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STM32W108HBU63TR

STMicroelectronics

STM32W108HBU63TR by STMicroelectronics

STM32W108HBU63TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 8192 RAM bytes. Ideal for industrial applications, it operates b/w -40 to 85 °C with a max supply current of 150mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Lantek

USA . 42,000 parts In-Stock

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42,000

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Vyrian

USA . 10,009 parts In-Stock

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10,009

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SIE Connect GmbH - GreenChips

Germany . 9,000 parts In-Stock

1+ parts

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9,000

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Greenchips

USA . 9,000 parts In-Stock

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9,000

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Digiode

USA . 2,209 parts In-Stock

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2,209

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Anansix

USA . 1,822 parts In-Stock

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1,822

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,025 parts In-Stock

1+ parts

$18.353

100+ parts

-

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$16.518

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2,025

$18.353

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$16.518

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AZTECH Wire

Italy . 1,072 parts In-Stock

1+ parts

$22.190

100+ parts

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1,072

$22.190

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MKK Technologies

India . 2,067 parts In-Stock

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$34.512

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2,067

$34.512

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DigiPath Technology Company

USA . 2,067 parts In-Stock

1+ parts

$34.512

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2,067

$34.512

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Microchip USA

USA . 5,686 parts In-Stock

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5,686

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QUARKTWIN TECHNOLOGY LTD

USA . 5,618 parts In-Stock

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5,618

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Corphita

USA . 4,039 parts In-Stock

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4,039

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Parana Technologies

USA . 864 parts In-Stock

1+ parts

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$21.944

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864

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$21.944

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Overview

Discover the STM32W108HBU63TR by STMicroelectronics, a top-quality microcontroller designed to revolutionize your projects. With a powerful 32-bit CPU and advanced technology, this device offers unmatched performance and reliability. Whether you're working on IoT devices, smart home appliances, or industrial automation systems, this versatile microcontroller is sure to meet your needs. Trust in STMicroelectronics' reputation for excellence and innovation, and unlock a world of possibilities with the STM32W108HBU63TR. Experience the value, benefits, and advantages it brings to your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Bit Size: 32

Offers a good balance between processing power and energy efficiency for a wide range of applications.

Power Supplies (V): 1.25,1.8,2.5/3.3

Supports a variety of power supply options, making it versatile and compatible with different voltage requirements.

No. of Terminals: 40

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER

Offers a compact and efficient packaging solution, saving space on the PCB.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in high-temperature environments, suitable for industrial applications.

CPU Family: CORTEX-M3

Belongs to a well-known and established family of processors, ensuring compatibility and reliability.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extremely cold environments, suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Provides a quality finish for the terminals, ensuring good electrical conductivity and resistance to corrosion.

ROM Words: 131072

Ample ROM capacity for storing program instructions, allowing for complex applications to be implemented.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures that the microcontroller can withstand reflow soldering without damage, making it suitable for mass production.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes, ensuring reliable solder joints during assembly.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability and longevity.

RAM Bytes: 8192

Sufficient RAM capacity for temporary data storage, enabling efficient multitasking and data processing.

Technology: CMOS

Low-power CMOS technology ensures energy efficiency and prolongs battery life in portable applications.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with industry regulations.

Maximum Supply Current: 150 mA

Efficient power consumption with a low maximum supply current, suitable for battery-operated devices.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware, facilitating product maintenance and upgrades.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable dense PCB layouts, saving space and reducing manufacturing costs.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with a moderate moisture sensitivity level, ensuring reliable solder joints.

Speed: 24 rpm

Provides fast processing speed for real-time applications, ensuring smooth and responsive performance.

Technical Specifications

Microcontrollers STM32W108HBU63TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STM32W108HBU63TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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