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STM32W108CCU73TR

STMicroelectronics

STM32W108CCU73TR by STMicroelectronics

STM32W108CCU73TR by STMicroelectronics is a 32-bit microcontroller with 65536 ROM words and 16384 RAM bytes. Operating at speeds up to 24 rpm, it is ideal for industrial applications requiring a temperature range of -40 to 105 °C. This surface-mount chip carrier package supports multiple power supplies (1.25V, 1.8V, 2.5/3.3V) in a compact square shape with no-lead terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,096 parts In-Stock

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11,096

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Digiode

USA . 1,023 parts In-Stock

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1,023

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Anansix

USA . 591 parts In-Stock

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591

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Distributors (Availability)

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AZTECH Wire

Italy . 379 parts In-Stock

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$14.220

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379

$14.220

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IDEA Electronic Components Group

UK . 1,316 parts In-Stock

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$60.413

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$54.371

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1,316

$60.413

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$54.371

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MKK Technologies

India . 2,012 parts In-Stock

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$113.602

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2,012

$113.602

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DigiPath Technology Company

USA . 2,012 parts In-Stock

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$113.602

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2,012

$113.602

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QUARKTWIN TECHNOLOGY LTD

USA . 15,280 parts In-Stock

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15,280

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Vigor

Singapore . 5,648 parts In-Stock

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5,648

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Microchip USA

USA . 5,428 parts In-Stock

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5,428

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Parana Technologies

USA . 1,162 parts In-Stock

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$72.233

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1,162

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$72.233

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Corphita

USA . 696 parts In-Stock

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696

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Overview

Experience seamless connectivity and superior performance with the STM32W108CCU73TR microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics ensures top-notch quality and reliability in all their products. This microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. Whether you're working on IoT devices, home automation systems, or industrial controls, the STM32W108CCU73TR delivers exceptional efficiency and functionality. Upgrade your projects today with this advanced microcontroller and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the microcontroller suitable for a wide range of industrial applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving, making it convenient for compact electronic designs.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and data processing efficiently.

Power Supplies (V): 1.25,1.8,2.5/3.3

Support for multiple power supply voltages ensures flexibility in design and compatibility with various power sources.

No. of Terminals: 48

Having 48 terminals allows for connectivity to a wide range of peripherals and components, enhancing the versatility of the microcontroller.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this microcontroller suitable for industrial environments where heat can be a concern.

CPU Family: CORTEX-M3

The Cortex-M3 family is known for its high-performance and energy-efficient processors, making this microcontroller a reliable choice for demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function reliably in cold environments, expanding its usability.

ROM Words: 65536

With 65536 ROM words, this microcontroller offers ample storage capacity for program memory, enabling the implementation of complex algorithms and applications.

Temperature Grade: INDUSTRIAL

Certified for industrial temperature ranges, ensuring the microcontroller can operate in harsh conditions typically found in industrial settings.

RAM Bytes: 16384

The 16384 bytes of RAM provides sufficient memory for data storage and processing, supporting the execution of multiple tasks simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing and assembly process, reducing costs and improving reliability.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the microcontroller's firmware without needing specialized equipment, enhancing flexibility and maintenance.

Speed: 24 rpm

With a speed of 24 rpm, this microcontroller can process instructions and data swiftly, ensuring optimal performance in real-time applications.

Technical Specifications

Microcontrollers STM32W108CCU73TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

STM32W108CCU73TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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