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STM32L552CET6Q

STMicroelectronics

STM32L552CET6Q by STMicroelectronics

STM32L552CET6Q by STMicroelectronics is a 32-bit microcontroller with Cortex-M33 CPU family, featuring 48 MHz clock frequency and 393216 bytes of RAM. With CAN, I2C, UART, USB connectivity options, it's ideal for low-power applications requiring high-speed processing and extensive peripheral support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,416 parts In-Stock

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-

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12,416

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Digiode

USA . 3,967 parts In-Stock

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3,967

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Anansix

USA . 1,256 parts In-Stock

1+ parts

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1,256

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Nova Conductors

Japan . 550 parts In-Stock

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-

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550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 445 parts In-Stock

1+ parts

$15.000

100+ parts

-

1k+ parts

-

10k+ parts

-

445

$15.000

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-

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AZTECH Wire

Italy . 365 parts In-Stock

1+ parts

$15.350

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-

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-

365

$15.350

-

-

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Semicontronic

India . 1,585 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

1k+ parts

$32.980

10k+ parts

-

1,585

$34.000

$33.150

$32.980

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IDEA Electronic Components Group

UK . 289 parts In-Stock

1+ parts

$34.982

100+ parts

-

1k+ parts

$31.484

10k+ parts

-

289

$34.982

-

$31.484

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Microchip USA

USA . 387 parts In-Stock

1+ parts

$42.612

100+ parts

-

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387

$42.612

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MKK Technologies

India . 1,811 parts In-Stock

1+ parts

$65.782

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-

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1,811

$65.782

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DigiPath Technology Company

USA . 1,811 parts In-Stock

1+ parts

$65.782

100+ parts

-

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-

1,811

$65.782

-

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$66.773

100+ parts

$63.434

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$63.434

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-

2,500

$66.773

$63.434

$63.434

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Aztec Data Supply Inc.

USA . 341 parts In-Stock

1+ parts

$74.240

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341

$74.240

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Corohmni

South Africa . 290 parts In-Stock

1+ parts

$79.502

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290

$79.502

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QUARKTWIN TECHNOLOGY LTD

USA . 25,449 parts In-Stock

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25,449

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Argo Parts USA

USA . 4,703 parts In-Stock

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Continental Prestige Electronics

USA . 2,911 parts In-Stock

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2,911

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,072 parts In-Stock

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1,072

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Parana Technologies

USA . 626 parts In-Stock

1+ parts

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$41.826

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626

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$41.826

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Bastille Electronics

Australia . 54 parts In-Stock

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54

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Overview

Unlock the potential of your next project with the STM32L552CET6Q microcontroller by STMicroelectronics. Designed with cutting-edge technology and unparalleled precision, this device offers a wide range of applications in various industries. With its advanced features, low power consumption, and high-performance capabilities, the STM32L552CET6Q provides exceptional value and benefits to customers looking for reliable and efficient solutions. Trust in the quality and expertise of STMicroelectronics to deliver a superior product that exceeds expectations. Upgrade your designs today with the STM32L552CET6Q and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-efficiency, making the product suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache helps improve the processing speed and efficiency of the microcontroller, making it a good choice for performance-critical tasks.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a variety of systems.

On Chip Data RAM Width: 8

The wide data RAM width enables the microcontroller to handle large amounts of data simultaneously, enhancing its capabilities in data-intensive applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style provides a compact and low-profile design, making it suitable for space-constrained applications while also allowing for easy integration into existing circuit designs.

CPU Family: CORTEX-M33

Being part of the Cortex-M33 CPU family ensures compatibility with a well-established and widely supported architecture, making it easier for developers to work with the microcontroller.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to accurately convert analog signals to digital data, enabling it to interface with a wide range of sensors and peripherals.

No. of External Interrupts: 43

A high number of external interrupts provide the microcontroller with the ability to respond quickly to external events and prioritize tasks efficiently, making it suitable for real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the peripheral IC type ensures streamlined and efficient operation, improving the overall performance and responsiveness of the microcontroller.

ROM Programmability: FLASH

The ROM programmability via Flash memory allows for easy and convenient firmware updates and modifications, enhancing the versatility of the microcontroller for different applications.

Technical Specifications

Microcontrollers STM32L552CET6Q attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

43

No. of I/O Lines:

36

No. of Serial I/Os:

9

No. of Terminals:

48

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

393216

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

110 rpm

Maximum Supply Current:

31.38 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, SAI(2), SPI(3), UART(4), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

9-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L552CET6Q Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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