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STM32L476QGI3TR

STMicroelectronics

STM32L476QGI3TR by STMicroelectronics

STM32L476QGI3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 125 °C, and supports low power modes. It includes 19 ADC channels and 2 DACs for versatile applications. Ideal for automotive and IoT devices, it offers robust connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 9,379 parts In-Stock

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Digiode

USA . 4,803 parts In-Stock

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Anansix

USA . 2,608 parts In-Stock

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2,608

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Distributors (Availability)

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AZTECH Wire

Italy . 624 parts In-Stock

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$17.490

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624

$17.490

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IDEA Electronic Components Group

UK . 708 parts In-Stock

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$28.986

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$26.088

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708

$28.986

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$26.088

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MKK Technologies

India . 719 parts In-Stock

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$54.507

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719

$54.507

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DigiPath Technology Company

USA . 719 parts In-Stock

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$54.507

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719

$54.507

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Corphita

USA . 1,591 parts In-Stock

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Parana Technologies

USA . 1,276 parts In-Stock

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$34.658

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Overview

Unlock limitless possibilities with the STM32L476QGI3TR microcontroller from STMicroelectronics, a leader in innovation and quality. Engineered for efficiency and performance, this device excels in low-power applications while supporting advanced functionalities like ADC, DAC, and connectivity options. Ideal for IoT, automotive, and industrial solutions, it empowers your projects with unmatched reliability and versatility—experience cutting-edge technology that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material protects the microcontroller while maintaining a compact form factor.

Integrated Cache: YES

The presence of an integrated cache improves performance by speeding up data access and execution times.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and facilitates automated assembly.

Maximum Supply Voltage: 3.6 V

This voltage specification ensures compatibility with a wide range of power supply circuits for robust applications.

On Chip Data RAM Width: 8

This RAM width supports efficient data processing within the microcontroller architecture.

Address Bus Width: 26

A wider address bus allows for more memory access, enhancing the device's capability to manage larger programs.

Package Shape: SQUARE

The square shape is versatile for PCB layouts, providing flexibility in design.

Bit Size: 32

The 32-bit architecture allows for advanced processing capabilities suitable for complex applications.

DAC Channels: YES

Integrated DAC channels enable high-quality analog signal output, useful for audio and control applications.

No. of Terminals: 132

A larger number of terminals expands connectivity options, allowing for more peripherals and functionalities.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style enables high-density designs, especially beneficial in space-constrained applications.

Minimum Supply Voltage: 1.71 V

Low minimum voltage increases the microcontroller's adaptability for low-power applications.

Maximum Operating Temperature: 125 °C

This high-temperature rating ensures reliable operation in harsh environments, suitable for automotive applications.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family supports digital signal processing features, making it ideal for audio and control tasks.

No. of External Interrupts: 16

Multiple external interrupts enable efficient event handling and real-time processing for dynamic applications.

Minimum Operating Temperature: -40 °C

The extreme low-temperature capability ensures operational reliability in cold environments.

ADC Channels: YES

Built-in ADC channels facilitate the measurement of real-world analog signals, expanding sensor interfacing capabilities.

DMA Channels: YES

Direct Memory Access improves data transfer speeds and reduces CPU load during data transfers.

Terminal Position: BOTTOM

Bottom terminal positioning can help in better thermal management and PCB layout designs.

ROM Words: 1048576

Large ROM capacity supports extensive firmware, enabling complex applications and functionalities.

Maximum Seated Height: 0.6 mm

A low profile allows for design flexibility in compact electronic systems.

Digital To Analog Convertors: 2 Ch 12-Bit

Dual 12-bit DACs enable precise analog output, enhancing the device's control and processing capabilities.

RAM Words: 65536

Sufficient RAM capacity allows for effective execution of complex algorithms and real-time applications.

Width: 7 mm

Compact width makes it suitable for space-restricted designs in portable devices.

Boundary Scan: YES

Boundary scan capability simplifies testing, debugging, and enhances the reliability of circuit assemblies.

External Data Bus Width: 16

A 16-bit external data bus supports efficient data handling, particularly for peripheral interfaces.

Peripherals: BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

Multiple integrated peripherals reduce the need for external components, simplifying design efforts.

Maximum Clock Frequency: 48 MHz

A high clock frequency allows for faster processing, suitable for real-time applications.

Length: 7 mm

The short length enables compatibility with a wide range of compact devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade components are designed for long-term reliability under demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient instruction execution, optimizing processing speed and power consumption.

No. of Timers: 14

Multiple timers allow for precise timing control in various applications, including motor control and event scheduling.

RAM Bytes: 131072

Generous RAM capacity supports multitasking and complex data structures for advanced applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing battery efficiency.

Terminal Form: BALL

Ball terminal configuration supports high-density packaging and good heat dissipation.

Analog To Digital Convertors: 19-Ch 12-Bit

Numerous 12-bit ADCs enable high-resolution signal sampling from a variety of analog sources.

Maximum Supply Current: 100 mA

Moderate supply current ensures good power efficiency while supporting a wide range of functionalities.

Nominal Supply Voltage: 1.8 V

A low nominal voltage allows for extended battery life in portable applications.

No. of DMA Channels: 14

A high number of DMA channels allows for efficient data handling without burdening the CPU.

No. of Serial I/Os: 8

Multiple serial I/O options increase connectivity for peripherals and sensors, broadening application scope.

PWM Channels: YES

With PWM capabilities, the microcontroller can control various devices, including motors and LEDs.

Connectivity: CAN, I2C(3), LPUART, SAI(2), SDMMC, SPI(3), UART(2), USART(3), USB

Diverse connectivity options ensure compatibility with a wide range of devices and protocols, enhancing application versatility.

ROM Programmability: FLASH

Flash programmability allows for easier updates and modifications to firmware, enabling long-term flexibility.

Terminal Pitch: 0.5 mm

The fine pitch terminal design provides a high density of connections in a small area, perfect for modern compact designs.

Format: FLOATING POINT

Floating point support enables handling of more complex mathematical operations, improving computational performance.

Speed: 80 rpm

The operational speed indicates the performance capabilities, suitable for real-time applications.

Low Power Mode: YES

Low power operations extend battery life and reduce heat generation, making it ideal for portable devices.

On Chip Program ROM Width: 8

The program ROM width supports efficient data storage and retrieval in applications requiring high-speed operation.

No. of I/O Lines: 109

A high number of I/O lines provides extensive interfacing options for sensors, actuators, and communication protocols.

Technical Specifications

Microcontrollers STM32L476QGI3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B132

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

109

No. of Serial I/Os:

8

No. of Terminals:

132

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

131072

RAM Words:

65536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

80 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN, I2C(3), LPUART, SAI(2), SDMMC, SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

19-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L476QGI3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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