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STM32L552MEY6QTR

STMicroelectronics

STM32L552MEY6QTR by STMicroelectronics

STM32L552MEY6QTR microcontroller from STMicroelectronics features a 32-bit Cortex-M33 CPU, operates at a max voltage of 3.6V, and includes 15 ADC channels. Ideal for low-power applications, it supports various connectivity options like I2C and UART. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$5.198

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 20,000 parts In-Stock

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Arrow

USA . 5,000 parts In-Stock

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$5.198

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$5.198

Verical

USA . 5,000 parts In-Stock

1+ parts

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$5.198

5,000

-

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$5.198

Chip1Stop

Japan . 5,000 parts In-Stock

1+ parts

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$5.760

5,000

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$5.760

Distributors (In-Stock)

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Vyrian

USA . 4,504 parts In-Stock

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4,504

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Digiode

USA . 2,294 parts In-Stock

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2,294

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Anansix

USA . 899 parts In-Stock

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899

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Distributors (Availability)

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Vigor

Singapore . 9,035 parts In-Stock

1+ parts

$5.170

100+ parts

-

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9,035

$5.170

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AZTECH Wire

Italy . 471 parts In-Stock

1+ parts

$14.730

100+ parts

-

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471

$14.730

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IDEA Electronic Components Group

UK . 2,195 parts In-Stock

1+ parts

$61.447

100+ parts

-

1k+ parts

$55.302

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2,195

$61.447

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$55.302

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MKK Technologies

India . 158 parts In-Stock

1+ parts

$115.547

100+ parts

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158

$115.547

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DigiPath Technology Company

USA . 158 parts In-Stock

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$115.547

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158

$115.547

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QUARKTWIN TECHNOLOGY LTD

USA . 15,937 parts In-Stock

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15,937

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Corphita

USA . 2,019 parts In-Stock

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2,019

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Parana Technologies

USA . 1,081 parts In-Stock

1+ parts

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$73.469

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1,081

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$73.469

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Overview

Elevate your designs with the STM32L552MEY6QTR microcontroller from STMicroelectronics, renowned for its exceptional quality and reliability. This advanced 32-bit MCU delivers superior performance while maintaining ultra-low power consumption, ideal for applications in IoT, wearables, and medical devices. Experience seamless integration and rich connectivity options that empower you to innovate faster and more efficiently, ensuring your projects stand out in a competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to various environmental factors, making the microcontroller suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache enhances data processing speed and overall performance, providing efficient execution of tasks.

Surface Mount: YES

The surface mount feature allows for compact designs, making the microcontroller ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is energy efficient, contributing to longer battery life in portable devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width supports efficient data manipulation, ideal for applications that handle simple data within the microcontroller.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various PCB layouts, optimizing design flexibility.

Bit Size: 32

The 32-bit architecture enables the microcontroller to handle more complex computations and larger data sets efficiently.

DAC Channels: YES

Integrated DAC channels facilitate analog output, allowing the microcontroller to interact smoothly with analog components.

No. of Terminals: 81

With 81 terminals, this microcontroller provides ample connectivity options for peripheral integration, enhancing functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array with a fine pitch enables high-density connections, optimizing the use of PCB space while maintaining performance.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage enhances compatibility with low-power applications and devices.

Maximum Operating Temperature: 85 °C

The capability to operate at a maximum temperature of 85 °C ensures reliability in high-temperature environments.

CPU Family: CORTEX-M33

Based on the Cortex-M33 architecture, this microcontroller offers high performance with low power consumption, making it perfect for IoT applications.

Minimum Operating Temperature: -40 °C

Operating as low as -40 °C, this microcontroller is suitable for extreme environments, enhancing its application range.

ADC Channels: YES

Having integrated ADC channels allows for precise analog signal conversion, crucial for sensor interface applications.

DMA Channels: YES

DMA support improves data transfer efficiency, allowing the CPU to focus on processing instead of handling data transfer tasks.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB design and promotes better thermal characteristics.

ROM Words: 524288

A substantial number of ROM words provides ample space for application code, supporting complex firmware implementations.

Maximum Seated Height: 0.59 mm

The low seated height allows for compact device designs, making the microcontroller suitable for sleek applications.

Digital To Analog Converters: 2 Ch 12-Bit

The inclusion of two 12-bit DACs ensures high-resolution analog output, essential for precision control applications.

Width: 4.07 mm

A compact width allows for space-efficient designs in various electronic devices without compromising on performance.

Boundary Scan: YES

Boundary scan capability assists in testing and debugging, enhancing product reliability and ease of development.

Peripherals: BOR, DMA(16), POR, RTC, TIMER(15), WDT(2)

A diverse range of peripherals increases functionality, enabling complex operations and interactions with various external systems.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides fast processing capabilities, allowing quicker execution of tasks.

Length: 4.36 mm

The small length supports a compact arrangement in multi-component systems, accommodating modern design standards.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it efficiently executes instructions, contributing to its overall speed and performance.

No. of Timers: 15

Fifteen timers provide numerous options for scheduling tasks and handling time-related functions in applications.

RAM Bytes: 262144

With 262,144 bytes of RAM, this microcontroller allows for extensive data handling during operation, supporting advanced applications.

Technology: CMOS

CMOS technology ensures low power consumption while retaining high speed, ideal for battery-powered devices.

Terminal Form: BALL

Ball-terminal form allows for high-density packaging, making it suitable for compact and portable electronic designs.

Analog To Digital Converters: 15-Ch 12-Bit

With 15 ADC channels, the microcontroller can interface with multiple sensors, making it versatile for data collection.

Maximum Supply Current: 32.2 mA

A maximum supply current of 32.2 mA balances performance and efficiency, suitable for high-performance applications while conserving energy.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V is optimal for low-power devices, extending battery life in portable applications.

No. of DMA Channels: 16

Having 16 DMA channels allows for strategic resource allocation, enhancing data handling capabilities.

No. of Serial I/Os: 7

Seven serial I/Os offer extensive communication avenues, facilitating integration with various peripherals.

PWM Channels: YES

PWM support is essential for motor control and signal modulation, adding versatility to the microcontroller.

Connectivity: FDCAN, I2C(4), LPUART, MMC, SAI(2), SD, SPI(3), UART(2), USART(3), USB

Diverse connectivity options ensure compatibility with a wide range of devices and peripherals, making it a flexible choice for various applications.

ROM Programmability: FLASH

Flash programmability allows for easy field updates and modifications, enhancing the microcontroller's usability over time.

Terminal Pitch: 0.4 mm

A 0.4 mm pitch promotes compact PCB designs while enabling high-density connections for reduced footprint.

Format: FLOATING-POINT

Floating-point format allows for complex mathematical computations, making the microcontroller suitable for applications requiring advanced calculations.

Speed: 110 rpm

A speed rating of 110 rpm indicates suitability for controlling devices such as motors, contributing to rotational speed precision.

Low Power Mode: YES

Low power mode functionality allows for significant energy savings in applications where power efficiency is critical.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient code execution while also maintaining simplicity in programming.

No. of I/O Lines: 51

Fifty-one I/O lines provide extensive interfacing capabilities for various sensors and modules, increasing application possibilities.

Technical Specifications

Microcontrollers STM32L552MEY6QTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B81

Length:

4.36 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

51

No. of Serial I/Os:

7

No. of Terminals:

81

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA81,9X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

262144

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.59 mm

Speed:

110 rpm

Maximum Supply Current:

32.2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.07 mm

Peripheral IC Type:

Connectivity:

FDCAN, I2C(4), LPUART, MMC, SAI(2), SD, SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, DMA(16), POR, RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

15-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L552MEY6QTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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