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STM32L4R9AGI6

STMicroelectronics

STM32L4R9AGI6 by STMicroelectronics

STM32L4R9AGI6 by STMicroelectronics is a 32-bit microcontroller with 1048576 ROM words and 655360 RAM bytes. It features 14-Ch 12-Bit ADC, 2-Ch 12-Bit DAC, and peripherals like RTC, TIMER(14), and USB. Ideal for industrial applications requiring high-speed processing up to 48 MHz.

Median Price

$14.615

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$14.615

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100

$14.615

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Vyrian

USA . 5,552 parts In-Stock

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5,552

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Anansix

USA . 2,045 parts In-Stock

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2,045

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Digiode

USA . 1,343 parts In-Stock

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1,343

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Distributors (Availability)

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AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$10.122

100+ parts

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472

$10.122

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Continental Prestige Electronics

USA . 1,450 parts In-Stock

1+ parts

$14.615

100+ parts

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$14.322

1,450

$14.615

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-

$14.322

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$14.615

100+ parts

$14.322

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1,000

$14.615

$14.322

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Corohmni

South Africa . 353 parts In-Stock

1+ parts

$15.000

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353

$15.000

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Vigor

Singapore . 152 parts In-Stock

1+ parts

$15.460

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152

$15.460

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$17.052

100+ parts

$15.688

1k+ parts

$14.700

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-

900

$17.052

$15.688

$14.700

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Semicontronic

India . 993 parts In-Stock

1+ parts

$18.000

100+ parts

$17.550

1k+ parts

$17.460

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-

993

$18.000

$17.550

$17.460

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Ampacity Inc.

Singapore . 1,243 parts In-Stock

1+ parts

$31.000

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1,243

$31.000

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Aztec Data Supply Inc.

USA . 241 parts In-Stock

1+ parts

$39.590

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241

$39.590

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IDEA Electronic Components Group

UK . 1,369 parts In-Stock

1+ parts

$45.488

100+ parts

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$40.939

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1,369

$45.488

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$40.939

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Microchip USA

USA . 1,663 parts In-Stock

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$55.440

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1,663

$55.440

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MKK Technologies

India . 1,366 parts In-Stock

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$85.536

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1,366

$85.536

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DigiPath Technology Company

USA . 1,366 parts In-Stock

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$85.536

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1,366

$85.536

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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iodParts Technologies Inc.

India . 4,500 parts In-Stock

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4,500

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Argo Parts USA

USA . 4,108 parts In-Stock

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4,108

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Corphita

USA . 3,732 parts In-Stock

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3,732

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RC Electronics

USA . 2,258 parts In-Stock

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2,258

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Parana Technologies

USA . 997 parts In-Stock

1+ parts

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100+ parts

$54.387

1k+ parts

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997

-

$54.387

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Overview

Unlock the power of cutting-edge technology with the STM32L4R9AGI6 microcontroller by STMicroelectronics. Designed to deliver unmatched performance and reliability, this advanced device offers a wide range of applications in various industries. With its innovative features and state-of-the-art design, customers can expect seamless integration, enhanced efficiency, and superior functionality. Experience the next level of productivity and precision with the STM32L4R9AGI6 - the ultimate solution for your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making the product suitable for various environments.

Surface Mount: YES

This feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.4 V

With a high maximum supply voltage, this product can handle power fluctuations without risking damage.

Address Bus Width: 25

The wide address bus width enables efficient data transfer and processing, improving overall performance.

Package Shape: SQUARE

The square shape of the package allows for space-saving design and easy integration into compact electronic devices.

Bit Size: 32

A 32-bit architecture provides enhanced processing capabilities, allowing for complex tasks to be completed efficiently.

DAC Channels: YES

The inclusion of DAC channels offers the ability to convert digital signals into analog output, expanding the product's functionality.

No. of Terminals: 169

With a high number of terminals, this product offers versatile connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style provides excellent electrical performance and thermal management in a compact form factor.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures efficient power consumption, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

ADC Channels: YES

The presence of ADC channels allows for accurate analog-to-digital signal conversion, increasing the product's versatility.

DMA Channels: YES

DMA channels enable direct memory access for efficient data transfer, enhancing the product's overall speed and performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connection to external components, ensuring stable operation.

ROM Words: 1048576

The large ROM capacity provides ample storage for program instructions, allowing for versatile application development.

Maximum Seated Height: 0.6 mm

The low maximum seated height allows for slim and compact device designs, ideal for space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

The dual-channel 12-bit DACs provide high-resolution analog output, suitable for precision control and signal processing.

Width: 7 mm

The compact width of the product facilitates easy integration into tight spaces, making it suitable for small form-factor applications.

External Data Bus Width: 16

A wide external data bus width enables fast and efficient data communication between the microcontroller and external devices.

Peripherals: BOR, COMPARATOR(2), DMA(14), LCD, RTC, TIMER(14), WDT(2)

The diverse range of peripherals enhances the product's functionality and compatibility with a variety of applications.

Maximum Clock Frequency: 48 MHz

With a high maximum clock frequency, this product can execute instructions quickly, improving overall performance.

Length: 7 mm

The short length of the product allows for flexible placement on circuit boards, optimizing space utilization in electronic designs.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this product can withstand rugged conditions and operate reliably in high-temperature settings.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller features a RISC architecture, offering efficient instruction execution and enhanced processing capabilities.

RAM Bytes: 655360

The large RAM capacity enables efficient data storage and retrieval, facilitating multitasking and complex computations.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, improving overall reliability.

Terminal Form: BALL

The ball terminal form provides secure electrical connections and simplifies soldering during assembly, ensuring reliable performance.

Analog To Digital Convertors: 14-Ch 12-Bit

The 14-channel 12-bit ADCs offer high-precision analog signal conversion, suitable for a wide range of sensor applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures stable and reliable operation, preventing overvoltage issues and extending product lifespan.

PWM Channels: YES

The presence of PWM channels enables precise control of digital signals, making the product ideal for motor control and power management.

Connectivity: CAN, I2C(4), SAI(2), SPI(5), UART(3), USART(3), USB

The variety of connectivity options allows for seamless integration with different devices and communication protocols.

ROM Programmability: FLASH

The Flash programmable ROM enables firmware updates and reprogramming without the need for specialized equipment, increasing flexibility.

Terminal Pitch: 0.5 mm

The small terminal pitch facilitates high-density mounting on circuit boards, optimizing space utilization in densely populated designs.

Speed: 120 rpm

With a speed of 120 rpm, this microcontroller can execute instructions quickly, improving overall system responsiveness.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width allows for efficient storage and retrieval of program instructions, enhancing performance.

No. of I/O Lines: 131

With 131 I/O lines, this product offers ample interfacing options for connecting to external devices, enhancing versatility and flexibility.

Technical Specifications

Microcontrollers STM32L4R9AGI6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES IN THE RANGE OF 1.71V TO 3.6V

Address Bus Width:

25

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

No. of I/O Lines:

131

No. of Terminals:

169

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

655360

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.4 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), SAI(2), SPI(5), UART(3), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), LCD, RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L4R9AGI6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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