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STM32L562QEI6P

STMicroelectronics

STM32L562QEI6P by STMicroelectronics

STM32L562QEI6P from STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 3.6V and operates at up to 48 MHz. It features ADC, DMA, and PWM channels, making it ideal for low-power applications in IoT devices. Its compact design includes a very thin profile grid array package with 132 terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 12,743 parts In-Stock

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Digiode

USA . 1,217 parts In-Stock

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Anansix

USA . 703 parts In-Stock

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Microchip USA

USA . 1,911 parts In-Stock

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$9.592

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AZTECH Wire

Italy . 302 parts In-Stock

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$21.120

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302

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IDEA Electronic Components Group

UK . 509 parts In-Stock

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$50.710

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MKK Technologies

India . 247 parts In-Stock

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$95.358

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DigiPath Technology Company

USA . 247 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 2,122 parts In-Stock

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Vigor

Singapore . 1,322 parts In-Stock

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Parana Technologies

USA . 980 parts In-Stock

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$60.632

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Overview

Unlock the potential of your next project with the STM32L562QEI6P microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics provides a powerful, energy-efficient solution ideal for wearable tech, IoT devices, and smart sensors. With advanced features that enable seamless connectivity and superior performance, this microcontroller empowers you to create cutting-edge applications while maximizing efficiency and reliability. Experience value like never before!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easier and more compact PCB designs, making this microcontroller ideal for modern electronic applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of battery-operated devices, enhancing energy efficiency.

Address Bus Width: 26

A 26-bit address bus width allows for a larger memory capacity, which is beneficial for data-intensive applications.

Package Shape: SQUARE

The square package shape optimizes space usage on PCBs and aids in efficient thermal management.

Bit Size: 32

With a 32-bit architecture, the microcontroller offers enhanced performance and can handle complex computations more effectively.

No. of Terminals: 132

A high number of terminals provides extensive connectivity options for peripherals and allows integration of advanced features.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This packaging style minimizes the overall footprint and allows for higher density designs, catering to space-constrained applications.

Minimum Supply Voltage: 1.71 V

Operating effectively at a minimum voltage of 1.71 V enables versatility in low-power designs, making it suitable for battery-powered systems.

ADC Channels: YES

The inclusion of ADC channels facilitates the conversion of analog signals to digital, enabling the microcontroller to interface with various sensors.

DMA Channels: YES

DMA support allows for efficient data transfer without CPU intervention, improving overall system performance and responsiveness.

Terminal Position: BOTTOM

Bottom terminal positioning can enhance thermal dissipation and provide better access for soldering in surface mount applications.

Width: 7 mm

With a compact width of 7 mm, this microcontroller is ideal for fitting into small electronic designs and portable devices.

External Data Bus Width: 16

A 16-bit external data bus width balances performance and compatibility, allowing efficient data handling for connected components.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures quick processing times, enabling smoother operation of applications requiring fast data handling.

Length: 7 mm

The 7 mm length further complements its compact design, providing flexibility in space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller optimizes command execution and increases the overall efficiency of the device in various applications.

Terminal Form: BALL

Ball terminal form provides excellent solderability and facilitates high-density mounting, crucial for advanced electronic systems.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V balances power consumption and performance, making it suitable for a broad range of applications.

PWM Channels: YES

Incorporation of PWM channels allows for precise control of motors and other actuators, enhancing its versatility in automation applications.

Terminal Pitch: 0.5 mm

A smaller terminal pitch of 0.5 mm allows for closer placement of components, which is crucial for high-density designs.

Speed: 110 rpm

The ability to operate up to 110 rpm makes it well-suited for applications requiring moderate-speed control, such as robotics and automation.

No. of I/O Lines: 115

With 115 I/O lines, this microcontroller provides extensive options for interfacing, enabling integration with multiple components and systems.

Technical Specifications

Microcontrollers STM32L562QEI6P attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

7 mm

No. of I/O Lines:

115

No. of Terminals:

132

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Speed:

110 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L562QEI6P Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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