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STM32L476JGY6VTR

STMicroelectronics

STM32L476JGY6VTR by STMicroelectronics

STM32L476JGY6VTR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. Ideal for low-power applications, it supports various connectivity options like CAN and USB. Its compact design with 72 terminals makes it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,687 parts In-Stock

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9,687

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Digiode

USA . 3,705 parts In-Stock

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Anansix

USA . 380 parts In-Stock

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380

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Distributors (Availability)

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AZTECH Wire

Italy . 304 parts In-Stock

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$8.310

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304

$8.310

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Microchip USA

USA . 1,868 parts In-Stock

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$12.722

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1,868

$12.722

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IDEA Electronic Components Group

UK . 335 parts In-Stock

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$30.231

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$27.208

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335

$30.231

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$27.208

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MKK Technologies

India . 730 parts In-Stock

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$56.848

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730

$56.848

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DigiPath Technology Company

USA . 730 parts In-Stock

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$56.848

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730

$56.848

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Corphita

USA . 3,525 parts In-Stock

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Parana Technologies

USA . 2,102 parts In-Stock

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$36.146

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Vigor

Singapore . 1,387 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Unlock the potential of your designs with the STM32L476JGY6VTR microcontroller from STMicroelectronics, a leader in innovation and reliability. This advanced 32-bit Cortex-M4 unit offers high performance while ensuring low power consumption, making it perfect for IoT, wearables, and portable devices. With rich connectivity options and robust processing capabilities, elevate your projects to new heights and enjoy the peace of mind that comes from choosing a trusted manufacturer renowned for quality. Experience efficiency and versatility—transform your ideas into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable design, making it suitable for various applications.

Integrated Cache: YES

The presence of integrated cache improves performance by reducing latency and speeding up data access times.

Surface Mount: YES

Surface mount technology allows for compact designs and facilitates automated assembly, making it easier to fit into smaller spaces.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications.

On Chip Data RAM Width: 8

This allows for efficient data processing and enables smoother operation in embedded systems.

Package Shape: RECTANGULAR

The rectangular shape aids in convenient handling and mounting in various circuit designs.

Bit Size: 32

A 32-bit architecture allows for more powerful processing capabilities and efficient handling of larger data sets.

DAC Channels: YES

The presence of Digital-to-Analog Converter channels enhances the microcontroller's ability to interface with analog devices.

No. of Terminals: 72

A higher number of terminals offers increased flexibility and options for connectivity in complex applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style enables high-density designs in space-constrained applications.

Minimum Supply Voltage: 1.71 V

Operational at lower voltages means reduced power consumption, which is ideal for battery-powered applications.

Maximum Operating Temperature: 85 °C

This allows the microcontroller to function effectively in moderately high-temperature environments.

CPU Family: CORTEX-M4

The CORTEX-M4 core provides efficient processing capabilities, especially for complex mathematical computations.

No. of External Interrupts: 16

More external interrupts allow for greater responsiveness and flexibility in multitasking applications.

Minimum Operating Temperature: -40 °C

This range ensures functionality in extreme environments, making it suitable for industrial and outdoor applications.

ADC Channels: YES

Analog-to-Digital Converter channels facilitate the connection to sensors and other devices requiring data conversion.

DMA Channels: YES

Direct Memory Access capability enhances data transfer efficiency without burdening the CPU, improving overall performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easy mounting on PCBs and offers better heat dissipation.

ROM Words: 1048576

A large ROM capacity allows for complex applications and feature-rich software implementations.

Maximum Seated Height: 0.585 mm

The low seated height enables compact designs and helps save precious PCB real estate.

Digital To Analog Convertors: 2-Ch 12-Bit

Having dual 12-bit DACs allows for precision control in applications involving audio or signal generation.

Width: 3.7594 mm

A narrower width aids in fitting the microcontroller into tighter designs, optimizing space usage.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of complex circuit designs.

Peripherals: BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

A rich set of peripherals supports a variety of applications, allowing for greater functionality and integration.

Maximum Clock Frequency: 48 MHz

This clock speed allows for reasonable processing performance suitable for numerous applications.

Length: 4.4084 mm

A small length supports compact PCB layout designs and minimizes overall device size.

Peripheral IC Type: MICROCONTROLLER, RISC

This type indicates efficient processing and reduced instruction set architecture, enhancing performance.

No. of Timers: 14

A greater number of timers allows for precise time management in various control applications.

RAM Bytes: 131072

The available RAM ensures smooth execution of programs and sufficient workspace for data handling.

Technology: CMOS

Using CMOS technology provides low power consumption and high noise immunity, leading to better efficiency.

Terminal Form: BALL

Ball grid array (BGA) terminals facilitate better heat dissipation and enhanced electrical performance.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16 channels for ADC enables simultaneous monitoring of multiple sensor inputs with high accuracy.

Maximum Supply Current: 12.1 mA

Low supply current translates to improved power efficiency, extending battery life in portable devices.

Nominal Supply Voltage: 1.8 V

Operating at a nominal voltage of 1.8 V minimizes power requirements and reduces heat generation.

No. of DMA Channels: 14

With 14 DMA channels, data transfer efficiency is improved, allowing for better CPU utilization.

No. of Serial I/Os: 8

Having multiple serial I/O lines enables easy integration with other components and communication protocols.

PWM Channels: YES

PWM capability allows for motor control and other applications requiring precision output control.

Connectivity: CAN, I2C(3), LPUART, SAI(2), SPI(3), UART(2), USART(3), USB

Versatile connectivity options enhance integration with a variety of devices and communication standards.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the program stored on the microcontroller.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch facilitates high-density layouts, allowing for compact and efficient board designs.

Format: FLOATING POINT

Support for floating-point operations enhances mathematical capabilities for more advanced applications.

Speed: 80 rpm

This speed capability indicates potential use in motor control applications, offering essential performance.

Low Power Mode: YES

Low power modes extend battery life in portable and energy-efficient applications, reducing overall power consumption.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides compatibility with various instruction sets and improves data handling efficiency.

No. of I/O Lines: 57

A high count of I/O lines provides extensive interfacing options for sensors, actuators, and other peripheral devices.

Technical Specifications

Microcontrollers STM32L476JGY6VTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B72

Length:

4.4084 mm

Low Power Mode:

YES

No. of DMA Channels:

14

No. of External Interrupts:

16

No. of I/O Lines:

57

No. of Serial I/Os:

8

No. of Terminals:

72

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA72,9X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

80 rpm

Maximum Supply Current:

12.1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.7594 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(3), LPUART, SAI(2), SPI(3), UART(2), USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(14), RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L476JGY6VTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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