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STM32L4Q5VGY6PTR

STMicroelectronics

STM32L4Q5VGY6PTR by STMicroelectronics

STM32L4Q5VGY6PTR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. Ideal for low-power applications, it supports various connectivity options like CAN and I2C. Its compact design makes it suitable for space-constrained environments.

Median Price

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3

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1k+

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Vyrian

USA . 2,184 parts In-Stock

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Anansix

USA . 2,089 parts In-Stock

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Digiode

USA . 271 parts In-Stock

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AZTECH Wire

Italy . 621 parts In-Stock

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$10.920

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621

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Microchip USA

USA . 8,030 parts In-Stock

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$26.062

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IDEA Electronic Components Group

UK . 1,033 parts In-Stock

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$57.803

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$52.022

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MKK Technologies

India . 1,649 parts In-Stock

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$108.694

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DigiPath Technology Company

USA . 1,649 parts In-Stock

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$108.694

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QUARKTWIN TECHNOLOGY LTD

USA . 26,365 parts In-Stock

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Authorized Procurement Solutions

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Vigor

Singapore . 1,716 parts In-Stock

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Parana Technologies

USA . 833 parts In-Stock

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Corphita

USA . 170 parts In-Stock

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Overview

Unlock the future of innovation with the STM32L4Q5VGY6PTR microcontroller from STMicroelectronics, a trusted leader in semiconductor solutions. This cutting-edge device offers unmatched performance and energy efficiency, making it perfect for diverse applications like IoT devices, wearables, and industrial automation. Experience seamless connectivity, powerful processing, and low power consumption—all essential for your next breakthrough project. Elevate your designs and drive success with STMicroelectronics' commitment to quality and reliability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides good protection against environmental factors.

Integrated Cache: YES

Integrated cache improves access times and overall processor performance, making it suitable for demanding applications.

Surface Mount: YES

Surface mount technology allows for a compact design, which is essential for modern electronic devices.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications while providing stability and reliability in power-sensitive environments.

On Chip Data RAM Width: 8

An 8-bit data RAM width optimizes memory usage for specific applications, enabling efficient processing.

Address Bus Width: 5

A 5-bit address bus width allows for expanded addressable memory capabilities in microcontroller applications.

Package Shape: RECTANGULAR

The rectangular shape is standard and facilitates easier integration into various designs.

Bit Size: 32

Being a 32-bit microcontroller, it allows for enhanced performance and the ability to handle complex computations.

DAC Channels: YES

Having digital-to-analog converters (DACs) enables accurate output of analog signals for real-world interfacing.

No. of Terminals: 100

A larger number of terminals increases connectivity options with peripherals and other devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This style ensures optimal space utilization and facilitates high-density designs.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage enhances efficiency and is ideal for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can operate reliably in demanding environments.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family provides advanced performance and energy efficiency for embedded systems.

No. of External Interrupts: 16

A good number of external interrupts allows for responsive applications that can react quickly to events.

Minimum Operating Temperature: -40 °C

It can operate in extreme environments, making it suitable for automotive and industrial applications.

ADC Channels: YES

Having analog-to-digital converters (ADCs) allows for effective signal digitization from the real world.

DMA Channels: YES

Direct memory access (DMA) channels enable efficient data transfers without burdening the CPU.

Terminal Position: BOTTOM

Bottom terminal position allows for better thermal performance and signal integrity in compact designs.

ROM Words: 1048576

A large ROM size supports complex applications requiring substantial firmware.

Maximum Seated Height: 0.58 mm

A low height allows for a slim profile, making it suitable for space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

The availability of 12-bit resolution ensures high-quality analog outputs for audio and control applications.

Width: 4.437 mm

A narrow width allows for placement in compact designs and tight spaces.

Boundary Scan: YES

Boundary scan support simplifies debugging and testing, enhancing reliability during development.

External Data Bus Width: 16

A 16-bit external data bus width aids in fast data transfers, enhancing overall system performance.

Peripherals: BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

A rich set of peripherals increases the versatility of this microcontroller for different applications.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures satisfactory performance for real-time applications.

Length: 4.456 mm

A compact length makes it easy to integrate into various size-constrained hardware designs.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture ensures efficient processing and lower power consumption.

No. of Timers: 14

The presence of many timers allows for precise timing control in various applications.

RAM Bytes: 327808

Ample RAM provides sufficient memory for complex algorithms and data handling.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it ideal for portable devices.

Terminal Form: BALL

The ball terminal form factor allows for better thermal management and efficient electrical performance.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple 12-bit ADCs facilitate high-precision measurements in applications like sensing and control.

Maximum Supply Current: 100 mA

A maximum supply current of 100 mA offers a balance between performance and power efficiency.

Nominal Supply Voltage: 2 V

A nominal supply voltage of 2 V optimizes power usage in energy-sensitive applications.

No. of DMA Channels: 14

Multiple DMA channels enable efficient data handling, freeing CPU resources for other processes.

No. of Serial I/Os: 7

Having multiple serial I/O lines supports various communication protocols, enhancing connectivity options.

PWM Channels: YES

Presence of PWM channels allows for extensive control in motor drivers and other applications.

Connectivity: CAN, I2C(4), LPUART, SAI(2), SDMMC, SPI(3), UART(2), USART(3), USB

Rich connectivity options improve interoperability with other devices and systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware without hardware changes.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch is optimal for high-density applications while ensuring signal integrity.

Format: FLOATING-POINT

The floating-point format allows for processing of complex mathematical operations more efficiently.

Speed: 120 rpm

A speed rating of 120 rpm indicates capability in dynamic applications like motor control.

Low Power Mode: YES

The presence of a low-power mode enhances battery life for portable and energy-sensitive applications.

On Chip Program ROM Width: 8

An 8-bit ROM width is sufficient for handling necessary program instructions in many applications.

No. of I/O Lines: 79

A high number of I/O lines provides significant interfacing capabilities, accommodating diverse applications.

Technical Specifications

Microcontrollers STM32L4Q5VGY6PTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

5

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B100

Length:

4.456 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

79

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

327808

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.58 mm

Speed:

120 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

4.437 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(4), LPUART, SAI(2), SDMMC, SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L4Q5VGY6PTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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