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STM32L476QGI6P

STMicroelectronics

STM32L476QGI6P by STMicroelectronics

STM32L476QGI6P from STMicroelectronics is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 132 terminals, and operates in -40 °C to 85 °C. It supports various connectivity options like CAN and USB, making it ideal for industrial applications. With integrated ADC/DAC channels and up to 48 MHz clock speed, it's perfect for low-power IoT devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,133 parts In-Stock

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9,133

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Anansix

USA . 2,079 parts In-Stock

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2,079

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Digiode

USA . 702 parts In-Stock

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702

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Distributors (Availability)

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Vigor

Singapore . 1,874 parts In-Stock

1+ parts

$8.030

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-

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-

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1,874

$8.030

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AZTECH Wire

Italy . 1,202 parts In-Stock

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$12.440

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1,202

$12.440

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IDEA Electronic Components Group

UK . 416 parts In-Stock

1+ parts

$71.723

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$64.551

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416

$71.723

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$64.551

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MKK Technologies

India . 823 parts In-Stock

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$134.871

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823

$134.871

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DigiPath Technology Company

USA . 823 parts In-Stock

1+ parts

$134.871

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823

$134.871

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,370 parts In-Stock

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1,370

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Parana Technologies

USA . 603 parts In-Stock

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$85.756

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603

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$85.756

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Overview

Unlock the potential of your next project with the STM32L476QGI6P microcontroller from STMicroelectronics. Renowned for their quality and innovation, STMicroelectronics provides this powerful yet energy-efficient solution perfect for industrial automation, wearable devices, and IoT applications. With its excellent performance and versatile connectivity options, the STM32L476QGI6P ensures reliable operation in demanding environments—giving you the edge to innovate and excel. Embrace efficiency and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package material enhances durability and provides good protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration onto PCBs, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures low power consumption, which is ideal for battery-operated devices.

Address Bus Width: 26

A 26-bit address bus width enables addressing a larger memory space, enhancing the microcontroller's capability for complex applications.

Package Shape: SQUARE

The square package shape allows for uniform heat dispersal and optimized layout in designs.

Bit Size: 32

The 32-bit architecture provides higher processing power and enables the handling of more data simultaneously.

DAC Channels: YES

Integrated DAC channels make it capable of generating analog signals, providing versatility for mixed-signal applications.

No. of Terminals: 132

A higher number of terminals allows for more peripheral connections, offering flexibility for complex interfacing needs.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style supports high-density mounting and is suitable for advanced board designs with limited space.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage enhances battery efficiency, allowing the device to operate effectively in low-power applications.

Maximum Operating Temperature: 85 °C

The ability to operate at elevated temperatures makes it suitable for industrial applications where ambient conditions can be harsh.

CPU Family: CORTEX-M4

The Cortex-M4 core provides advanced processing capabilities, enabling efficient performance for demanding embedded applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliability in extreme conditions, making it suitable for automotive and industrial environments.

ADC Channels: YES

Integrated ADC channels facilitate direct analog measurements, providing essential functionality for sensor interfacing.

DMA Channels: YES

DMA support allows for efficient data transfers without CPU intervention, improving overall system performance and responsiveness.

Terminal Position: BOTTOM

Bottom terminal positioning enhances connectivity options in space-constrained layouts, maintaining a low profile.

ROM Words: 1,048,576

A large ROM capacity allows for substantial program storage, enabling complex application development.

Maximum Seated Height: 0.6 mm

The low seated height is advantageous for ultra-thin product designs, contributing to compact and portable solutions.

Width: 7 mm

The compact width supports space-efficient designs that are essential in advanced electronic applications.

External Data Bus Width: 16

A 16-bit external data bus width allows for effective communication with various peripherals, increasing versatility.

Peripherals: BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

A rich set of integrated peripherals enhances functionality, reducing the need for external components.

Maximum Clock Frequency: 48 MHz

The 48 MHz clock frequency allows for fast processing and real-time performance in demanding applications.

Length: 7 mm

The compact length aligns with the requirements for small devices, making it highly suitable for embedded systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in continuous operation over varying environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller allows for simplified instruction sets, improving execution efficiency for embedded applications.

No. of Timers: 17

A high number of timers provides extensive options for precise time-based applications like control and automation.

Technology: CMOS

CMOS technology offers low power consumption and high-density integration, ideal for modern electronic design.

Terminal Form: BALL

Ball terminal form supports easier soldering processes and enhances thermal and electrical connectivity.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V strikes a good balance between performance and power efficiency.

No. of DMA Channels: 14

Multiple DMA channels enable highly efficient data handling and improved performance for complex applications.

PWM Channels: YES

The inclusion of PWM channels is beneficial for motor control and dimming LED applications.

Connectivity: CAN, I2C(3), LPUART, SAI(2), SDMMC, SPI(3), UART(2), USART(3), USB

Diverse connectivity options make it highly versatile for various applications, allowing seamless integration with other devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware post-production, enhancing long-term usability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density layouts, maximizing the functionality within a small footprint.

Speed: 80 rpm

The specified speed could relate to applications involving motors or data processing speed, ensuring suitable operation in targeted applications.

On Chip Program ROM Width: 8

The program ROM width of 8 bits supports efficient instruction set processing, enabling better performance for specific applications.

No. of I/O Lines: 109

An ample number of I/O lines allows for extensive interfacing capabilities with various sensors and devices, increasing application potential.

Technical Specifications

Microcontrollers STM32L476QGI6P attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B132

Length:

7 mm

No. of DMA Channels:

14

No. of I/O Lines:

109

No. of Terminals:

132

No. of Timers:

17

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(3), LPUART, SAI(2), SDMMC, SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

Trade Compliance

STM32L476QGI6P Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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