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STM32L4A6AGI6TR

STMicroelectronics

STM32L4A6AGI6TR by STMicroelectronics

STM32L4A6AGI6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 85 °C, and supports up to 48 MHz clock speed. It includes integrated DAC and ADC channels for versatile applications. Ideal for low-power industrial devices, it offers extensive connectivity options.

Median Price

$6.721

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 1,425,000 parts In-Stock

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Avnet

USA . 5,000 parts In-Stock

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Verical

USA . 5,000 parts In-Stock

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$6.721

5,000

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$6.721

Distributors (In-Stock)

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TME

Poland . 5,000 parts In-Stock

1+ parts

-

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$9.060

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$9.060

Digiode

USA . 4,980 parts In-Stock

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4,980

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Vyrian

USA . 4,283 parts In-Stock

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4,283

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Anansix

USA . 1,422 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$15.550

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694

$15.550

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IDEA Electronic Components Group

UK . 401 parts In-Stock

1+ parts

$59.918

100+ parts

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$53.926

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401

$59.918

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$53.926

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MKK Technologies

India . 1,897 parts In-Stock

1+ parts

$112.671

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1,897

$112.671

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DigiPath Technology Company

USA . 1,897 parts In-Stock

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$112.671

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1,897

$112.671

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Corphita

USA . 4,053 parts In-Stock

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4,053

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Parana Technologies

USA . 1,201 parts In-Stock

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$71.641

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1,201

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$71.641

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Overview

Unlock the potential of your projects with the STM32L4A6AGI6TR microcontroller from STMicroelectronics, a trusted leader in innovation. This versatile microcontroller combines low power consumption with high-performance capabilities, making it perfect for battery-operated devices and IoT applications. With its robust features, including integrated DAC and ADC channels, you can seamlessly elevate your designs while ensuring reliability and efficiency. Experience unmatched quality and support as you bring your ideas to life!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and protection for the microcontroller, making it suitable for a wide range of applications.

Integrated Cache: YES

An integrated cache improves data access speed, enhancing overall performance for tasks that require quick response times.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The moderate maximum supply voltage ensures compatibility with various power sources commonly used in electronic devices.

Address Bus Width: 24

A 24-bit address bus width allows the microcontroller to access a large memory space, increasing its capability for complex applications.

Package Shape: SQUARE

The square shape of the package facilitates efficient layout design on PCB boards, optimal for modern applications.

Bit Size: 32

As a 32-bit microcontroller, it can process larger data types and execute complex instructions more efficiently.

DAC Channels: YES

Having DAC channels allows for accurate analog signal generation, making it suitable for applications requiring precise control.

No. of Terminals: 169

A high terminal count offers extensive connectivity options and interfacing capabilities with other components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style supports high-density applications, ensuring a compact footprint while maintaining performance and functionality.

Minimum Supply Voltage: 1.71 V

The ability to operate at a lower voltage allows for battery-efficient designs, extending the device's operational life.

Maximum Operating Temperature: 85 °C

This temperature range makes the microcontroller suitable for industrial applications, where higher ambient temperatures are common.

CPU Family: CORTEX-M4

The Cortex-M4 family is known for its efficiency and performance, making it ideal for real-time applications requiring quick processing.

No. of External Interrupts: 16

A high number of external interrupts provides flexibility in handling multiple external events, enhancing responsiveness in applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold conditions increases its versatility for applications in harsh environments.

ADC Channels: YES

Integration of ADC channels allows the microcontroller to interface directly with sensors, enabling data acquisition and processing.

DMA Channels: YES

DMA support facilitates efficient data transfer without CPU intervention, improving system performance for data-intensive tasks.

Terminal Position: BOTTOM

Bottom terminal placement allows for efficient PCB layout and improves the thermal management of the microcontroller.

ROM Words: 1048576

A substantial amount of ROM allows for large firmware storage, accommodating complex applications and features.

Maximum Seated Height: 0.6 mm

A low height profile is advantageous for compact design requirements, enabling thin devices and saving board space.

Digital To Analog Converters: 2 Ch 12-Bit

The presence of two 12-bit DAC channels allows for high-quality analog output, useful for audio and control applications.

Width: 7 mm

The compact width supports space-saving designs, making it suitable for portable and small devices.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of PCB assemblies, improving the reliability of the manufacturing process.

External Data Bus Width: 16

A 16-bit external data bus width allows for higher data throughput, enhancing performance in applications that require fast data processing.

Peripherals: BOR, DMA, LCD, RTC, TIMER(16)

The range of peripherals available increases the versatility of the microcontroller for diverse applications, such as real-time data logging and display.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz offers a good balance between power consumption and processing capability for efficient operation.

Length: 7 mm

A short length complements the compact nature of this product, allowing it to be easily integrated into various designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade implies reliability and robustness in harsh environments, making it suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it utilizes a simplified instruction set, leading to better efficiency and performance.

RAM Bytes: 327680

A significant amount of RAM enhances the microcontroller's ability to handle complex applications and multitasking efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making it ideal for battery-powered and high-performance applications.

Terminal Form: BALL

The ball terminal form factor allows for a compact design and improved thermal performance, suitable for modern applications.

Analog To Digital Converters: 3-Ch 12-Bit

Three channels of 12-bit ADC enable multiple sensor connections, allowing for simultaneous data capture and processing.

Maximum Supply Current: 13.31 mA

Low maximum supply current contributes to overall energy efficiency, essential for battery-operated devices.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V aligns with common battery voltages, simplifying the design of power supply circuits.

No. of DMA Channels: 14

Having 14 DMA channels allows for concurrent data transfers, reducing processor load and increasing overall system efficiency.

PWM Channels: YES

Presence of PWM channels enables the microcontroller to control motor speeds and dim LED lights precisely, useful for automation and control tasks.

Connectivity: CAN(2), I2C(4), SPI(3), UART(3), USART(3), USB

A wide range of connectivity options facilitates integration with various devices and networks, enhancing communication capabilities in applications.

ROM Programmability: FLASH

Flash programmability allows for reprogramming of the microcontroller, providing flexibility for updates and changes during product life cycles.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density layouts on PCB, maximizing board space utilization and performance.

Format: FLOATING POINT

Floating point support allows for efficient handling of decimal values, improving performance for complex calculations.

Speed: 80 rpm

The operational speed of 80 rpm indicates suitability for specific motion control applications, ensuring reliable performance.

Low Power Mode: YES

A low power mode feature enables energy savings during idle periods, extending battery life in portable devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for compatibility with various programming tools and enhances flexibility in firmware development.

No. of I/O Lines: 136

A high number of I/O lines allows for extensive interfacing capabilities with various peripherals, making it highly versatile for different applications.

Technical Specifications

Microcontrollers STM32L4A6AGI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

136

No. of Terminals:

169

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

327680

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Current:

13.31 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(4), SPI(3), UART(3), USART(3), USB

Peripherals:

BOR, DMA, LCD, RTC, TIMER(16)

Analog To Digital Convertors:

3-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L4A6AGI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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