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STM32L552CET6P

STMicroelectronics

STM32L552CET6P by STMicroelectronics

STM32L552CET6P by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max clock frequency of 48 MHz. It is commonly used in applications requiring low power consumption, such as IoT devices and battery-powered systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,404 parts In-Stock

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6,404

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Digiode

USA . 4,663 parts In-Stock

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Anansix

USA . 986 parts In-Stock

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Nova Conductors

Japan . 97 parts In-Stock

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Semicontronic

India . 1,198 parts In-Stock

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$3.000

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$2.925

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$2.910

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1,198

$3.000

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$2.910

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Vigor

Singapore . 1,411 parts In-Stock

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$5.240

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AZTECH Wire

Italy . 709 parts In-Stock

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$8.041

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709

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Microchip USA

USA . 3,186 parts In-Stock

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$17.569

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Ampacity Inc.

Singapore . 1,133 parts In-Stock

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$33.000

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$33.000

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IDEA Electronic Components Group

UK . 866 parts In-Stock

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$33.916

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$30.524

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$33.916

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MKK Technologies

India . 716 parts In-Stock

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$63.776

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DigiPath Technology Company

USA . 716 parts In-Stock

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Aztec Data Supply Inc.

USA . 109 parts In-Stock

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$85.412

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$81.141

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200

$85.412

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Corohmni

South Africa . 8 parts In-Stock

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$85.777

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Continental Prestige Electronics

USA . 5,765 parts In-Stock

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Corphita

USA . 3,903 parts In-Stock

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Argo Parts USA

USA . 3,372 parts In-Stock

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Parana Technologies

USA . 1,174 parts In-Stock

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$40.552

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$40.552

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Bastille Electronics

Australia . 79 parts In-Stock

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Overview

Experience the quality and innovation of STMicroelectronics with the STM32L552CET6P microcontroller. Designed for a wide range of applications, this powerful device offers customers unmatched value and benefits. With integrated cache and low power mode, it guarantees efficient performance and extended battery life. Whether you need precise data conversion with its ADC channels or reliable connectivity through CAN, I2C, UART, and USB, the STM32L552CET6P has you covered. Trust in the industry-leading manufacturer and unlock endless possibilities with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material enhances the product's durability and allows for easier handling and installation.

Integrated Cache: YES

The integrated cache improves the product's performance by providing faster access to frequently used data.

Surface Mount: YES

The surface mount capability allows for easier and more efficient PCB assembly, making this product suitable for compact and space-constrained applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage enables the product to handle a wide range of power supply conditions, ensuring reliable operation.

On Chip Data RAM Width: 8

The wide on-chip data RAM width allows for efficient data processing and storage, enhancing the product's overall performance.

Package Shape: SQUARE

The square package shape facilitates easier PCB layout and integration, making it convenient for designers during product development.

Bit Size: 32

With a 32-bit architecture, this product offers enhanced computational capabilities, allowing for more complex operations and faster data processing.

DAC Channels: YES

The presence of DAC channels enables the product to generate high-resolution analog signals, making it suitable for applications that require precise analog outputs.

No. of Terminals: 48

The large number of terminals allows for versatile connectivity options, enabling the product to interface with various external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact form factor, low profile, and fine pitch, making the product suitable for small and space-limited designs.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage enables the product to operate in power-constrained environments, enhancing its flexibility for diverse applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions, ensuring robust performance in challenging situations.

CPU Family: CORTEX-M33

The Cortex-M33 CPU family offers efficient processing capabilities, enabling the product to handle complex tasks while maintaining low power consumption.

No. of External Interrupts: 43

The abundant number of external interrupts provides flexibility for interrupt-driven operations, enhancing the product's ability to respond to real-time events.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions, making the product suitable for various environments.

ADC Channels: YES

The availability of ADC channels enables the product to convert analog signals into digital data, making it suitable for applications that require precise analog-to-digital conversion.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer between peripherals and memory, reducing the CPU's workload and enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position provides convenient and versatile mounting options, facilitating easy integration into different PCB layouts.

ROM Words: 524288

With a large ROM capacity, this product can store a significant amount of program code, allowing for complex application development while maintaining speed and performance.

Maximum Seated Height: 1.6 mm

The low maximum seated height offers compatibility with space-constrained designs, making the product suitable for compact electronic devices.

