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STM32L4R5QGI6TR

STMicroelectronics

STM32L4R5QGI6TR by STMicroelectronics

STM32L4R5QGI6TR microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and supports up to 110 I/O lines. Its applications include low-power devices with ADC and PWM capabilities. Ideal for compact designs due to its thin profile and grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,010 parts In-Stock

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4,010

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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2,500

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ComSIT USA

USA . 2,500 parts In-Stock

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2,500

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Anansix

USA . 2,460 parts In-Stock

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2,460

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Digiode

USA . 1,543 parts In-Stock

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1,543

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Distributors (Availability)

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Vigor

Singapore . 3,750 parts In-Stock

1+ parts

$9.380

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3,750

$9.380

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AZTECH Wire

Italy . 1,010 parts In-Stock

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$16.730

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$16.730

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Microchip USA

USA . 4,507 parts In-Stock

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$31.453

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4,507

$31.453

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IDEA Electronic Components Group

UK . 786 parts In-Stock

1+ parts

$50.140

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$45.126

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786

$50.140

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$45.126

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MKK Technologies

India . 22 parts In-Stock

1+ parts

$94.285

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22

$94.285

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DigiPath Technology Company

USA . 22 parts In-Stock

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$94.285

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22

$94.285

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 721 parts In-Stock

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$59.950

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721

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$59.950

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Corphita

USA . 372 parts In-Stock

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372

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Overview

Unlock the full potential of your designs with the STM32L4R5QGI6TR microcontroller from STMicroelectronics! Renowned for their uncompromising quality and innovation, STMicroelectronics empowers your applications with exceptional performance, energy efficiency, and versatility. Perfect for IoT devices, wearables, and industrial automation, this compact powerhouse delivers seamless connectivity and advanced processing capabilities, ensuring your projects thrive in any environment. Experience reliability and cutting-edge technology that elevate your creations to new heights!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact PCB layouts, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with low-power applications, enhancing energy efficiency.

Address Bus Width: 26

A wider address bus width enables addressing of more memory, facilitating complex applications that require significant data processing.

Package Shape: SQUARE

The square package shape provides efficient space utilization on the PCB, making it suitable for high-density applications.

Bit Size: 32

A 32-bit architecture allows for increased processing power and efficiency, enabling the handling of more complex tasks.

No. of Terminals: 132

With 132 terminals, this microcontroller offers ample connectivity options for various peripherals and sensors, enhancing system flexibility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and thin profile package style provide better thermal performance and signal integrity for high-speed applications.

Minimum Supply Voltage: 1.71 V

A minimum supply voltage of 1.71V allows for operation in battery-powered devices, increasing battery life and efficiency.

ADC Channels: YES

Integrated ADC channels allow for real-time analog signal processing, making it suitable for sensor-driven applications.

DMA Channels: YES

DMA capabilities provide high-speed data transfer without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal positioning ensures efficient heatsinking and compact assembly, optimizing thermal management.

Width: 7 mm

A compact width of 7mm is suitable for space-sensitive applications and enhances the overall design flexibility.

External Data Bus Width: 16

A 16-bit external data bus width enables efficient data transfer with peripherals, enhancing overall system throughput.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures fast processing speeds, allowing for responsive and efficient operation in applications.

Length: 7 mm

The 7mm length contributes to the compact form factor, ideal for space-constrained devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, improving performance while minimizing power consumption.

Terminal Form: BALL

Ball terminal form allows for better solder joint integrity and is well-suited for reflow soldering processes.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V optimizes power usage, making it suitable for modern electronic devices.

PWM Channels: YES

Pulse-width modulation channels enable precise control of motors and other actuators, making it versatile for robotics and automation.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for more compact designs, facilitating higher circuit density on PCBs.

Speed: 120 rpm

The capability to operate efficiently at speeds of 120 rpm lends itself well to motor control applications.

No. of I/O Lines: 110

Having 110 I/O lines provides extensive connectivity options, allowing for integration with multiple sensors and devices.

Technical Specifications

Microcontrollers STM32L4R5QGI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

7 mm

No. of I/O Lines:

110

No. of Terminals:

132

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

120 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L4R5QGI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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