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STM32U545JEY6QTR

STMicroelectronics

STM32U545JEY6QTR by STMicroelectronics

STM32U545JEY6QTR microcontroller from STMicroelectronics features a 32-bit Cortex-M33 CPU, operates at a max voltage of 3.6V, and includes 12 ADC channels. Ideal for low-power applications, it supports various connectivity options like I2C and USB. Its compact design ensures efficient integration in space-constrained devices.

Median Price

$7.010

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 200 parts In-Stock

1+ parts

$6.370

100+ parts

$4.120

1k+ parts

$3.714

10k+ parts

$3.552

200

$6.370

$4.120

$3.714

$3.552

Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$7.650

100+ parts

$4.820

1k+ parts

$3.620

10k+ parts

$3.550

200

$7.650

$4.820

$3.620

$3.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,634

-

-

-

-

Anansix

USA . 1,376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,376

-

-

-

-

Digiode

USA . 1,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,202

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 973 parts In-Stock

1+ parts

$18.510

100+ parts

-

1k+ parts

-

10k+ parts

-

973

$18.510

-

-

-

Corphita

USA . 2,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,375

-

-

-

-

Overview

Unlock the potential of your next innovation with the STM32U545JEY6QTR microcontroller from STMicroelectronics. Renowned for their excellence and reliability, STMicroelectronics delivers unmatched quality that empowers developers to create cutting-edge applications in IoT, smart devices, and industrial automation. With its low power consumption and advanced features, this microcontroller offers superior performance while ensuring efficiency, making it the ideal choice for your projects. Elevate your designs with a trusted partner!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable plastic/epoxy material provides reliable protection for the microcontroller, ensuring longevity and resistance to environmental factors.

Integrated Cache: YES

The presence of integrated cache enhances processing efficiency by allowing faster access to frequently used data, resulting in improved overall system performance.

Surface Mount: YES

Surface mount technology simplifies assembly and reduces the footprint on printed circuit boards, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows compatibility with a broad range of low-power applications while ensuring stable operation.

On Chip Data RAM Width: 8

An 8-bit wide on-chip RAM enables processing of data efficiently and supports various applications requiring quick data retention.

Package Shape: SQUARE

The square package shape promotes even heat distribution and simplicity in PCB layout design, optimizing performance in compact spaces.

Bit Size: 32

The 32-bit architecture enables the handling of larger data types and advanced computational tasks, suitable for modern applications.

DAC Channels: YES

The presence of DAC channels allows for direct analog signal generation, making this MCU ideal for applications such as audio output and sensor control.

No. of Terminals: 72

With 72 terminals, this microcontroller offers extensive connectivity options, catering to complex interfacing requirements.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style provides a compact footprint, facilitating high-density applications and promoting efficient thermal management.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage enhances the MCU's capability to operate in various low-voltage environments, supporting energy-efficient designs.

Maximum Operating Temperature: 85 °C

Capability to operate at a high temperature of up to 85 °C makes this MCU suitable for industrial and demanding environmental conditions.

CPU Family: CORTEX-M33

Based on the ARM Cortex-M33 architecture, it offers advanced security features and performance, ideal for a variety of next-gen applications.

Minimum Operating Temperature: -40 °C

The ability to function in extreme low temperatures ensures reliable performance in harsh environments, making it suitable for automotive or outdoor applications.

ADC Channels: YES

Integrated ADC channels facilitate easy signal acquisition from sensors, enhancing the microcontroller's versatility in embedded applications.

DMA Channels: YES

Direct Memory Access support allows for efficient data transfer without burdening the CPU, significantly improving system performance.

Terminal Position: BOTTOM

Bottom terminal configuration simplifies heat dissipation and allows for more compact designs, improving overall product reliability.

ROM Words: 524288

With substantial ROM capacity, it supports complex applications and sufficient storage for necessary firmware and data.

Maximum Seated Height: 0.58 mm

The low seated height is ideal for low-profile designs, enabling miniaturization in end-products.

