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STM32W108CZU73TR

STMicroelectronics

STM32W108CZU73TR by STMicroelectronics

STM32W108CZU73TR by STMicroelectronics is a 32-bit microcontroller with 48 terminals, 49152 ROM words, and 12288 RAM bytes. It operates in industrial temperature range (-40 to 105 °C) and features Cortex-M3 CPU for various applications like IoT devices and embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,889 parts In-Stock

1+ parts

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7,889

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Anansix

USA . 2,155 parts In-Stock

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2,155

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Digiode

USA . 977 parts In-Stock

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977

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 654 parts In-Stock

1+ parts

$3.120

100+ parts

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654

$3.120

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IDEA Electronic Components Group

UK . 1,940 parts In-Stock

1+ parts

$47.271

100+ parts

-

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$42.544

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1,940

$47.271

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$42.544

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MKK Technologies

India . 2,016 parts In-Stock

1+ parts

$88.891

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2,016

$88.891

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DigiPath Technology Company

USA . 2,016 parts In-Stock

1+ parts

$88.891

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2,016

$88.891

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Perfect Parts

USA . 2,798 parts In-Stock

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2,798

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Parana Technologies

USA . 1,660 parts In-Stock

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$56.520

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1,660

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$56.520

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Corphita

USA . 804 parts In-Stock

1+ parts

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804

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Overview

Unleash the power of innovation with the STM32W108CZU73TR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics offers top-quality microcontrollers that are ideal for a wide range of applications. From smart home devices to industrial automation systems, this product delivers unparalleled performance and reliability. Customers can expect seamless integration, efficient operation, and exceptional value with the STM32W108CZU73TR. Stay ahead of the curve and experience the benefits of cutting-edge technology with this advanced microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy packages are durable and cost-effective, making the product reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and reduces the overall size of the product, making it suitable for compact designs.

Bit Size: 32

A 32-bit architecture provides high processing power and efficiency, making the product suitable for handling complex tasks.

Power Supplies (V): 1.25,1.8,2.5/3.3

Multiple voltage options allow flexibility in power supply configurations, making the product compatible with a variety of applications.

No. of Terminals: 48

Having a sufficient number of terminals allows for versatile connectivity options, enabling the product to interface with other components effectively.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and efficient, allowing for easy integration into electronic systems.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, enhancing its reliability in industrial settings.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers advanced processing capabilities, making the product suitable for demanding applications that require high performance.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to function in extreme cold conditions, making it suitable for a variety of environments.

ROM Words: 49152

With a large ROM capacity, the product can store a significant amount of program data and instructions, accommodating complex software requirements.

Temperature Grade: INDUSTRIAL

Being industrial-grade ensures that the product meets rigorous standards for reliability and durability, making it suitable for industrial applications.

RAM Bytes: 12288

Having a generous amount of RAM allows the product to efficiently handle data processing and multitasking, enhancing its performance.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the product energy-efficient and responsive.

Terminal Form: NO LEAD

No lead terminals are environmentally friendly and compliant with RoHS regulations, making the product sustainable and safe to use.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the firmware, enabling the product to adapt to changing requirements effectively.

Terminal Pitch: 0.5 mm

A small terminal pitch enables high-density mounting, making the product suitable for compact designs with limited space constraints.

Speed: 24 rpm

With a speed of 24 rpm, the product can process instructions quickly, enhancing its overall performance and responsiveness.

Technical Specifications

Microcontrollers STM32W108CZU73TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

49152

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32W108CZU73TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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