2), LPUART, QSPI, SAI(2), SPI(2), USART, USB

Diverse connectivity options enable interfacing with various peripherals and communication protocols.

ROM Programmability: FLASH

Flash programmability supports easy updates and firmware changes, improving long-term product adaptability.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density designs, enhancing component integration.

Format: FLOATING POINT

Floating point format allows for precise mathematical operations, advantageous in complex computations.

Speed: 64 rpm

Effective speed ensures timely processing, beneficial for real-time applications.

Low Power Mode: YES

Low power mode capability extends battery life in portable applications, ensuring energy efficiency.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for efficient retrieval of instructions, improving processing times.

No. of I/O Lines: 72

A high number of I/O lines expand the microcontroller’s capability for interfacing with multiple devices.

Technical Specifications

Microcontrollers STM32WB55VEQ6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B129

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of I/O Lines:

72

No. of Serial I/Os:

2

No. of Terminals:

129

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA129,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

524288

RAM Words:

256K

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(2), LPUART, QSPI, SAI(2), SPI(2), USART, USB

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(7), WDT(2)

Analog To Digital Convertors:

19-Ch 12-Bit

Trade Compliance

STM32WB55VEQ6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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