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STM32L476ZGJ6

STMicroelectronics

STM32L476ZGJ6 by STMicroelectronics

STM32L476ZGJ6 microcontroller from STMicroelectronics features a 32-bit architecture, operates at a max voltage of 3.6V, and supports up to 144 terminals. With ADC and PWM channels, it's ideal for low-power applications like IoT devices. Its compact design ensures efficient integration in various projects.

Median Price

$6.973

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Future Electronics

Canada . 672 parts In-Stock

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$6.360

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Verical

USA . 672 parts In-Stock

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$7.586

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672

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$7.586

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Vyrian

USA . 7,418 parts In-Stock

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Digiode

USA . 3,342 parts In-Stock

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Chip Stock

USA . 1,012 parts In-Stock

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IBS Electronics

USA . 504 parts In-Stock

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$8.233

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Anansix

USA . 238 parts In-Stock

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Vigor

Singapore . 5,487 parts In-Stock

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$9.370

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$9.370

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AZTECH Wire

Italy . 45 parts In-Stock

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$12.260

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Microchip USA

USA . 5,736 parts In-Stock

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$30.447

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$30.447

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IDEA Electronic Components Group

UK . 357 parts In-Stock

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$51.144

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$46.029

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357

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MKK Technologies

India . 1,728 parts In-Stock

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$96.172

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DigiPath Technology Company

USA . 1,728 parts In-Stock

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$96.172

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QUARKTWIN TECHNOLOGY LTD

USA . 15,536 parts In-Stock

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Parana Technologies

USA . 2,017 parts In-Stock

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$61.150

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Glotronic Ltd.

UK . 538 parts In-Stock

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Corphita

USA . 145 parts In-Stock

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Overview

Unlock endless possibilities with the STM32L476ZGJ6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for energy-efficient applications, this versatile 32-bit MCU seamlessly integrates into IoT devices, wearables, and smart home systems. Experience unparalleled performance and reliability that empower your projects while saving power. Choose the STM32L476ZGJ6 to elevate your designs and drive success in a competitive marketplace!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for a compact installation, making it suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for compatibility with various power sources, enhancing its versatility in electronic designs.

Address Bus Width: 26

With a 26-bit address bus width, this microcontroller can access a large memory space, enabling more complex applications.

Package Shape: SQUARE

The square package shape provides an efficient footprint for PCB layout, ensuring optimal placement and routing in design.

Bit Size: 32

Being 32-bit offers better performance and the capability to handle large data types effectively, ideal for advanced applications.

No. of Terminals: 144

Having 144 terminals allows for extensive interfacing options, accommodating various peripherals and I/O needs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch make it suitable for high-density applications in modern electronics.

Minimum Supply Voltage: 1.71 V

A minimum supply voltage of 1.71 V supports low-power designs, making it energy-efficient for portable devices.

ADC Channels: YES

Having ADC channels enhances the microcontroller's ability to process analog signals, broadening its range of applications.

DMA Channels: YES

With DMA channels included, it ensures efficient data handling and transfer, reducing CPU load for better performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier and more efficient soldering during assembly in automated processes.

Width: 10 mm

A compact width of 10 mm supports small form factor designs, essential in miniaturized electronic devices.

External Data Bus Width: 16

The 16-bit external data bus width allows for efficient data transfer rates, ensuring fast operation in data-intensive applications.

Maximum Clock Frequency: 48 MHz

Operating at a maximum clock frequency of 48 MHz enables quick processing, making it suitable for tasks requiring real-time performance.

Length: 10 mm

At 10 mm in length, this device contributes to a compact design, perfect for space-efficient electronic projects.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture optimizes performance and energy efficiency, making it well-suited for various control applications.

Terminal Form: BALL

Ball terminal form enhances the reliability of connections and allows for effective heat dissipation.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V balances performance with power consumption, making it apt for battery-operated devices.

PWM Channels: YES

The inclusion of PWM channels enables precise control of power, useful in applications like motor control and LED dimming.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch supports a denser layout, accommodating more components in limited space.

Speed: 80 rpm

Achieving speeds of 80 rpm makes it suitable for low-speed applications, catering to specific control system needs.

No. of I/O Lines: 114

With 114 I/O lines, the microcontroller provides extensive interfacing capabilities for sensors, actuators, and other devices.

Technical Specifications

Microcontrollers STM32L476ZGJ6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

10 mm

No. of I/O Lines:

114

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32L476ZGJ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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