Loading...

STM32U575ZGT3QTR

STMicroelectronics

STM32U575ZGT3QTR by STMicroelectronics

STM32U575ZGT3QTR microcontroller from STMicroelectronics features a 32-bit Cortex-M33 CPU, operates b/w -40 °C to 125 °C, and supports up to 57 mA supply current. It includes integrated DACs and ADCs for versatile applications in IoT and automation. With 144 terminals and low power modes, it's ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,373

-

-

-

-

Anansix

USA . 1,901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,901

-

-

-

-

Digiode

USA . 448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

448

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 244 parts In-Stock

1+ parts

$22.090

100+ parts

-

1k+ parts

-

10k+ parts

-

244

$22.090

-

-

-

IDEA Electronic Components Group

UK . 1,444 parts In-Stock

1+ parts

$33.668

100+ parts

-

1k+ parts

$30.301

10k+ parts

-

1,444

$33.668

-

$30.301

-

MKK Technologies

India . 2,065 parts In-Stock

1+ parts

$63.311

100+ parts

-

1k+ parts

-

10k+ parts

-

2,065

$63.311

-

-

-

DigiPath Technology Company

USA . 2,065 parts In-Stock

1+ parts

$63.311

100+ parts

-

1k+ parts

-

10k+ parts

-

2,065

$63.311

-

-

-

Parana Technologies

USA . 1,591 parts In-Stock

1+ parts

-

100+ parts

$40.256

1k+ parts

-

10k+ parts

-

1,591

-

$40.256

-

-

Corphita

USA . 359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

359

-

-

-

-

Overview

Unlock the potential of your next project with the STM32U575ZGT3QTR microcontroller from STMicroelectronics, a name synonymous with innovation and reliability. Designed for robust performance in diverse applications—from IoT devices to industrial automation—this versatile chip ensures low power consumption without compromising on speed or functionality. Experience seamless integration and enhanced efficiency, making it the perfect choice for engineers seeking quality and value in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability in various environments.

Integrated Cache: YES

Enhances processing speed and efficiency, enabling faster data retrieval.

Surface Mount: YES

Supports compact circuit design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

Provides flexibility in powering the device within a wide range of electronic systems.

On Chip Data RAM Width: 8

Allows for efficient data handling and processing.

Package Shape: SQUARE

Facilitates easier layout integration and packaging.

Bit Size: 32

Offers a balance of performance and complexity, suitable for a wide range of applications.

DAC Channels: YES

Provides digital-to-analog conversion capabilities, allowing for audio and signal processing.

No. of Terminals: 144

Supports numerous connections, increasing versatility for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables efficient space utilization on PCBs, beneficial for modern electronics.

Minimum Supply Voltage: 1.71 V

Allows for low-power applications, ideal for battery-operated devices.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, enhancing reliability in diverse applications.

CPU Family: CORTEX-M33

Offers advanced features and power efficiency for modern embedded systems.

Minimum Operating Temperature: -40 °C

Reliable performance in extreme cold, suitable for outdoor and industrial applications.

ADC Channels: YES

Provides analog-to-digital conversion, enabling data acquisition from various sensors.

DMA Channels: YES

Increases system efficiency by allowing direct memory access for data transfers.

Terminal Position: QUAD

Enhances soldering efficiency and stability on the PCB.

ROM Words: 1048576

Provides ample storage for firmware and applications, enabling complex functionalities.

Maximum Seated Height: 1.6 mm

Low profile design aids in high-density packaging and reduced footprint.

Digital To Analog Convertors: 2-Ch 12-Bit

Supports precise signal generation for a variety of applications.

Width: 20 mm

Compact size allows for efficient integration into various designs.

Boundary Scan: YES

Facilitates testing and debugging of circuitry, improving the development process.

Peripherals: COMPARATOR(2), POR, RTC, TIMER(17), WDT(2)

Wide range of integrated peripherals enhances functionality without needing external components.

Maximum Clock Frequency: 50 MHz

Provides sufficient performance for most embedded applications.

Length: 20 mm

Compact dimensions make it easy to include in small devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient architecture results in lower power consumption during operation.

No. of Timers: 17

Supports precise timing for various tasks, improving application performance.

RAM Bytes: 804864

Ample RAM supports complex data processing, enhancing application capabilities.

Technology: CMOS

Ensures lower power consumption and heat generation compared to other technologies.

Terminal Form: GULL WING

Facilitates easy soldering and improves assembly efficiency.

Analog To Digital Convertors: 15-Ch 14-Bit, 17-Ch 12-Bit

Provides high-resolution analog data reading, which is crucial for accurate sensing.

Maximum Supply Current: 57 mA

Efficiency in power usage is pivotal for battery-powered applications.

Nominal Supply Voltage: 1.8 V

Ideal for low-voltage applications, enhancing compatibility with modern power sources.

No. of DMA Channels: 20

Increases the efficiency of data handling in applications with high data throughput.

No. of Serial I/Os: 7

Supports multiple serial communication interfaces, enhancing connectivity options.

PWM Channels: YES

Enables a wide range of applications, including motor control and signal modulation.

Connectivity: CAN, I2C(4), LPUART, SAI(2), SPI(3), UART(2), USART(3)

Diverse communication protocols allow seamless integration into many systems.

ROM Programmability: FLASH

Allows for in-circuit programming and updates, offering flexibility in applications.

Terminal Pitch: 0.5 mm

Fine pitch enables higher density of connections on the PCB without compromising performance.

Format: FLOATING-POINT

Supports complex calculations and data representation, essential for high-performance computing.

Speed: 160 rpm

Adequate speed for various control applications, ensuring responsiveness.

Low Power Mode: YES

Conserves energy during periods of inactivity, critical for long battery life.

On Chip Program ROM Width: 8

Facilitates efficient program execution and data handling.

No. of I/O Lines: 111

High number of I/O lines allows for extensive interaction with external devices and sensors.

Technical Specifications

Microcontrollers STM32U575ZGT3QTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

20

No. of External Interrupts:

0

No. of I/O Lines:

111

No. of Serial I/Os:

7

No. of Terminals:

144

No. of Timers:

17

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.86SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

804864

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

57 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, SAI(2), SPI(3), UART(2), USART(3)

Peripherals:

COMPARATOR(2), POR, RTC, TIMER(17), WDT(2)

Analog To Digital Convertors:

15-Ch 14-Bit, 17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32U575ZGT3QTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20