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STM32W108CBU61TR

STMicroelectronics

STM32W108CBU61TR by STMicroelectronics

STM32W108CBU61TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words and 8192 RAM bytes. Ideal for industrial applications, it operates b/w -40 to 85 °C with power supplies of 1.25V, 1.8V, and 2.5/3.3V. Its Cortex-M3 CPU family and FLASH ROM programmability make it suitable for various embedded systems projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 2,631 parts In-Stock

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2,631

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Vyrian

USA . 2,467 parts In-Stock

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2,467

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Anansix

USA . 2,033 parts In-Stock

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2,033

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Goldney Electronics S.L.

Spain . 16 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 805 parts In-Stock

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$16.950

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805

$16.950

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Microchip USA

USA . 385 parts In-Stock

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$23.708

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385

$23.708

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IDEA Electronic Components Group

UK . 1,917 parts In-Stock

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$75.204

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$67.684

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1,917

$75.204

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$67.684

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MKK Technologies

India . 899 parts In-Stock

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$141.417

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899

$141.417

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DigiPath Technology Company

USA . 899 parts In-Stock

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$141.417

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899

$141.417

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Corphita

USA . 2,800 parts In-Stock

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2,800

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Perfect Parts

USA . 268 parts In-Stock

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268

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Parana Technologies

USA . 218 parts In-Stock

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$89.918

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218

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$89.918

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GreenTree Electronics

Israel . 190 parts In-Stock

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Overview

Unlock a world of endless possibilities with the STM32W108CBU61TR microcontroller by STMicroelectronics. Designed with high-quality materials and advanced technology, this chip carrier package offers unmatched performance and reliability for your industrial applications. With a powerful Cortex-M3 CPU family and 32-bit architecture, this microcontroller delivers lightning-fast speed and efficient operation. Whether you're working on automation, IoT, or smart energy solutions, the STM32W108CBU61TR provides the perfect balance of power and efficiency to bring your projects to life. Trust STMicroelectronics to elevate your designs to the next level with this innovative microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the microcontroller, ensuring reliability and durability.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Bit Size: 32

Offers decent processing power for a variety of applications, striking a balance between performance and cost.

Power Supplies (V): 1.25,1.8,2.5/3.3

Supports a wide range of power supply voltages, making it versatile and compatible with different systems.

No. of Terminals: 48

Provides sufficient I/O connections for interfacing with other components or peripherals, enhancing functionality.

Package Style (Meter): CHIP CARRIER

Offers a compact and space-saving design, ideal for applications with limited PCB real estate.

CPU Family: CORTEX-M3

Based on a proven and reliable architecture, ensuring stable performance and compatibility with various software ecosystems.

RAM Bytes: 8192

Ample amount of memory for storing data and running multiple tasks concurrently, improving overall system efficiency.

Technology: CMOS

Utilizes low power consumption technology, suitable for battery-powered applications or energy-efficient designs.

Maximum Supply Current: 150 mA

Efficient power usage, reducing energy costs and heat generation, while maintaining stable operation.

ROM Programmability: FLASH

Provides flexibility for in-system programming and firmware updates, ensuring adaptability to changing requirements.

Technical Specifications

Microcontrollers STM32W108CBU61TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25,1.8,2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

STM32W108CBU61TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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