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STM32U545NEY6QTR

STMicroelectronics

STM32U545NEY6QTR by STMicroelectronics

STM32U545NEY6QTR microcontroller from STMicroelectronics features a 32-bit Cortex-M33 CPU, operates b/w -40 °C to 85 °C, and supports up to 20 DMA channels. With integrated ADC/DAC capabilities and low power modes, it's ideal for IoT applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$4.998

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 190 parts In-Stock

1+ parts

$6.140

100+ parts

$3.961

1k+ parts

$3.568

10k+ parts

$3.411

190

$6.140

$3.961

$3.568

$3.411

Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$7.370

100+ parts

$4.630

1k+ parts

$3.470

10k+ parts

$3.360

200

$7.370

$4.630

$3.470

$3.360

Avnet

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.857

30,000

-

-

-

$3.857

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.801

5,000

-

-

-

$3.801

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,741

-

-

-

-

Anansix

USA . 2,231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,231

-

-

-

-

Vyrian

USA . 2,204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,204

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 395 parts In-Stock

1+ parts

$12.880

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$12.880

-

-

-

Corphita

USA . 3,231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,231

-

-

-

-

Overview

Elevate your projects with the STM32U545NEY6QTR from STMicroelectronics, a leader in innovative microcontroller solutions. This cutting-edge device combines exceptional performance with low power consumption, making it ideal for diverse applications—from IoT to industrial automation. With robust connectivity options and advanced peripherals, it empowers developers to create efficient, high-quality products that stand out in the market, ensuring reliability and longevity. Choose excellence; choose STM32!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various applications.

Integrated Cache: YES

The presence of integrated cache improves data access speed, enhancing overall performance.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly, making it suitable for modern applications.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage supports power-efficient designs, suitable for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit RAM width optimizes memory usage while enabling effective data processing.

Package Shape: SQUARE

The square package shape facilitates easy integration into various PCB layouts.

Bit Size: 32

A 32-bit architecture allows for efficient data processing and supports complex applications.

DAC Channels: YES

The inclusion of DAC channels enables accurate analog signal generation, making it versatile for various applications.

No. of Terminals: 56

A higher number of terminals allows for extensive connectivity and functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch grid array is ideal for high-density designs, maximizing space efficiency.

Minimum Supply Voltage: 1.71 V

This allows for operation in low-power conditions, which is crucial for battery-operated applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures ensures reliability in harsh environments.

CPU Family: CORTEX-M33

Based on the efficient Cortex-M33 architecture, this microcontroller provides superior performance and energy efficiency.

Minimum Operating Temperature: -40 °C

The broad temperature range ensures functionality in extreme conditions, suitable for industrial use.

ADC Channels: YES

The presence of ADC channels allows for precise digital-to-analog conversions, enhancing sensor interfacing.

DMA Channels: YES

Direct Memory Access capabilities optimize data transfer efficiency, improving the overall system performance.

Terminal Position: BOTTOM

Bottom terminal positioning allows for effective thermal management and PCB layout flexibility.

ROM Words: 524288

A large ROM capacity supports extensive firmware and application storage.

Maximum Seated Height: 0.59 mm

The thin profile allows for space-saving designs, particularly in compact electronic devices.

Digital To Analog Converters: 2-Ch 12-Bit

Dual 12-bit DACs allow for high-resolution output, making it suitable for audio and control applications.

Width: 3.38 mm

A compact width facilitates dense circuit designs without compromising functionality.

Boundary Scan: YES

Boundary scan support enhances debugging and testing capabilities, ensuring product reliability.

Peripherals: BOR, COMPARATOR, DMA(20), RTC, TIMER(17), WDT(2)

A rich set of integrated peripherals supports a wide range of applications, simplifying design complexity.

Maximum Clock Frequency: 50 MHz

A 50 MHz clock frequency enables responsive performance for real-time applications.

Length: 3.38 mm

Similar to the width, this length supports compact and efficient design layouts.

Peripheral IC Type: MICROCONTROLLER, RISC

The use of RISC architecture optimizes instruction execution, enhancing computational efficiency.

No. of Timers: 17

Multiple timers provide flexibility for various timing applications in embedded systems.

RAM Bytes: 278528

Ample RAM ensures smooth multitasking and memory allocation for complex applications.

Technology: CMOS

CMOS technology provides low power consumption and high integration, ideal for modern electronic devices.

Terminal Form: BALL

Ball terminal form factor is optimized for high-density assemblies and improves reliability.

Analog To Digital Converters: 11-Ch 14-Bit

The inclusion of 14-bit ADCs enhances resolution in data capturing applications, making it ideal for sensor integration.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA allows for low-power designs while still delivering the necessary performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V enhances compatibility with various devices and sensors.

No. of DMA Channels: 20

With 20 DMA channels, this microcontroller can efficiently manage multiple data transfers, improving performance.

No. of Serial I/Os: 4

Support for multiple serial I/Os allows for diverse connectivity options, enhancing flexibility in communication.

PWM Channels: YES

PWM support allows for precise control of motors and other devices, which is essential in automation.

Connectivity: FDCAN, I2C(4), LPUART, SAI, SPI(4), USART(2), USB

Diverse connectivity options enable integration with various other components and communication protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing adaptability.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch is suitable for high-density applications, improving space utilization on PCBs.

Format: FLOATING POINT

Floating point support is crucial for applications requiring precise mathematical calculations.

Speed: 160 rpm

Operating speed of 160 rpm allows for effective control in various dynamic applications.

Low Power Mode: YES

Low power mode options enhance energy efficiency, which is critical for battery-operated and portable devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient storage and execution of code.

No. of I/O Lines: 39

A high number of I/O lines provides flexible interfacing options for various peripherals and components.

Technical Specifications

Microcontrollers STM32U545NEY6QTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B56

Length:

3.38 mm

Low Power Mode:

YES

No. of DMA Channels:

20

No. of I/O Lines:

39

No. of Serial I/Os:

4

No. of Terminals:

56

No. of Timers:

17

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,8X14,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

278528

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.59 mm

Speed:

160 rpm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3.38 mm

Peripheral IC Type:

Connectivity:

FDCAN, I2C(4), LPUART, SAI, SPI(4), USART(2), USB

Peripherals:

BOR, COMPARATOR, DMA(20), RTC, TIMER(17), WDT(2)

Analog To Digital Convertors:

11-Ch 14-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32U545NEY6QTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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