Digital To Analog Convertors: 2-Ch 12-Bit

The 2-channel 12-bit digital-to-analog converters enable the product to generate accurate and high-resolution analog signals, essential for applications such as audio and sensory systems.

Width: 7 mm

With a compact width dimension, this product can fit into small form factor designs, optimizing space utilization in electronic systems.

Boundary Scan: YES

The presence of boundary scan capability simplifies testing and debugging during product development, enhancing the ease of integration and overall reliability.

Peripherals: BOR, COMPARATOR(2), RTC, TIMER(15), WDT(2)

The variety of built-in peripherals, including brown-out reset, comparators, real-time clock, timers, and watchdog timers, offer extensive functionality and flexibility for different application requirements.

Maximum Clock Frequency: 48 MHz

With a high maximum clock frequency, this product can execute instructions at a rapid rate, enabling efficient real-time processing and response.

Length: 7 mm

The compact length dimension allows for easy integration into space-constrained designs, providing flexibility in product development.

Peripheral IC Type: MICROCONTROLLER, RISC

This product's peripheral IC type, being a microcontroller with a Reduced Instruction Set Computing (RISC) architecture, ensures efficient instruction execution and low power consumption.

No. of Timers: 15

The ample number of timers allows for precise timing operations and event scheduling, making the product suitable for applications requiring accurate timekeeping or event management.

RAM Bytes: 393216

With a generous amount of RAM, this product can efficiently store and manipulate data during program execution, facilitating high-performance computing and data processing tasks.

Technology: CMOS

The Complementary Metal-Oxide-Semiconductor (CMOS) technology used in this product ensures low power consumption, enabling energy-efficient operation and longer battery life.

Terminal Form: GULL WING

The gull-wing terminal form simplifies PCB assembly processes and ensures secure solder connections, enhancing the product's durability and reliability.

Analog To Digital Convertors: 9-Ch 12-Bit

The 9-channel 12-bit analog-to-digital converters enable the product to capture and digitize multiple analog signals simultaneously with high precision.

Maximum Supply Current: 31.38 mA

The low maximum supply current ensures efficient power usage, contributing to the product's energy efficiency and reducing overall system operating costs.

Nominal Supply Voltage: 3 V

The nominal supply voltage provides stable and reliable power distribution, ensuring consistent and accurate performance of the product across various operating conditions.

No. of DMA Channels: 14

The abundance of DMA channels allows for efficient data transfer and offloading of the CPU, providing a performance boost and freeing up computational resources.

No. of Serial I/Os: 9

The multiple serial input/output ports provide versatile connectivity options for external devices, enabling seamless communication and integration with a variety of peripherals.

PWM Channels: YES

The availability of pulse-width modulation (PWM) channels allows for precise control of analog signals, facilitating applications such as motor speed control and LED dimming.

Connectivity: CAN, I2C(4), LPUART, SAI(2), SPI(3), UART(4), USART(3), USB

The wide range of connectivity options, including CAN, I2C, LPUART, SAI, SPI, UART, USART, and USB, enables seamless integration with diverse communication protocols and peripherals.

ROM Programmability: FLASH

The availability of flash ROM programmability allows for flexibility in firmware updates, ensuring easy maintenance and future-proofing of the product.

Terminal Pitch: 0.5 mm

The narrow terminal pitch facilitates miniaturized PCB designs, enabling the product to be used in compact consumer electronics and handheld devices.

Format: FLOATING POINT

The floating-point format supports high-precision mathematical calculations, making the product suitable for applications involving complex computations.

Speed: 110 rpm

With a high speed rating of 110 revolutions per minute (rpm), this product is capable of rapidly performing tasks, enhancing its efficiency and responsiveness.

Low Power Mode: YES

The availability of a low power mode allows for energy-saving operation, prolonging battery life and making the product suitable for portable and battery-powered devices.

On Chip Program ROM Width: 8

The wide on-chip program ROM width allows for efficient storage and execution of program instructions, enhancing the product's performance and versatility.

No. of I/O Lines: 36

The large number of I/O lines provides extensive connectivity options for interfacing with external devices, allowing for versatile input and output configurations.

Technical Specifications

Microcontrollers STM32L552CET6P attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

43

No. of I/O Lines:

36

No. of Serial I/Os:

9

No. of Terminals:

48

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

393216

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

110 rpm

Maximum Supply Current:

31.38 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), LPUART, SAI(2), SPI(3), UART(4), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

9-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L552CET6P Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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