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STM32L552MEY6PTR

STMicroelectronics

STM32L552MEY6PTR by STMicroelectronics

STM32L552MEY6PTR microcontroller from STMicroelectronics features a 32-bit Cortex-M33 CPU, operates b/w 1.71V and 3.6V, and includes 16 ADC channels for precise data acquisition. Its low power mode makes it ideal for battery-operated devices. With integrated DMA and multiple connectivity options, it's perfect for IoT applications.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,822 parts In-Stock

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Anansix

USA . 851 parts In-Stock

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851

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Digiode

USA . 814 parts In-Stock

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814

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Distributors (Availability)

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Vigor

Singapore . 3,208 parts In-Stock

1+ parts

$5.170

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3,208

$5.170

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AZTECH Wire

Italy . 346 parts In-Stock

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$21.670

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346

$21.670

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IDEA Electronic Components Group

UK . 1,413 parts In-Stock

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$69.009

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$62.108

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1,413

$69.009

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$62.108

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Component Stockers USA

USA . 1,126 parts In-Stock

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$98.090

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1,126

$98.090

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MKK Technologies

India . 1,560 parts In-Stock

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$129.767

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1,560

$129.767

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DigiPath Technology Company

USA . 1,560 parts In-Stock

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$129.767

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1,560

$129.767

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Corphita

USA . 3,309 parts In-Stock

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3,309

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Parana Technologies

USA . 149 parts In-Stock

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$82.511

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149

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$82.511

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Overview

Elevate your projects with the STM32L552MEY6PTR, a premier microcontroller from STMicroelectronics that blends performance and efficiency seamlessly. Designed for energy-sensitive applications, it boasts a robust architecture and advanced connectivity options, making it ideal for IoT devices, wearable tech, and smart home solutions. Experience unparalleled reliability and support from a trusted leader in innovation, empowering you to create smarter, more efficient products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliability and protection for the microcontroller under various environmental conditions.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, allowing for quicker access to frequently used data.

Surface Mount: YES

Surface mounting allows for a smaller footprint on the PCB, enabling compact designs in modern applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V makes it suitable for various applications without the risk of damage from high voltage.

On Chip Data RAM Width: 8

An 8-bit data RAM width facilitates efficient data handling for certain applications, particularly in resource-constrained environments.

Package Shape: RECTANGULAR

The rectangular package shape supports efficient layout on PCBs and aligns well with common design practices.

Bit Size: 32

A 32-bit architecture enables the microcontroller to handle more complex computations and larger data types effectively.

DAC Channels: YES

Integrated DAC channels allow for analog output generation, making it a versatile option for applications requiring variable signal output.

Number of Terminals: 81

A higher number of terminals (81) provides ample I/O options, making the microcontroller suitable for complex applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch grid array allows for high-density connections while maintaining a thin profile, essential for space-constrained designs.

Minimum Supply Voltage: 1.71 V

This low minimum supply voltage makes it ideal for battery-powered applications and helps in energy efficiency.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures performance in warm environments, adding to its versatility for various applications.

CPU Family: CORTEX-M33

The Cortex-M33 CPU family provides advanced features and performance, making it suited for numerous applications including IoT.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C enhances reliability in extreme conditions, making it suitable for industrial applications.

ADC Channels: YES

Integrated ADC channels enable data acquisition from sensors, expanding the microcontroller's application range in automated systems.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal positions facilitate easier soldering and assembly in compact PCB designs.

ROM Words: 524288

With 524288 words of ROM, there is ample space for storing firmware and application code, enhancing functionality.

Maximum Seated Height: 0.59 mm

A low seated height helps maintain a slim design profile, suitable for modern compact consumer electronics.

Digital To Analog Converters: 2 Ch 12-Bit

The presence of 12-bit DACs offers high-resolution analog output suitable for audio and precise control applications.

Width: 4.07 mm

With a width of 4.07 mm, the microcontroller is compact enough for space-limited designs.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes in PCB manufacturing, reducing time and costs.

Peripherals: BOR, DMA(16), POR, RTC, TIMER(15), WDT(2)

A rich selection of peripherals enhances functionality and gives flexibility for various applications, from real-time control to monitoring.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides a good balance of performance for most microcontroller applications without excessive power consumption.

Length: 4.36 mm

The length of 4.36 mm makes it suitable for space-constrained designs, enabling integration into smaller devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers high performance and efficiency in executing instructions, suitable for various applications.

Number of Timers: 15

Fifteen timers provide a variety of timing functions for complex applications such as robotics or industrial control.

RAM Bytes: 262144

With 262144 bytes of RAM, it can handle multiple tasks and buffers efficiently, crucial for responsive applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminals provide a robust connection and support effective heat dissipation, enhancing reliability.

Analog To Digital Converters: 16-Ch 12-Bit

With 16 channels of 12-bit ADC, this microcontroller can interface with multiple sensors, expanding its utility in data acquisition systems.

Maximum Supply Current: 32.2 mA

A maximum supply current of 32.2 mA balances power consumption and performance, suitable for a wide range of applications.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V is optimal for low-power designs, particularly beneficial in portable electronics.

Number of DMA Channels: 16

With 16 DMA channels available, it significantly improves data handling efficiency in multi-tasking environments.

Number of Serial I/Os: 7

Seven serial I/O interfaces enable various communication protocols, enhancing connectivity options for diverse applications.

PWM Channels: YES

PWM channels allow for features like motor control and signal modulation, adding versatility to its applications.

Connectivity: FDCAN, I2C(4), LPUART, MMC, SAI(2), SD, SPI(3), UART(2), USART(3), USB

With extensive connectivity options, this microcontroller is well-suited for embedded systems requiring interaction with different devices.

ROM Programmability: FLASH

FLASH programmability allows users to update the firmware easily, extending the product's lifecycle and functionality.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for high-density layout and connection options in compact PCB designs.

Format: FLOATING-POINT

The support for floating-point operations allows for handling complex numerical calculations effectively, useful in various applications.

Speed: 110 rpm

With a speed of 110 rpm, the microcontroller may be optimized for specific actuators or motors in control applications.

Low Power Mode: YES

The low power mode feature enhances energy conservation, making it ideal for battery-operated systems.

On Chip Program ROM Width: 8

An 8-bit ROM width permits efficient code execution, improving the overall performance of the microcontroller.

Number of I/O Lines: 54

Having 54 I/O lines offers versatile interfacing capabilities, enabling complex designs and functionality.

Technical Specifications

Microcontrollers STM32L552MEY6PTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B81

Length:

4.36 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

54

No. of Serial I/Os:

7

No. of Terminals:

81

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA81,9X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

262144

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.59 mm

Speed:

110 rpm

Maximum Supply Current:

32.2 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.07 mm

Peripheral IC Type:

Connectivity:

FDCAN, I2C(4), LPUART, MMC, SAI(2), SD, SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, DMA(16), POR, RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L552MEY6PTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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