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STM32L476JGY7TR

STMicroelectronics

STM32L476JGY7TR by STMicroelectronics

STM32L476JGY7TR from STMicroelectronics is a low-power 32-bit microcontroller featuring a max supply voltage of 3.6V, 16 ADC channels, and operates in -40 °C to 105 °C. Ideal for industrial applications, it supports various connectivity options like CAN and USB. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,384 parts In-Stock

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11,384

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Quantum Digital Technology

USA . 8,056 parts In-Stock

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8,056

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K-1 Technologies

USA . 7,324 parts In-Stock

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7,324

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Sensible Micro Corp

USA . 7,324 parts In-Stock

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7,324

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Anansix

USA . 1,720 parts In-Stock

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1,720

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Digiode

USA . 518 parts In-Stock

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518

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Vigor

Singapore . 1,104 parts In-Stock

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$7.320

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1,104

$7.320

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AZTECH Wire

Italy . 523 parts In-Stock

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$20.350

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523

$20.350

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Microchip USA

USA . 8,545 parts In-Stock

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$23.454

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$23.454

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IDEA Electronic Components Group

UK . 1,174 parts In-Stock

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$58.817

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$52.935

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$52.935

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Component Stockers USA

USA . 524 parts In-Stock

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$97.840

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524

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MKK Technologies

India . 494 parts In-Stock

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$110.601

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494

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DigiPath Technology Company

USA . 494 parts In-Stock

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Perfect Parts

USA . 22,400 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,872 parts In-Stock

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RC Electronics

USA . 6,750 parts In-Stock

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Kepictronics

USA . 3,255 parts In-Stock

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Parana Technologies

USA . 1,485 parts In-Stock

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$70.324

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Corphita

USA . 238 parts In-Stock

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Metaverse IC Inc.

Canada . 200 parts In-Stock

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200

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Overview

Elevate your projects with the STM32L476JGY7TR microcontroller from STMicroelectronics, renowned for its exceptional quality and reliability. Designed for low-power applications, it provides an ideal solution for IoT devices, wearable tech, and sensor networks. Enjoy enhanced performance with versatile connectivity options, ensuring seamless integration into your designs. Experience unmatched value, increased efficiency, and innovation that empowers your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction material provides protection and reliability in various environments.

Surface Mount: YES

Allows for compact designs and easier integration into modern electronic circuits.

Maximum Supply Voltage: 3.6 V

Ensures compatibility with low-power applications while providing sufficient operational range.

On Chip Data RAM Width: 8

Facilitates efficient data processing for a variety of applications.

Address Bus Width: 2

Allows addressing of a maximum of 4 unique addresses, enabling specific control in constrained scenarios.

Package Shape: RECTANGULAR

Optimizes space utilization on the PCB layout.

Bit Size: 32

Offers improved performance over 8-bit and 16-bit microcontrollers, enabling more complex computations.

DAC Channels: YES

Enables digital-to-analog conversion, suitable for applications requiring analog output.

No. of Terminals: 72

Provides multiple I/O options for enhanced connectivity and versatility in design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Allows for high-density packaging, maximizing pin count in a compact footprint.

Minimum Supply Voltage: 1.71 V

Enables operation in low-power, battery-operated applications.

Maximum Operating Temperature: 105 °C

Suitable for industrial applications that require robust performance in high-temperature environments.

CPU Family: CORTEX-M4

Provides high performance with energy efficiency, ideal for a range of embedded applications.

No. of External Interrupts: 16

Facilitates responsive operation by allowing multiple events to be processed in real-time.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold conditions, making it suitable for outdoor or harsh environments.

Terminal Finish: TIN SILVER COPPER NICKEL

Contributes to improved durability and corrosion resistance for reliable connections.

ADC Channels: YES

Allows for precise analog signal measurement, essential for various sensor applications.

DMA Channels: YES

Enables direct memory access for efficient data handling, reducing CPU overhead and improving performance.

Terminal Position: BOTTOM

Facilitates easier mounting on PCBs while optimizing thermal and electrical performance.

ROM Words: 1048576

Provides ample program memory for complex applications, supporting higher functionality.

Maximum Seated Height: 0.585 mm

Thin profile design allows for better integration into space-constrained applications.

Digital To Analog Convertors: 2 Ch 12-Bit

Offers flexibility in generating precise analog signals for various outputs.

RAM Words: 65536

Sufficient RAM for processing tasks efficiently, allowing for smoother operation.

Width: 3.7594 mm

Compact width facilitates high-density layouts within constrained board designs.

Boundary Scan: YES

Enhances debugging and testing capabilities for better quality assurance during development.

Peripherals: BOR, COMPARATOR(2), LCD, RTC, TIMER(14), WDT(2)

Rich set of built-in peripherals enhances functionality and reduces external component needs.

Maximum Clock Frequency: 48 MHz

Provides sufficient processing speed for a wide range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

Dananges compatibility with high-precision soldering techniques, enhancing manufacturing quality.

Peak Reflow Temperature °C: 260

Ensures reliability in soldering processes, reducing risks of damage during assembly.

Length: 4.4084 mm

Provides a compact physical footprint, ideal for modern electronic applications.

Temperature Grade: INDUSTRIAL

Designed for demanding environments, ensuring long-term reliability and operation in tough conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Delivers efficient computing architecture that speeds up processing while conserving power.

No. of Timers: 17

High timer count allows for precise time management in various processing tasks.

RAM Bytes: 131072

Large RAM capacity helps in handling complex data processing requirements efficiently.

Technology: CMOS

Provides power efficiency and high performance, suitable for a variety of applications.

Terminal Form: BALL

Assists in achieving a compact design while providing excellent electrical performance.

Analog To Digital Convertors: 16-Ch 12-Bit

High channel count for ADC allows for multiple analog inputs—ideal for multi-sensor systems.

Nominal Supply Voltage: 1.8 V

Optimizes power consumption, making it suitable for energy-sensitive applications.

No. of DMA Channels: 14

Allows efficient data transfer, improving overall system performance without CPU intervention.

PWM Channels: YES

Facilitates control of motors and other devices with precise duty cycle adjustment.

Connectivity: CAN, I2C(3), SAI(2), SPI(4), UART(3), USART(3), USB

Multiple communication interfaces enhance integration with other devices and systems.

ROM Programmability: FLASH

Enables modification and updates to firmware, extending product life and adaptability.

Terminal Pitch: 0.4 mm

Narrow terminal pitch supports high-density placements on PCBs.

Format: FLOATING POINT

Enables handling of real numbers effectively, crucial for complex calculations.

Speed: 80 rpm

Specifically caters to applications needing controlled speeds and precise operation.

Low Power Mode: YES

Extends battery life in portable devices, making it ideal for IoT applications.

On Chip Program ROM Width: 8

Provides a suitable architecture for applications with a need for efficient instructions.

No. of I/O Lines: 57

Generous GPIO availability allows for versatile interfacing with various peripherals.

Technical Specifications

Microcontrollers STM32L476JGY7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

2

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B72

JESD-609 Code:

e2

Length:

4.4084 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

57

No. of Terminals:

72

No. of Timers:

17

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA72,9X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

65536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER NICKEL

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.7594 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), SAI(2), SPI(4), UART(3), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), LCD, RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32L476JGY7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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