Digital To Analog Converters: 2-Ch 12-Bit

Providing 12-bit resolution, these DACs ensure high-quality analog output, suitable for precision control applications.

Width: 3.38 mm

Compact width allows integration into smaller circuit designs without sacrificing performance.

Boundary Scan: YES

Boundary scan capability supports testing and debugging of PCBs, enhancing manufacturing efficiency and product reliability.

Peripherals: BOR, COMPARATOR, DMA(20), RTC, TIMER(17), WDT(2)

A rich set of peripherals ensures the microcontroller can handle diverse application needs, from timing to watchdog functionalities, enhancing versatility.

Maximum Clock Frequency: 50 MHz

Operating at 50 MHz ensures adequate processing speed for most embedded applications, balancing performance with power efficiency.

Length: 3.38 mm

The short length complements its compact size, making it favorable for space-limited projects.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for high-performance operation while maintaining low power consumption, making it ideal for efficient embedded systems.

No. of Timers: 17

An abundance of timers enables complex scheduling and timing tasks, enhancing the microcontroller's functionality in real-time applications.

RAM Bytes: 278528

High RAM capacity supports demanding applications and multitasking, making it a robust choice for advanced embedded projects.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, essential for sustainable designs.

Terminal Form: BALL

Ball terminal form ensures reliable connections and enhances the overall robustness of the device in rugged applications.

Analog To Digital Converters: 12-Ch 14-Bit

Providing 14-bit resolution across 12 channels allows high-precision readings from multiple sensors simultaneously, ideal for complex monitoring tasks.

Maximum Supply Current: 20 mA

With a moderate maximum current rating, it supports effective power management while delivering sufficient performance for most applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is compatible with many low-power applications, promoting thoughtful design in battery-operated devices.

No. of DMA Channels: 20

Twenty DMA channels drastically enhance data handling capabilities, allowing for smooth and efficient data movement within systems.

No. of Serial I/Os: 4

Four serial I/O ports provide flexible communication options, enabling the microcontroller to interact efficiently with various peripherals and networks.

PWM Channels: YES

The inclusion of PWM channels enables fine control of devices such as motors and lights, adding to the application's scope.

Connectivity: FDCAN, I2C(4), LPUART, SAI, SPI(4), USART(2), USB

Rich connectivity options cater to a wide array of communication standards, ensuring seamless integration into various technical environments.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications, ensuring the microcontroller can adapt to changing application requirements.

Terminal Pitch: 0.35 mm

A fine terminal pitch supports high-density layouts, making it suitable for advanced compact applications.

Format: FLOATING POINT

Floating point format allows for complex mathematical calculations, improving the microcontroller's performance in computation-heavy tasks.

Speed: 160 rpm

Capable of operating at 160 rpm supports applications such as motor control and automation sequences, enhancing functionality.

Low Power Mode: YES

Low power mode features make this MCU ideal for battery-powered devices, extending operation time while maintaining functionality.

On Chip Program ROM Width: 8

An 8-bit program ROM width facilitates firmware storage for compact applications, ensuring efficient memory utilization.

No. of I/O Lines: 50

Fifty I/O lines offer extensive interfacing capabilities, allowing for complex interactions with multiple devices simultaneously.

Technical Specifications

Microcontrollers STM32U545JEY6QTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B72

Length:

3.38 mm

Low Power Mode:

YES

No. of DMA Channels:

20

No. of I/O Lines:

50

No. of Serial I/Os:

4

No. of Terminals:

72

No. of Timers:

17

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA72,9X16,14

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

278528

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.58 mm

Speed:

160 rpm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Width:

3.38 mm

Peripheral IC Type:

Connectivity:

FDCAN, I2C(4), LPUART, SAI, SPI(4), USART(2), USB

Peripherals:

BOR, COMPARATOR, DMA(20), RTC, TIMER(17), WDT(2)

Analog To Digital Convertors:

12-Ch 14-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32U545JEY6QTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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