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STM32U575OGY3QTR

STMicroelectronics

STM32U575OGY3QTR by STMicroelectronics

STM32U575OGY3QTR from STMicroelectronics is a 32-bit microcontroller featuring a Cortex-M33 CPU, with a max clock frequency of 50 MHz and integrated DAC/ADC channels. It operates b/w -40 °C to 125 °C, making it ideal for industrial applications. Its low power mode and extensive connectivity options enhance versatility in embedded systems.

Median Price

$9.940

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$9.940

100+ parts

$6.450

1k+ parts

$4.940

10k+ parts

$4.720

200

$9.940

$6.450

$4.940

$4.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,781 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,781

-

-

-

-

Anansix

USA . 2,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,469

-

-

-

-

Digiode

USA . 2,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,458

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 82 parts In-Stock

1+ parts

$11.360

100+ parts

-

1k+ parts

-

10k+ parts

-

82

$11.360

-

-

-

Microchip USA

USA . 7,071 parts In-Stock

1+ parts

$19.050

100+ parts

-

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-

10k+ parts

-

7,071

$19.050

-

-

-

IDEA Electronic Components Group

UK . 2,368 parts In-Stock

1+ parts

$70.868

100+ parts

-

1k+ parts

$63.781

10k+ parts

-

2,368

$70.868

-

$63.781

-

MKK Technologies

India . 1,866 parts In-Stock

1+ parts

$133.262

100+ parts

-

1k+ parts

-

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-

1,866

$133.262

-

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DigiPath Technology Company

USA . 1,866 parts In-Stock

1+ parts

$133.262

100+ parts

-

1k+ parts

-

10k+ parts

-

1,866

$133.262

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-

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Corphita

USA . 2,909 parts In-Stock

1+ parts

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2,909

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Parana Technologies

USA . 1,870 parts In-Stock

1+ parts

-

100+ parts

$84.733

1k+ parts

-

10k+ parts

-

1,870

-

$84.733

-

-

Overview

Unlock limitless innovation with the STM32U575OGY3QTR microcontroller from STMicroelectronics, renowned for its unmatched quality and reliability. Designed for diverse applications including IoT, industrial automation, and consumer electronics, this highly efficient 32-bit Cortex-M33 chip offers superior performance while maintaining low power consumption. Experience seamless connectivity and robust functionality that empower your projects to excel, ensuring you stay ahead in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures reliability in various environments, making it suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache improves data access speed, enhancing overall performance during processing tasks.

Surface Mount: YES

Surface mount capability allows for a compact design and easier integration into modern PCB layouts.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with low-power devices, enhancing energy efficiency.

On Chip Data RAM Width: 8

With an 8-bit data RAM width, it’s well-suited for applications requiring efficient data handling and manipulation.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on the PCB.

Bit Size: 32

A 32-bit architecture provides robust processing capability, suitable for complex applications.

DAC Channels: YES

Integrated DAC channels offer flexibility in output signal generation, making it ideal for multimedia applications.

No. of Terminals: 90

With 90 terminals, there are ample I/O options for connecting to various peripherals and systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch design facilitate high-density applications, helping save board space.

Minimum Supply Voltage: 1.71 V

Operating at a minimum supply voltage of 1.71 V allows for low-power applications, extending battery life in portable devices.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125 °C makes it suitable for use in harsh environments.

CPU Family: CORTEX-M33

Utilizing the Cortex-M33 family enhances processing power and supports advanced features like security and digital signal processing.

Minimum Operating Temperature: -40 °C

The capability to operate at temperatures as low as -40 °C is ideal for outdoor and automotive applications.

ADC Channels: YES

The presence of ADC channels supports high-precision sensing applications, such as in industrial controls.

DMA Channels: YES

DMA channels allow for efficient data transfer between peripherals and memory, reducing CPU load and improving performance.

Terminal Position: BOTTOM

Bottom terminal position enhances thermal performance and facilitates better heat dissipation.

ROM Words: 1048576

With 1MB of ROM, ample program storage is available for complex applications and algorithms.

Maximum Seated Height: 0.59 mm

A low seated height allows for a more compact design, beneficial for space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

The inclusion of dual 12-bit DACs supports quality signal generation for various applications.

Width: 3.95 mm

A width of 3.95 mm enables placement in compact designs, aiding miniaturization.

Boundary Scan: YES

Boundary scan simplifies PCB testing and debugging, ensuring quality and reducing time-to-market.

Peripherals: COMPARATOR(2), POR, RTC, TIMER(17), WDT(2)

A rich set of peripherals offers extensive functionality for diverse applications, including timing and real-time processing.

Maximum Clock Frequency: 50 MHz

A clock frequency of 50 MHz enables fast processing speed for demanding applications.

Length: 4.2 mm

The compact length allows for efficient layout in smaller devices, supporting compact electronic designs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and efficiency, making it ideal for applications requiring low power consumption.

No. of Timers: 17

With 17 timers, this microcontroller can manage multiple time-related tasks effectively, excellent for real-time operations.

RAM Bytes: 804864

Having 804864 bytes of RAM supports demanding applications by providing ample memory for data storage.

Technology: CMOS

CMOS technology ensures lower power consumption, making this microcontroller suitable for battery-operated devices.

Terminal Form: BALL

Ball terminal form factor enhances the reliability of connections, particularly in high-density environments.

Analog To Digital Convertors: 16-Ch 14-Bit, 11-Ch 12-Bit

High-resolution ADCs ensure accurate signal sampling, essential for precision-oriented applications.

Maximum Supply Current: 57 mA

A maximum supply current of 57 mA indicates capability for powering additional peripherals without compromising performance.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V aligns with modern low-power design goals and enhances battery efficiency.

No. of DMA Channels: 20

Twenty DMA channels facilitate advanced data handling, allowing for smooth data transfer between devices.

No. of Serial I/Os: 7

Seven serial I/Os provide flexibility for communication with various devices and sensors.

PWM Channels: YES

Support for PWM channels is ideal for motor control and modulation applications, broadening its utility.

Connectivity: CAN, I2C(4), LPUART, SAI, SPI(3), UART(2), USART(3)

Diverse connectivity options ensure compatibility with a wide range of external devices and sensors.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming, enhancing long-term usability and adaptation.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch supports high-density designs, making it a valuable choice for compact devices.

Format: FLOATING-POINT

Floating-point support allows for complex mathematical computations, improving performance in signal processing tasks.

Speed: 160 rpm

A speed rating of 160 rpm indicates suitability for motor applications requiring controlled movement.

Low Power Mode: YES

Low power mode extends battery life, making this microcontroller ideal for portable and energy-sensitive applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for effective instruction handling, optimizing the programming model.

No. of I/O Lines: 69

Sixty-nine I/O lines provide extensive capabilities for interfacing with various external components.

Technical Specifications

Microcontrollers STM32U575OGY3QTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B90

Length:

4.2 mm

Low Power Mode:

YES

No. of DMA Channels:

20

No. of External Interrupts:

0

No. of I/O Lines:

69

No. of Serial I/Os:

7

No. of Terminals:

90

No. of Timers:

17

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA90,9X10,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

804864

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.59 mm

Speed:

160 rpm

Maximum Supply Current:

57 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3.95 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, SAI, SPI(3), UART(2), USART(3)

Peripherals:

COMPARATOR(2), POR, RTC, TIMER(17), WDT(2)

Analog To Digital Convertors:

16-Ch 14-Bit, 11-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32U575OGY3QTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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